JPS58223227A - Method of fixing connecting terminal - Google Patents

Method of fixing connecting terminal

Info

Publication number
JPS58223227A
JPS58223227A JP57105151A JP10515182A JPS58223227A JP S58223227 A JPS58223227 A JP S58223227A JP 57105151 A JP57105151 A JP 57105151A JP 10515182 A JP10515182 A JP 10515182A JP S58223227 A JPS58223227 A JP S58223227A
Authority
JP
Japan
Prior art keywords
connecting terminal
fixing
terminal
paste
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57105151A
Other languages
Japanese (ja)
Inventor
寛治 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meisei Electric Co Ltd
Original Assignee
Meisei Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meisei Electric Co Ltd filed Critical Meisei Electric Co Ltd
Priority to JP57105151A priority Critical patent/JPS58223227A/en
Publication of JPS58223227A publication Critical patent/JPS58223227A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は冨1子部品の接続端子を封止する方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for sealing connection terminals of a single-layer component.

近年、印刷配線板への実装に適した機構的電子部品、例
えば軽量小形の電磁継電器、スイッチ等が要求されてお
り、これらの電子部品の印刷配線板への取付は及び配線
は、フラッフ塗布やデi)ヒート処理などを含む自動半
田槽で、その外部接続端子を半田付けすることによって
行われている。
In recent years, there has been a demand for mechanical electronic components that are suitable for mounting on printed wiring boards, such as lightweight and compact electromagnetic relays and switches, and these electronic components can be mounted on printed wiring boards and wired using fluff coating or other methods. d) This is done by soldering the external connection terminals in an automatic soldering tank that includes heat treatment.

このため、例えば電磁継電器の場合、半田付作業の際の
フラックスの電磁継電器本体、特に接点部への付着や溶
剤の付着から、電磁継電器を保護する目的と、運用時の
ほこりなどからの保護のため、電磁継電器本体を樹脂の
ケースに収容したものが作られている。
For this reason, for example, in the case of an electromagnetic relay, the purpose is to protect the electromagnetic relay from adhesion of flux to the electromagnetic relay body, especially the contact part, and solvent adhesion during soldering work, and to protect it from dust during operation. Therefore, electromagnetic relays are manufactured in which the main body is housed in a resin case.

更に半田付は後印刷配線板面のフラックスの除去などを
行う目的として印刷配線板に部品を実装した状態で所謂
“丸洗い″を行う必要のあるものや、運用時に腐食性ガ
スなどの有害芥囲気での使用に耐える気密性の高い封止
が施されている電磁継電器が要求される場合があり、こ
れらの要求に対してはケースの封着部を完全に制止する
と共に、外部接続端子の引出部の隙間からの前記溶剤や
フラックス、及び有害ガスなどの浸入を防止するため従
来は例えば第1図に示すように電磁継電器本体Rを組立
ててケース3に収容した後、ペース1に挿通しだ外部接
続端子2の周縁を工rJeキシ樹脂等の接着剤Eなどに
より充填し、隙間を封止していだのであるが、このよう
な固着方法では接着剤が必要であるだめに材料費がかさ
み、その上余分な接着剤が外部接続端子の半田付部に付
着するのを避けるために封止工程では細心の注意が必要
で組立てに時間がかかるなど製造上安価な電磁継電器を
提供できない欠点があった。本発明はこれらの欠点を解
消し、安価な電子部品(電磁継電器等)を提供するだめ
になされたもので以下本発明を図面に従って順次説明す
る。
Furthermore, after soldering, there are cases where it is necessary to perform so-called "washing" with the components mounted on the printed wiring board in order to remove flux from the surface of the printed wiring board, and there are cases where the printed wiring board is exposed to harmful gases such as corrosive gases during operation. In some cases, electromagnetic relays are required to have a highly airtight seal that can withstand use in In order to prevent the infiltration of the solvent, flux, harmful gas, etc. through the gaps between the parts, conventionally, as shown in Fig. 1, the electromagnetic relay body R was assembled and housed in the case 3, and then inserted into the pace 1. The periphery of the external connection terminal 2 was filled with an adhesive E such as resin, and the gap was sealed, but this method of fixing requires adhesive, which increases the material cost. Furthermore, in order to avoid excess adhesive from adhering to the soldered parts of the external connection terminals, careful attention is required during the sealing process, and assembly time is required. there were. The present invention has been made to eliminate these drawbacks and provide inexpensive electronic components (electromagnetic relays, etc.).The present invention will be explained below in sequence with reference to the drawings.

