JPS5829419U - Temperature sensor mounting structure in foam molding mold - Google Patents
Temperature sensor mounting structure in foam molding moldInfo
- Publication number
- JPS5829419U JPS5829419U JP12430281U JP12430281U JPS5829419U JP S5829419 U JPS5829419 U JP S5829419U JP 12430281 U JP12430281 U JP 12430281U JP 12430281 U JP12430281 U JP 12430281U JP S5829419 U JPS5829419 U JP S5829419U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- mounting structure
- foam molding
- molding mold
- sensor mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は発泡成形金型の断面図、第2図は本案の要部を
示す拡大断面図である。
1:原料フィーダー、2:キャビティ、3:コア、4:
型、5:蒸気室、6:小孔、14:案内孔、15:治具
、16:取付孔、17:温度センサー、19:支持部。FIG. 1 is a sectional view of a foam mold, and FIG. 2 is an enlarged sectional view showing the main parts of the present invention. 1: Raw material feeder, 2: Cavity, 3: Core, 4:
Mold, 5: Steam chamber, 6: Small hole, 14: Guide hole, 15: Jig, 16: Mounting hole, 17: Temperature sensor, 19: Support part.
Claims (1)
サーを密に嵌挿して保持する取付孔を直線状に連続して
貫通形成した治具を用いて型内温度測定用の温度セン→
−を取付けるようになしたことを特徴とする発泡成形用
金型における温度センサー取付構造。The temperature inside the mold can be measured using a jig in which a guide hole with a trumpet-shaped tip insertion part and a mounting hole in which a small-diameter sensor is tightly inserted and held are formed continuously in a straight line. Sen →
- A temperature sensor mounting structure in a foam molding mold, characterized in that the temperature sensor is mounted on the mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12430281U JPS5829419U (en) | 1981-08-22 | 1981-08-22 | Temperature sensor mounting structure in foam molding mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12430281U JPS5829419U (en) | 1981-08-22 | 1981-08-22 | Temperature sensor mounting structure in foam molding mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5829419U true JPS5829419U (en) | 1983-02-25 |
JPS6139551Y2 JPS6139551Y2 (en) | 1986-11-13 |
Family
ID=29918175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12430281U Granted JPS5829419U (en) | 1981-08-22 | 1981-08-22 | Temperature sensor mounting structure in foam molding mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5829419U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4536885B2 (en) * | 2000-08-22 | 2010-09-01 | 株式会社大塚製薬工場 | Temperature sensor holder |
WO2019240156A1 (en) * | 2018-06-12 | 2019-12-19 | 株式会社Ihi | Reaction device |
-
1981
- 1981-08-22 JP JP12430281U patent/JPS5829419U/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4536885B2 (en) * | 2000-08-22 | 2010-09-01 | 株式会社大塚製薬工場 | Temperature sensor holder |
WO2019240156A1 (en) * | 2018-06-12 | 2019-12-19 | 株式会社Ihi | Reaction device |
CN112292202A (en) * | 2018-06-12 | 2021-01-29 | 株式会社Ihi | Reaction device |
JPWO2019240156A1 (en) * | 2018-06-12 | 2021-07-08 | 株式会社Ihi | Reactor |
EP3808444A4 (en) * | 2018-06-12 | 2022-02-23 | IHI Corporation | Reaction device |
US11878281B2 (en) | 2018-06-12 | 2024-01-23 | Ihi Corporation | Reactor with jig provided in pipe for temperature measurement |
Also Published As
Publication number | Publication date |
---|---|
JPS6139551Y2 (en) | 1986-11-13 |
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