JPS583047U - スイツチングレギユレ−タ集積回路 - Google Patents
スイツチングレギユレ−タ集積回路Info
- Publication number
- JPS583047U JPS583047U JP1981093858U JP9385881U JPS583047U JP S583047 U JPS583047 U JP S583047U JP 1981093858 U JP1981093858 U JP 1981093858U JP 9385881 U JP9385881 U JP 9385881U JP S583047 U JPS583047 U JP S583047U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- switching regulator
- regulator integrated
- metal plate
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Dc-Dc Converters (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来技術におけるスイッチングレギュレータ集
積回路の構造図、第２図はスイッチングレギュレータ集
積回路本使用した電源回路図ζ第３図は本考案の具体例
を示す構造図である。 １・・・金属板、２・・・スイッチング素子、２４・・
・スイッチング素子と金属板を絶縁する絶縁板。
積回路の構造図、第２図はスイッチングレギュレータ集
積回路本使用した電源回路図ζ第３図は本考案の具体例
を示す構造図である。 １・・・金属板、２・・・スイッチング素子、２４・・
・スイッチング素子と金属板を絶縁する絶縁板。
Claims (1)
- 金属板と絶縁されたスイッチング素子と金属板上にあり
金属板と絶縁される定電圧制御回路から構成されること
を特徴とす゛るスイッチングレギュレータ集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981093858U JPS583047U (ja) | 1981-06-26 | 1981-06-26 | スイツチングレギユレ−タ集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981093858U JPS583047U (ja) | 1981-06-26 | 1981-06-26 | スイツチングレギユレ−タ集積回路 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS583047U true JPS583047U (ja) | 1983-01-10 |
Family
ID=29888825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981093858U Pending JPS583047U (ja) | 1981-06-26 | 1981-06-26 | スイツチングレギユレ−タ集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS583047U (ja) |
-
1981
- 1981-06-26 JP JP1981093858U patent/JPS583047U/ja active Pending
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