第2図〜第6図はいずれも本発明を電磁継電器に実施し
た実施例について説明するだめの図であり、第2図(A
) T (B)は、それぞれ本発明を実施した電磁継電
器の側面図及び底面図、第3図(A)〜(D)は本発明
に係る固着方法を説明する要部の断面図、第4図囚〜(
9)は外部接続端子の種々の形状のものについて本発明
を実施した後の要部の断面図、第5図及び第6図は外部
端子の挿入孔について他の実施例を示す要部の断面図で
ある。
2 to 6 are diagrams for explaining an embodiment in which the present invention is applied to an electromagnetic relay, and FIG. 2 (A
) T (B) is a side view and a bottom view of an electromagnetic relay embodying the present invention, respectively, FIGS. 3(A) to (D) are sectional views of essential parts explaining the fixing method according to the present invention, and FIG. Illustrated prisoner~(
9) is a cross-sectional view of the main part after implementing the present invention for various shapes of external connection terminals, and FIGS. 5 and 6 are cross-sectional views of the main part showing other embodiments of the external terminal insertion hole. It is a diagram.

第2図〜第6図に於いて、1は熱可塑性樹脂で成形され
たペース、2は外部接続端子(以下、端子という。)、
3はケース、Rは電磁継電器本体、Fは2次成形用成形
型(以下、成形型という。)であり、ペース1に於いて
、11 (11A、11B)は端子挿入孔(以下、孔と
いう。)12は肉厚部、端子2に於いて、21は溝、2
2は突部、成形型Fに於いて、flけ成形用の窪み、f
2は窪みflの側面図、f3け端子の逃げ孔である。ペ
ース1には第3図(4)に示すように、端子2を挿通す
る表裏に貫通した孔11が設けられており、この孔11
の周縁には、他の部分より厚い肉厚部12が円筒状に成
形されている。また、孔11の内径寸法r1は端子2の
径寸法r2より若干大きく設定され、当該孔11内を端
子2が容易に挿通できるようになっている。第2図に示
すように、電磁継電器本体Rは組立後、ペース1に端子
2を挿通し、保護カバーを兼ねたケース3に収容する。
In Figures 2 to 6, 1 is a paste molded from thermoplastic resin, 2 is an external connection terminal (hereinafter referred to as a terminal),
3 is a case, R is the electromagnetic relay body, F is a mold for secondary molding (hereinafter referred to as the mold), and in Pace 1, 11 (11A, 11B) are terminal insertion holes (hereinafter referred to as holes). .) 12 is the thick part, 21 is the groove in the terminal 2, 2
2 is a protrusion, and in the mold F, a recess for fl-forming, f
2 is a side view of the depression fl, which is an escape hole for the terminal f3. As shown in FIG. 3 (4), the pace 1 is provided with a hole 11 penetrating the front and back sides through which the terminal 2 is inserted.
A thick wall portion 12, which is thicker than other portions, is formed in a cylindrical shape around the periphery. Further, the inner diameter dimension r1 of the hole 11 is set to be slightly larger than the diameter dimension r2 of the terminal 2, so that the terminal 2 can be easily inserted into the hole 11. As shown in FIG. 2, after assembly of the electromagnetic relay main body R, the terminal 2 is inserted through the paste 1, and the electromagnetic relay main body R is housed in a case 3 which also serves as a protective cover.

勿論この場合ケース3に収容された電磁継電器本体Rは
位置(5) ずれなど生じないよう適宜な手段で保持できるようにし
ておく。この状態ではペース1の孔11と端子2とは第
3図(4)に示すように若干の隙間gを有して配置され
ている。
Of course, in this case, the electromagnetic relay body R housed in the case 3 should be held in position (5) by appropriate means so as not to shift. In this state, the hole 11 of the paste 1 and the terminal 2 are arranged with a slight gap g as shown in FIG. 3(4).

