JPS5825558B2 - Laser processing equipment - Google Patents

Laser processing equipment

Info

Publication number
JPS5825558B2
JPS5825558B2 JP55130761A JP13076180A JPS5825558B2 JP S5825558 B2 JPS5825558 B2 JP S5825558B2 JP 55130761 A JP55130761 A JP 55130761A JP 13076180 A JP13076180 A JP 13076180A JP S5825558 B2 JPS5825558 B2 JP S5825558B2
Authority
JP
Japan
Prior art keywords
laser beam
laser
hole
cover
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55130761A
Other languages
Japanese (ja)
Other versions
JPS5756190A (en
Inventor
正明 佐藤
英 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55130761A priority Critical patent/JPS5825558B2/en
Publication of JPS5756190A publication Critical patent/JPS5756190A/en
Publication of JPS5825558B2 publication Critical patent/JPS5825558B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476Features inside the nozzle for feeding the fluid stream through the nozzle

Description

【発明の詳細な説明】 この発明は主として溶接加工に好適なレーザ加工装置に
係わり、特に加工部を不活性ガスによってシールドして
行う装置の改良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention mainly relates to a laser processing device suitable for welding processing, and particularly to an improvement of a device in which a processing section is shielded with an inert gas.

たとえばレーザ溶接加工において、溶接される部分を大
気にさらした状態では溶接部に悪影響があるため、これ
を避けるべ〈従来から種々の工夫がなされている。
For example, in laser welding, exposing the part to be welded to the atmosphere has an adverse effect on the weld, so various techniques have been used to avoid this.

第1図はその工夫したものの一つで溶接・溶断の両方を
兼ねることのできるレーザ加工用のノズルである。
Figure 1 shows one of these innovations, a nozzle for laser processing that can be used for both welding and fusing.

同図において、集光レンズ1を内設するレンズホルダ2
とノズル3とがスペーサ4により同軸に結合されている
In the figure, a lens holder 2 in which a condensing lens 1 is installed
and the nozzle 3 are coaxially coupled by a spacer 4.

ノズル3の先端部は内筒体5およびこの内筒体5の下端
側5を取囲む外筒体6の二重構造となり、いずれも先細
に形成されている。
The tip of the nozzle 3 has a double structure of an inner cylinder 5 and an outer cylinder 6 surrounding the lower end 5 of the inner cylinder 5, both of which are tapered.

内筒体5の先端は集束されたレーザ光7の射出孔8とな
り、また外筒体6の先端は射出孔8を取囲む環状の噴気
口9となっている。
The tip of the inner cylindrical body 5 serves as an exit hole 8 for the focused laser beam 7, and the tip of the outer cylindrical body 6 serves as an annular blowhole 9 surrounding the injection hole 8.

外筒体6にはその側壁を貫通し、内・外筒間に形成され
たヘッダ10に通じる不活性、例えばアルゴンガスの供
給管11が接続されている。
An inert, for example, argon gas supply pipe 11 is connected to the outer cylinder 6, passing through its side wall and communicating with a header 10 formed between the inner and outer cylinders.

また内筒体5の上部側にはその側壁を貫通して接続され
た酸素ガスの供給管13が接続されている。
Further, an oxygen gas supply pipe 13 is connected to the upper side of the inner cylindrical body 5 through its side wall.

このノズルの場合、内筒体5の先細部5′の側壁に、ヘ
ッダ10に開き内筒体5の内部に連通ずる通路14が設
けられている。
In the case of this nozzle, a passage 14 that opens in the header 10 and communicates with the inside of the inner cylinder 5 is provided in the side wall of the tapered portion 5' of the inner cylinder 5.

上記のノズル3による溶接加工は、供給管13からの酸
素の供給を断ち、供給管13からアルゴンガスを供給す
ることで行われる。
The welding process using the nozzle 3 described above is performed by cutting off the supply of oxygen from the supply pipe 13 and supplying argon gas from the supply pipe 13.

被加工物15゜16溶接部17は環状の噴気口9からの
アルゴンガスでシールドされ、大気にさらされることな
くレーザ光7の照射を受けることができ、また通路14
から噴出するアルゴンガスの流れが溶接部17からの蒸
気等の飛散物による集光レンズ1の汚染を防止すること
ができる。
The welded part 17 of the workpiece 15° 16 is shielded with argon gas from the annular blowhole 9 and can be irradiated with the laser beam 7 without being exposed to the atmosphere.
The flow of argon gas ejected from the welding part 17 can prevent the condensing lens 1 from being contaminated by scattered objects such as steam from the welding part 17.

