JPS582780Y2 - Antistatic packaging paper for semiconductor products - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to packaging bag paper used to prevent charging of semiconductor products.

In semiconductor products such as MO8 type ICs, insulation is often broken due to voltage caused by static electricity, and the product becomes unusable.

For this reason, conventional measures have been taken to house semiconductor products in conductive packaging materials to prevent them from being charged with electricity.

Metal thin films, conductive plastic films, etc. are generally used as conductive packaging materials, but thin metal films lack flexibility and can easily damage semiconductor products. If so, there will be a problem with its own strength.

Furthermore, bags and the like are used to store ICs and the like, but there are problems in the processability of making bags from thin metal films.

In addition, conductive plastic film is generally made from heat-weldable plastic, mixed with conductive substances such as metal powder and carbon powder, and then formed into a film. The bag can be easily processed by heat welding, but there is metal powder in the plastic.

Since carbon powder and the like are mixed in, it is difficult to form into a thin film, and the price is also relatively high.

Therefore, the present invention was developed by impregnating paper based on plant fibers with heat-weldable thermoplastic resin paint mixed with conductivity imparting agents such as metal powder and carbon powder, thereby making it conductive and flexible. The present invention provides packaging bag paper for semiconductor products that is easy to process and is anti-electrical.

To explain the present invention with reference to the drawings, Figure 1 shows fine metal powder on both sides of paper 1 based on plant fibers.

This shows antistatic packaging bag paper impregnated with a thermoplastic resin paint 2 mixed with a conductivity imparting agent such as carbon powder.In the drawing, the thermoplastic resin paint 2 is impregnated on both sides of the paper 1. However, if the paper 1 is thin, this paint will be impregnated throughout the paper.

The thermoplastic resin coating may be impregnated into paper, dried and cured, and the coating film can be thermally welded, and the conductivity imparting agent to be mixed into the coating is preferably fine metal powder or conductive carbon powder.

Furthermore, from the viewpoint of the strength of the packaging bag paper or the strength of the fusing force in bag-forming, it is desirable that the film formed by impregnation with paint be excellent.

Between metal powder-based paints and coarse carbon-based paints, metal powder-based paints have a lower resistance value, or in other words, better conductivity, but even carbon powder-based paints have a coating thickness of about 20μ, although this varies depending on the coating thickness. In this case, a resistance value of 102 to 103Q can be obtained, and the purpose of preventing static electricity can be sufficiently achieved. Therefore, from the viewpoint of cost, a carbon powder-based paint is preferable, and the coating thickness is from several microns to several tens of microns, and is approximately <20 microns. is desirable from the above-mentioned point of view as well as from the viewpoint of thermal welding.

The thermoplastic resin paint may be impregnated with any method such as brush coating or immersion in a paint bath, but the immersion method is suitable for mass production.

In the present invention, the antistatic packaging bag paper obtained above is stacked with two sheets of packaging bag paper as shown in Figure 2.
One side is opened and the edges of the other three sides are heated and welded (3) to form a bag, which is used for packaging semiconductor products.

Example A 100μ thick paper based on plant fibers was impregnated with a thermoplastic urethane resin paint (trade name: Dentol, manufactured by Nippon Elastolan Co., Ltd.) mixed with fine carbon powder, and then dried and applied. A packaging bag paper for semiconductor products having a thickness of 20 μm and having antistatic properties was obtained.

The resistance value of this wrapping paper is 2500 Q. In this invention, paper based on plant fibers is impregnated with heat-weldable thermoplastic resin paint mixed with conductivity imparting agents such as metal powder and carbon powder, which has an excellent conductivity effect. A bag formed by heating and welding packaging bag paper can completely prevent semiconductor products from being electrostatically charged.

Furthermore, since the coating film on the paper based on plant fibers is a thermoplastic resin, it can be heat-welded and can be easily and easily processed into bags.

In addition, since paper is composed of a collection of fibers, there is no risk of the paint penetrating between the fibers and causing their adhesion to peel off.

Furthermore, because paper based on plant fibers is simply impregnated with heat-sealable thermoplastic resin paint containing a conductivity imparting agent, extremely thin paper can be easily and inexpensively obtained, and its tensile strength is high. It is durable and highly flexible, making it ideal for packaging bags for semiconductor products.

[Brief explanation of the drawing]

Figure 1 is an enlarged cross-sectional view of a portion of packaging bag paper for semiconductor products that is antistatic according to the present invention, and Figure 2 is a package formed using the packaging bag paper that is antistatic according to the present invention. A perspective view of one example of a bag. 1...Paper based on plant fibers, 2...
- Heat-weldable thermoplastic synthetic resin paint, 3...
・Heat welded part.

Claims (1)

[Scope of utility model registration request] A paper for packaging bags for semiconductor products that is antistatic and is made by impregnating plant fiber-based paper with a heat-weldable thermoplastic resin paint mixed with a conductive agent such as metal powder or carbon powder.