JPS5828697Y2 - Drive chain engagement device for board support frame in automatic soldering equipment - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an automatic soldering device that engages a substrate support frame that is moved and guided on a guide rail with a drive chain disposed along the guide rail. It is.

Conventional automatic soldering equipment is equipped with a guide rail with a stepped section above the panda melting tank, and a board support frame runs on this guide rail to support the printed circuit board to be soldered. There is a structure in which the board support frame is freely supported and pulled by a single universal drive chain disposed along a guide rail.

This universal chain cannot be bent sharply in a small radius, and in the conventional automatic bending device described above, the drive chain is made to run parallel to the step below the guide rail. The height between the step part of the guide rail and the drive chain is gradually changed by tilting the front and back of this step part, and the drive chain is provided with a drive rod protruding upward and downward, while the board support frame An engagement plate that protrudes laterally above the drive chain is fixed to one outer surface, and the above-mentioned drive rod is slidably inserted into a vertical engagement hole drilled at the tip of this engagement plate. By doing so, the drive chain and the engagement plate are engaged with each other to absorb height changes between the guide rail and the drive chain.

However, in the drive chain engagement device for the board support frame, the engagement hole provided in the engagement plate and the drive rod cannot be tilted at the same angle on the slopes before and after the step of the guide rail. There is a risk that the drive rod may not slide smoothly within the engagement hole at the inclined portion, and the board support frame may not move smoothly on the guide rail.

The purpose of the present invention is to provide a drive chain engagement device for a board support frame that solves the above-mentioned problems. An engaging member is rotatably supported on the shaft, and the rolling elements of the engaging member are vertically supported by a groove-shaped rail-shaped guide member provided across two chains arranged vertically in parallel. It is characterized by being slidably engaged.

An embodiment of the present invention will be described below with reference to the drawings.

In Figure 1, 1 is a printed circuit board to be soldered (
This is a board support frame that supports a board (not shown) within the frame, and its front part supports wheels 2 and 3 rotatably around a rotating shaft 4, and the rear part supports wheels 5 and 3 rotatably around a rotating shaft 7. It is something that can be freely supported.

One end of a U-shaped bracket 8 is attached to the rear side surface supporting the wheel 6 so as to straddle the upper part of the wheel 6, and the wheel 9 is attached to the outer surface of the other end of the bracket 8.
0 and is rotatably supported.

These wheels are mounted so as to roll on guide rails 11.12 which are arranged in parallel and run over the melting tank.

Of these, wheels 2 and 5 are placed on one guide rail 11, and wheel 3 is placed on a second guide rail 12 that constitutes the other guide rail 12.
The wheels 6 are placed on the second rail 14, and the wheels 9 are positioned so as to roll on the third rail 15.

Parallel guide rails 11 and 12 have stepped portions 16 and 1 lowered at the same height in a solder melting tank (not shown).
7 is formed.

The step portion 16 includes a downwardly inclined portion 16a, a horizontal portion 16b, and an upwardly inclined portion 16c.

Further, the stepped portion 17 is composed of a stepped portion 18 of the second rail 14 and a stepped portion 19 spanning the second rail 14 and the third rail 15.

The former stepped portion 18 has a downwardly inclined portion 18a,
It is composed of a horizontal part 18b and an upwardly inclined part 18c. It is composed of an inclined portion 19c.

Note that the step portion 16 and the step portion 18 of the second rail 14 have the same shape and are provided in parallel with each other out of phase, and the upward slope portion 16c=18c is the downward slope portion 16a=
It is set more gently than 18a.

Further, the sloped part 19a is provided in parallel with the sloped part 16a at a position before the sloped part 18a, and the sloped part 19e is also provided in a position in front of the sloped part 18c in parallel with the sloped part 16c.
is placed parallel to.

Additionally, two drive chains 2 are provided along the guide rail 11.
0.21 are arranged vertically in parallel.

The drive chains 20, 21 are universal and are moved in the direction of the solid arrow in FIG. 1 by a drive motor (not shown).

A drive chain engagement device for the substrate support frame is interposed between the drive chain 20, 21 and the substrate support frame 1.

To explain this engagement device, a shaft 22 is attached to the side of the substrate support frame 1 near the drive chain 20.
．． 21, and an engagement member 23 is rotatably supported on this shaft 22.

This engaging member 23 is connected to a machine frame 24, a bearing 25 provided on the front side of the machine frame 24 and supporting the shaft 22, a mounting plate 26 attached to the back side of the machine frame 24, and a bearing 25 on the back side of the mounting plate 26. It is composed of two fixed annular rolling elements 27 and 28 that are vertically long (see Fig. 2).

Then, an annular rolling element 27, 2 is attached to a guide member 29 in the form of a wrench-shaped rail provided across the drive chains 20, 21.
By fitting the rollers 30 and 31 of 8, the engaging member 23 becomes a sliding mark in the vertical direction of the guide member 29.

The guide member 29 is attached to the drive chain 20 at its upper end and to the drive chain 21 at its lower end with screws 32, respectively.

It is attached to the attachment 33 by screwing.

Next, the effect will be explained.

When the drive motor is activated to move the drive chain 20.21 along the guide rail 1 in the direction of arrow A in FIG.
The board support frame 1 supporting the printed circuit board is pulled by the engaging device and moves on the guide rail i 1.12.