しかしながら、噴気口9から出るアルゴンガスは溶接部
17にできる溶融池を直接的に噴射してしまい、アルゴ
ンガスが溶接内部に入り込んで気孔を作ったり、また、
上記ノズルでは飛散物や蒸気を積極的に排除していない
構造となっているため、ノズルの先端の射出孔8や噴気
口9が長時間使用中には閉塞してしまうなどの不具合が
あった。
However, the argon gas coming out of the nozzle 9 directly injects the molten pool formed in the welding part 17, and the argon gas enters the inside of the weld and creates pores.
Since the nozzle mentioned above has a structure that does not actively exclude flying objects and steam, there were problems such as the injection hole 8 and jet nozzle 9 at the tip of the nozzle becoming clogged during long periods of use. .

更に、上記のようなノズルではシールド面積が狭く、レ
ーザ光と被加工物とを相対的に移動して溶接する場合で
は、溶接部が十分冷却されない間に大気にさらされて酸
化してしまうという重大な不具合があった。
Furthermore, the shield area of the nozzle described above is small, and when welding is performed by moving the laser beam and the workpiece relative to each other, the welded part may be exposed to the atmosphere and oxidized while it is not sufficiently cooled. There was a serious problem.

この発明は上記の事情に鑑みてなされたもので、シール
ド面積を加工完了部が酸化しない程度の温度に冷却され
る範囲とし、かつ加工部からの飛散物や蒸気をシールド
ガスと共に加工部の上方に導き、レーザ光の光路に直交
する方向に強制排除することにより、酸化防止を確実に
したレーザ加工を実施できるようにしたものである。
This invention was made in view of the above-mentioned circumstances, and the shield area is set in a range where the processed part is cooled to a temperature that does not oxidize. By guiding the laser beam and forcibly removing it in a direction perpendicular to the optical path of the laser beam, it is possible to perform laser processing with reliable prevention of oxidation.

以下、実施例を示す図面を参照し、この発明を説明する
Hereinafter, the present invention will be described with reference to drawings showing embodiments.

第2図および第3図はこの発明の一実施例のレーザ溶接
加工における装置を示す。
FIGS. 2 and 3 show an apparatus for laser welding according to an embodiment of the present invention.

図において、レーザ発振器21を有し、このレーザ発振
器21から発振されたレーザ光22は反射鏡23、集光
レンズ24を経て移動テーブル(図示せず)上に載置さ
れた被加工物25 a > 25 bの合わせ部26に
集束照射されるようになっている。
In the figure, a laser oscillator 21 is provided, and a laser beam 22 emitted from the laser oscillator 21 passes through a reflecting mirror 23 and a condensing lens 24 to a workpiece 25 a placed on a moving table (not shown). > 25b is focused and irradiated onto the matching portion 26.

上記被工物25 a 、25 bの上方には、それらに
近接して合わせ部26に対するレーザ光照射のスポット
部を十分に覆う面積をもつ角形または円形の覆い板27
が水平に配置されている。
Above the workpieces 25 a and 25 b, a rectangular or circular cover plate 27 having an area that sufficiently covers the spot portion of the laser beam irradiation on the mating portion 26 is provided close to the workpieces 25 a and 25 b.
is placed horizontally.

上記覆い板27の面積は上記移動テーブルの加工走査速
度によって異なるが、要は合わせ部26における溶接部
分が覆い板27が外れた時点で、大気と酸化反応を起こ
しえない程度に温度低下する余裕の広さであればよい。
The area of the cover plate 27 varies depending on the processing scanning speed of the movable table, but the important thing is that there is enough room for the temperature of the welded part at the joining part 26 to drop to such an extent that no oxidation reaction with the atmosphere occurs when the cover plate 27 is removed. It should be as wide as .

また覆い板27は必ずしも板状でなくてよく、加工形状
によって変形される。
Further, the cover plate 27 does not necessarily have to be plate-shaped, and can be deformed depending on the shape of the plate.

集光レンズ24を透過した集束レーザ光22との光路上
の位置となる覆い板27のほぼ中央にはこの集束レーザ
光22の光束全体を通過させる穴28が穿設されている
A hole 28 is bored at approximately the center of the cover plate 27, which is located on the optical path of the focused laser beam 22 that has passed through the focusing lens 24, through which the entire beam of the focused laser beam 22 passes.

また、覆い板27の上方には図示せぬ公知の送風機に接
続された送風管29がスリット状の開口部に形成されて
いる先端を集束レーザ光22の光束に可及的に近接して
設置されている。
Further, above the cover plate 27, a blow pipe 29 connected to a known blower (not shown) is installed with its tip formed in a slit-shaped opening as close as possible to the beam of the focused laser beam 22. has been done.

