JPS5825055U - 半導体発光表示装置 - Google Patents

半導体発光表示装置

Info

Publication number
JPS5825055U
JPS5825055U JP1981117639U JP11763981U JPS5825055U JP S5825055 U JPS5825055 U JP S5825055U JP 1981117639 U JP1981117639 U JP 1981117639U JP 11763981 U JP11763981 U JP 11763981U JP S5825055 U JPS5825055 U JP S5825055U
Authority
JP
Japan
Prior art keywords
light emitting
semiconductor light
display device
emitting element
emitting display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981117639U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218071Y2 (forum.php
Inventor
藤村　則夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1981117639U priority Critical patent/JPS5825055U/ja
Publication of JPS5825055U publication Critical patent/JPS5825055U/ja
Application granted granted Critical
Publication of JPS6218071Y2 publication Critical patent/JPS6218071Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1981117639U 1981-08-10 1981-08-10 半導体発光表示装置 Granted JPS5825055U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981117639U JPS5825055U (ja) 1981-08-10 1981-08-10 半導体発光表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981117639U JPS5825055U (ja) 1981-08-10 1981-08-10 半導体発光表示装置

Publications (2)

Publication Number Publication Date
JPS5825055U true JPS5825055U (ja) 1983-02-17
JPS6218071Y2 JPS6218071Y2 (forum.php) 1987-05-09

Family

ID=29911800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981117639U Granted JPS5825055U (ja) 1981-08-10 1981-08-10 半導体発光表示装置

Country Status (1)

Country Link
JP (1) JPS5825055U (forum.php)

Also Published As

Publication number Publication date
JPS6218071Y2 (forum.php) 1987-05-09

Similar Documents

Publication Publication Date Title
JPS5825055U (ja) 半導体発光表示装置
JPS6073966U (ja) ガスケツトの位置決め装置
JPS5968385U (ja) 液晶表示装置
JPS58151262U (ja) 照明器付キ−
JPS5835280U (ja) コネクタのロツク装置
JPS6016566U (ja) 光素子用フイメ−ル
JPS58183770U (ja) 端子ネジ
JPS59121895U (ja) シ−ルドケ−ス
JPS59168894U (ja) テ−プカセツト
JPS6067604U (ja) ランプソケツト取付装置
JPS6148015U (ja) 燃料フイルタ装置
JPS5981050U (ja) 反射体付きｌｅｄ素子
JPS5926950U (ja) 硬質フイルム止着装置
JPS5835277U (ja) コンセント
JPS5927281U (ja) 排水溝の蓋
JPS59169047U (ja) 集積回路素子
JPS58156675U (ja) 集水器の梱包構造
JPS5865907U (ja) コハゼ
JPS5990190U (ja) スワン式ランプ取付装置
JPS5935587U (ja) ガラス押え材
JPS60189151U (ja) 受光装置
JPS59129182U (ja) コネクタ装置
JPS5876158U (ja) 断線検知装置
JPS58178283U (ja) リ−ドフレ−ム
JPS606184U (ja) 光表示装置