When the substrate support frame 1 moves on the guide rails 11.12 and moves down a step 16.17, it moves tilted as shown in FIGS. 4 and 5.

First, when the wheels 3 of the substrate support 1 are guided by the downwardly inclined portion 18a of the stepped portion 18 and descend, the substrate support frame 1 moves with its front portion inclined downward (see FIG. 4).

Note that by the time the wheel 3 reaches the stepped portion 18, the wheel 2 has left the guide rail 11 and is floating in the air, but the board support frame 1
There is no problem with stable running.

Then, the wheels 2 and 3 are connected to the horizontal portion 16b of the stepped portion 16, respectively.
After reaching the horizontal part 18b of the stepped part 18 and traveling,
After a delay, the wheels 5 and 6 are guided by the downwardly inclined portion 16a of the stepped portion 16 and the downwardly inclined portion 19a of the stepped portion 19, respectively, and begin to descend.

During this descent, a part of the printed circuit board (path shown) supported by the board support frame 1 begins to be immersed in the solder solution in the solder melting tank (not shown).

Then, as the wheels 5 and 6 approach the horizontal portion 16b of the stepped portion 16 and the horizontal portion 19b of the stepped portion 19, the board support frame 1 gradually becomes horizontal, thereby increasing the immersion area of the printed circuit board.

When the substrate support frame 1 moves downward, the engagement member 2
3 itself rolls the rollers 30 of the rolling elements 27 and the rollers 31 of the rolling elements 28 into the center of the guide member 29, moves downward, rotates around the shaft 22, and drives the upper side. To absorb changes in the heights of a chain 20 and guide rails 1 and 2, and to smoothly operate a board support frame 1.

When the wheels 5 and 6 reach the horizontal portions 16b and 19b, respectively, the substrate support frame 1 becomes horizontal and the entire back surface of the printed circuit board is immersed in the powder solution.

Then, as the drive chain 20.2'1 moves, the board support frame 1 moves on the horizontal parts 16b and 19b toward the upwardly inclined parts 16c and 18c, and the back side of the printed circuit board is soldered. (See Figure 5).

The travel time in this state is preferably about 3 seconds.

Then, the wheels 2 are connected to the upwardly inclined portion 1 of the guide rail 11.
At the same time as the wheel 3 starts to rise guided by the wheel 6c, the third wheel
The substrate support frame 1 begins to rise while being guided by the inclined portion 18c of the rail 15, gradually inclining upward.

Along with this, the printed circuit board supported by the board support frame 1 is gradually lifted out of the solder solution.

When the wheels 2 and 3 rise to the vicinity of the upper ends of the inclined parts 16c and 18c in this way, the wheel 9, which has been floating in the air during the process up to now, reaches the lower part of the inclined part 19c of the third rail 15,
Further, as the substrate support frame 1 moves in the advancing direction, it begins to rise guided by the inclined portion 19c, and the printed circuit board is completely lifted from the solder solution.

At this time as well, although the wheels 5 and 6 are floating in the air, this does not interfere with the stable running of the substrate support frame 1.

When the substrate support frame 1 is moved upward, similarly to the downward movement, the rollers 30 and 31 are rolled within the guide member 29, and the engaging portion vf23 is moved upward. , rotates around the shaft 22 to absorb the change in height between the drive chain 20 and the guide rail 1.degree. 2, thereby allowing the board support frame 1 to move smoothly.

After the above steps, the board support frame 1 is moved again with the wheels 2.5 placed on the guide rail 1, the wheels 3 placed on the first rule 13, and the wheels 6 placed on the second rail. Become.

Since the present invention has the configuration described above, when the board support frame is moved on the step of the guide rail that is one step lower than the solder melting tank, the board support frame is not tilted with respect to the drive chain, or Even if the height interval between the board support frame and the drive chain increases or decreases, the engaging member will rotate around the shaft provided on the side of the board support frame, or the engaging member will not rotate around the shaft provided on the side of the board support frame. These changes in inclination and spacing can be absorbed by sliding up and down on the guide member passed between the drive chains, and automatic soldering allows the board support frame to move easily and smoothly on the guide rail in the device. I can say that.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view of an automatic soldering device showing one embodiment of the present invention, FIG. 2 is a partial perspective view of the device shown in FIG. FIGS. 4 and 5 are sectional views showing how the mating member and guide member are attached, and FIGS. 4 and 5 are side views showing how the substrate support frame is moved. In the figure, 1... Board support frame, 11.12... Curved guide rail, 16, 17... Step part, 20.21
... Drive chain, 22 ... Axis, 23
......Engaging member, 27.28...Rolling element, 29...Guiding member, 3o. 31...Koro, 33...Attachment.

Claims (1)

[Scope of utility model registration request] An automatic soldering device in which a board support frame is movably supported on a guide rail having a step lower than the solder melting tank, and the board support frame is pulled by a drive chain provided along the guide rail. A shaft is provided on the side of the board support frame near the drive chain to protrude outward, an engaging member is rotatably supported on the shaft, and rolling elements of the retaining member are arranged vertically in parallel. A drive chain engagement device for a board support frame in an automatic soldering device, characterized by engaging a guide member in the shape of a miso-shaped rail provided across two chains so as to be slidable in the vertical direction. .