この送風管29の上記先端を含む一端部は排気管30内
に嵌入されている。
One end portion of the blower pipe 29 including the above-mentioned tip is fitted into the exhaust pipe 30 .

この排気管30には集束レーザ光22の光束全体が通過
するための通気孔31が穿設されていて、この通気孔3
1は穴28とほぼ同軸的に位置している。
This exhaust pipe 30 is provided with a ventilation hole 31 through which the entire luminous flux of the focused laser beam 22 passes.
1 is located approximately coaxially with the hole 28.

一方、上記覆い板27には穴28の穿設のほかに、排気
管30を間にした対称位置の四箇所にそれぞれ供給管3
2が接続されている。
On the other hand, in addition to drilling holes 28 in the cover plate 27, supply pipes 3 are provided at four locations symmetrically with the exhaust pipe 30 in between.
2 are connected.

これら供給管32は、不活性ガス供給装置に接続し、被
加工物25a。
These supply pipes 32 are connected to an inert gas supply device and are connected to the workpiece 25a.

25bと覆い板27との対向空間33に不活性ガスを供
給するようになっている。
An inert gas is supplied to a space 33 between the cover plate 25b and the cover plate 27.

なお、上記排気管30は、送風管29の噴射による流束
を拡大しないことと、排気物を所定箇所に導くためのも
のであり、それらの必要がない場合には除去しても差し
支えない。
Note that the exhaust pipe 30 is for not expanding the flux caused by the injection from the blast pipe 29 and for guiding the exhaust to a predetermined location, and may be removed if these are not necessary.

次に上記の構成による作用を説明する。Next, the effect of the above configuration will be explained.

先ず、図示せぬ送風機および不活性ガス供給装置を作動
せしめ、矢印Aに示す方向から空気、窒素等の高速流体
を送風管29より流し、また、各供給管32からは、ア
ルゴン、ヘリウム等の不活性ガスがそれぞれ矢印Cおよ
びD方向から供給される。
First, a blower and an inert gas supply device (not shown) are activated, and a high-speed fluid such as air or nitrogen is flowed from the blow pipe 29 in the direction shown by arrow A, and argon, helium, etc. are supplied from each supply pipe 32. Inert gas is supplied from the directions of arrows C and D, respectively.

上記不活性ガスは被加工物25a 、25bの面に向っ
て噴出し、矢印E、FまたはG、H方向に沿って流れ、
対向空間33内に充満する。
The inert gas is ejected toward the surfaces of the workpieces 25a and 25b and flows along the directions of arrows E, F or G, H,
The opposing space 33 is filled.

上記充満した不活性ガスは排気管30内に流れる高速流
体による吸引作用で矢印I、Jに示すように穴28、通
気孔31を通り上記高速流体と合流して矢印B方向に排
出される。
The filled inert gas is suctioned by the high-speed fluid flowing in the exhaust pipe 30, passes through the hole 28 and the vent hole 31 as shown by arrows I and J, merges with the high-speed fluid, and is discharged in the direction of arrow B.

このような状態にした後、レーザ発振器1を作動し、レ
ーザ光22と被加工物25 a 、25 bとを相対的
に走査するために、前記図示せぬ移動テーブルを走査し
て合わせ部26、溶接加工を行う。
After achieving this state, the laser oscillator 1 is activated, and in order to relatively scan the laser beam 22 and the workpieces 25 a and 25 b, the movable table (not shown) is scanned and the alignment portion 26 is moved. , Performs welding processing.

集束レーザ光22の照射を受けて一時的に溶融する合わ
せ部26から発生する溶融飛散物や金属蒸気は、矢印I
、Jで示す不活性ガスの流れに乗って強制排気され、ま
た同時に、上記矢印I、Jの流れ作用を発生させる排気
管30の高速流体は溶接内部に気孔をつくるガスを、照
射されて溶融している部分の合わせ部26内部から強制
的に吸引し、矢印B方向に高速流体、不活性ガス、飛散
物等とともに排除する。
The melted scatterings and metal vapor generated from the joint portion 26 that is temporarily melted when irradiated with the focused laser beam 22 are shown by the arrow I.
, J is forcibly exhausted along with the flow of inert gas, and at the same time, the high-speed fluid in the exhaust pipe 30 that generates the flow action shown by arrows I and J is irradiated and melts the gas that creates pores inside the weld. It is forcibly sucked in from inside the mating portion 26 of the part where the gas is attached, and is removed along with high-speed fluid, inert gas, scattered objects, etc. in the direction of arrow B.

上記気孔についてはシールドガスとなっている不活性ガ
スも一因となるが、上記したように矢印■。
The inert gas acting as a shielding gas is also a contributing factor to the above pores, but as mentioned above, the arrow ■.

Jとなり、合わせ部26に直接吹きつけてはいないので
、溶融時の合わせ部26内に侵入しにくくなる。
J, and since it is not sprayed directly onto the joint part 26, it becomes difficult for it to enter into the joint part 26 during melting.

一方、覆い板27は合わせ部26における集束レーザ光
22のスポット部を十分覆う面積になっているので、集
束レーザ光22の照射を受けた合わせ部26は覆い27
から外れ、大気にふれても酸化されることはない。
On the other hand, since the cover plate 27 has an area that sufficiently covers the spot portion of the focused laser beam 22 on the mating portion 26, the mating portion 26 that has been irradiated with the focused laser beam 22 is covered with the cover plate 27.
It will not be oxidized even if it comes off and comes into contact with the atmosphere.

以上詳述したように、この発明は溶接、スクライビング
等の加工において、加工部もしくはその近傍に不活性ガ
スを直接噴射してシールドするのではなく、不活性ガス
が加工部より離れた周囲から加工部に向かう流れのシー
ルドとなるために、例えばレーザ溶接加工では、レーザ
光路に不活性ガスが導かれ、かつレーザ光路に交差する
方向に排出する手段を設けるとともに、シールドの雰囲
気をつくる覆い板加工走査速度に見合った大きさの面積
として構成したので、溶接加工においては、不活性ガス
が溶融部内に発生するガスが不活性ガスとともに強制的
に排出され、気孔のない溶接部を得ることができ、また
、溶接完了後、大気にふれて酸化してしまった従来の不
具合も覆いの面積を十分にとることにより解消された。
As detailed above, in processing such as welding and scribing, the present invention does not directly inject inert gas at or near the processing part to shield it, but rather injects inert gas from the surrounding area away from the processing part. For example, in laser welding processing, inert gas is guided into the laser optical path and a means is provided to discharge it in a direction that intersects the laser optical path, and a cover plate is processed to create a shielding atmosphere. Since the area is configured to be large enough to match the scanning speed, during the welding process, the inert gas generated in the molten zone is forcibly discharged together with the inert gas, making it possible to obtain a welded zone without pores. Furthermore, the conventional problem of oxidation due to exposure to the atmosphere after welding is completed has been resolved by providing a sufficient cover area.

なお、上記実施例では、排気管内に設置した送風管より
高速の気体を流したが、水などの液体を高速に流しても
よい。
In the above embodiment, gas was flowed at high speed from the blower pipe installed in the exhaust pipe, but liquid such as water may be flowed at high speed.

また以上のような高速流体による排気作用のかわりに、
例えば真空吸引装置によって代替できることは言うまで
もない。
Also, instead of the exhaust action caused by the high-speed fluid as described above,
Needless to say, it can be replaced by a vacuum suction device, for example.

さらには、この発明の第2の実施例である第4図に示す
ように排気管30と覆い板27とは一体にせず、離して
設置し例えば排気管30を矢印2−2で示す上下方向に
移動できるようにすれば、穴28よりの吸G七げ量の微
調節をすることができる。
Furthermore, as shown in FIG. 4, which is a second embodiment of the present invention, the exhaust pipe 30 and the cover plate 27 are not integrated, but are installed separately, for example, so that the exhaust pipe 30 is moved in the vertical direction indicated by the arrow 2-2. By making it possible to move to , the amount of G suction from the hole 28 can be finely adjusted.

第5図はこの発明の第3の実施例で、この実施例に覆い
板27は裏面に不活性ガスを穴28に向って導くための
溝34を設けたものであって、上記溝34によって不活
性ガスの排気管30内への流れ込みはより良好となる。
FIG. 5 shows a third embodiment of the present invention, in which a cover plate 27 is provided with a groove 34 on the back surface for guiding inert gas toward the hole 28. The flow of inert gas into the exhaust pipe 30 becomes better.

なおこの発明は上記実施例に限定されることなく、要旨
を逸脱しない範囲で種々変形できるものである。
Note that the present invention is not limited to the above-mentioned embodiments, and can be modified in various ways without departing from the spirit of the invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図従来の装置の断面図、第2図はこの発明の一実施
例を示す断面図、83図は第2図の■−■線に沿って切
断した断面図、第4図はこの発明の第2実施例を示す断
面図、第5図はこの発明の第3の実施例を示す平面図で
ある。 21・・・・・・レーザ発振器、22・・・・・・レー
ザ光、24・・・・・・集光レンズ、25a 、25b
・・・・・・被加工物、27・・・・・・覆い板、28
・・・・・・穴、29・・・・・・送風管、30・・・
・・・排気管、32・・・・・・供給管。
Fig. 1 is a cross-sectional view of a conventional device, Fig. 2 is a cross-sectional view showing an embodiment of the present invention, Fig. 83 is a cross-sectional view taken along the line ■-■ in Fig. 2, and Fig. 4 is a cross-sectional view of the present invention. FIG. 5 is a cross-sectional view showing a second embodiment of the invention, and FIG. 5 is a plan view showing a third embodiment of the invention. 21... Laser oscillator, 22... Laser light, 24... Condensing lens, 25a, 25b
...Workpiece, 27...Covering plate, 28
...hole, 29 ... air pipe, 30 ...
...exhaust pipe, 32...supply pipe.

Claims (1)

【特許請求の範囲】 1 レーザ発振器と、上記レーザ発振器から放出される
レーザ光を集光して被加工物に集束スポットを照射する
集光レンズと、上記集光レンズと上記被加工物との間に
なり上記レーザ光に交差して設けられるとともに上記レ
ーザ光の光路上になる位置に上記レーザ光を通過させる
穴を有する覆いと、上記覆いと上記被加工物との対向空
間に対し上記穴から離れた位置から不活性ガスを供給す
る供給手段と、上記覆いの上方に位置し上記対向空間に
充満された不活性ガスを上記穴より導き上記レーザ光の
光路外に排出装置とを備えることを特徴とするレーザ加
工装置。 2、特許請求の範囲第1項記載のレーザ加工装置におい
て、覆いはレーザ光の照射後の加工部が加工走査時大気
に接触した時点で酸化されない温度に低下することを補
償する面積になっていることを特徴とするレーザ加工装
置。 3 特許請求の範囲第1項記載のレーザ加工装置におい
て、排出装置は通気孔を有しこの通気孔をレーザ光路に
位置して設けられる外管とこの外管に嵌入され一端を上
記通気孔に可及的に接近して設けられ上記通気孔を通過
するレーザ光に交差する方向に高速の流体を噴出する内
管とで構成されることを特徴とするレーザ加工装置。
[Scope of Claims] 1. A laser oscillator, a condenser lens that condenses laser light emitted from the laser oscillator and irradiates a focused spot on the workpiece, and a combination of the condenser lens and the workpiece. a cover having a hole intersecting the laser beam and passing the laser beam at a position on the optical path of the laser beam; and a cover having a hole in the space facing the cover and the workpiece. and a discharge device positioned above the cover and guiding the inert gas filling the opposing space from the hole to outside the optical path of the laser beam. Laser processing equipment featuring: 2. In the laser processing apparatus according to claim 1, the cover has an area that compensates for the temperature of the processed part after irradiation with the laser beam to decrease to a temperature at which it will not be oxidized when it comes into contact with the atmosphere during processing scanning. A laser processing device characterized by: 3. In the laser processing apparatus according to claim 1, the discharge device has a vent hole, and the vent device is fitted into an outer tube provided in the laser beam path and has one end connected to the vent hole. A laser processing device characterized by comprising an inner tube that is provided as close as possible to the inner tube and ejects a high-speed fluid in a direction intersecting the laser beam passing through the ventilation hole.
JP55130761A 1980-09-22 1980-09-22 Laser processing equipment Expired JPS5825558B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55130761A JPS5825558B2 (en) 1980-09-22 1980-09-22 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55130761A JPS5825558B2 (en) 1980-09-22 1980-09-22 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPS5756190A JPS5756190A (en) 1982-04-03
JPS5825558B2 true JPS5825558B2 (en) 1983-05-27

Family

ID=15042017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55130761A Expired JPS5825558B2 (en) 1980-09-22 1980-09-22 Laser processing equipment

Country Status (1)

Country Link
JP (1) JPS5825558B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58179989U (en) * 1982-05-25 1983-12-01 株式会社東芝 Laser irradiation device
US5045668A (en) * 1990-04-12 1991-09-03 Armco Inc. Apparatus and method for automatically aligning a welding device for butt welding workpieces
US5981901A (en) * 1991-11-29 1999-11-09 La Rocca; Aldo Vittorio Method and device for gas shielding laser processed work pieces
JP2009166065A (en) * 2008-01-15 2009-07-30 Nippon Densan Corp Laser beam processing method, bearing device, spindle motor, and disk drive unit

Also Published As

Publication number Publication date
JPS5756190A (en) 1982-04-03

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