この状態から第3図(I3)に示すように、ペース1を
構成する樹脂を軟化、溶融させる程度に熱せられた成形
型Fを端子2の軸方向(矢印方向)に沿って移動圧下す
る。ところで、成形型Fは第3図(B)に示すように傾
斜面に構成された側壁面f2を有する、肉厚部12を2
次成形加工するための窪みflと、2次成形加工時の成
形型Fの移動時の端子の逃げ孔f3が形成されて成って
おり、自みflの開口部の径寸法r4はペース1の肉厚
部12の径寸法r3よ如若干大きく、また、窪み1f1
の底部の径寸法r5はペース1の肉厚部12の径寸法r
3より小さくそれぞれ設定されており、当該成形型Fの
下降により、その窪みfl中に上記肉厚部12が内包さ
れるようになっている。尚、端子2の逃げ孔f3の径が
端子2の径より大きく設定されていることは勿論である
From this state, as shown in FIG. 3 (I3), the mold F heated to such an extent as to soften and melt the resin constituting the paste 1 is moved and pressed down along the axial direction (arrow direction) of the terminal 2. By the way, as shown in FIG. 3(B), the mold F has a thick wall portion 12 having a side wall surface f2 formed as an inclined surface.
It consists of a recess fl for the next forming process and an escape hole f3 for the terminal when the mold F is moved during the secondary forming process, and the diameter r4 of the opening of the self fl is the same as that of the pace 1. The diameter dimension r3 of the thick portion 12 is somewhat larger, and the recess 1f1
The diameter dimension r5 of the bottom part is the diameter dimension r of the thick part 12 of the pace 1.
3, and when the mold F is lowered, the thick portion 12 is contained in the recess fl. It goes without saying that the diameter of the escape hole f3 of the terminal 2 is set larger than the diameter of the terminal 2.

(6) したがって第3図(B)に示すように成形型Fを矢印方
向に移動圧下していくと、ペース1の肉厚部12け成形
型Fの窪みflの内部に包容され、斜面を形成している
側壁面f2によって圧下行程で肉厚部12の樹脂が孔1
1の径寸法r1を縮少する方向に変形し、第3図(C)
に示すように孔11と端子2との間の隙間gを少くとも
肉厚部12の部分でふさいで、端子2の側面とペース1
とは互いに密着する。肉厚部12の上記変形は塑性変形
であるので、第3図(9)に示すように、2次成形加工
の後、成形型Fを外しても上記変形はそのまま維持され
る。このようにして、樹脂の冷却後端子2はペース1に
封着固定される。
(6) Therefore, as shown in Fig. 3(B), when the mold F is moved and compressed in the direction of the arrow, the 12-thick part of Pace 1 is enclosed inside the depression fl of the mold F, and the slope is Due to the formed side wall surface f2, the resin in the thick part 12 is drawn into the hole 1 during the rolling process.
Fig. 3 (C)
As shown in FIG.
are in close contact with each other. Since the deformation of the thick portion 12 is plastic deformation, the deformation is maintained as it is even if the mold F is removed after the secondary molding process, as shown in FIG. 3(9). In this way, the terminal 2 is sealed and fixed to the paste 1 after the resin has cooled.

本発明に係る方法による端子2の固着及び封止効果をよ
り高くするために端子2の形状に種々の工夫がなされる
。第4図(A)〜(D)は端子2の形状の変形を示した
もので、第4図(4)は端子2の被固着部全周にわたっ
て$21を設けだもの、第4図(B)は端子2の被固着
部全周にわたって突部22を設けたもの、第4図(C)
は端子2の被固着部軸心方向に溝21を設けたもの、第
4図の)は端子2の被固着部軸心方向に突部22を設け
だものをそれぞれ示している。
Various modifications are made to the shape of the terminal 2 in order to enhance the fixing and sealing effect of the terminal 2 by the method according to the present invention. 4(A) to 4(D) show the deformation of the shape of the terminal 2. FIG. B) is the one in which the protrusion 22 is provided around the entire circumference of the fixed part of the terminal 2, Fig. 4 (C)
4 shows a case in which a groove 21 is provided in the axial direction of the fixed part of the terminal 2, and a protrusion 22 is provided in the axial direction of the fixed part of the terminal 2.

これらの形状の端子に対して前記第3図(A)〜(D)
で説明した固着方法によって端子2をペース1に固着す
ると、肉厚部12の熱可塑性樹脂が溝21又は突部22
の周囲に充填されるので、第3図(A)。
3(A) to (D) above for terminals of these shapes.
When the terminal 2 is fixed to the paste 1 by the fixing method explained in , the thermoplastic resin of the thick part 12 is attached to the groove 21 or the protrusion 22.
Figure 3 (A).

(B)に示す形状のものについては、端子2の抜止め構
造及びより良好な封止構造を得る上で効果的であり、第
3図(C) 、 (D)に示す形状のものについては、
端子2の抜止め構造及び回り止め構造を得る上で効果的
である。
The shape shown in (B) is effective in obtaining a structure to prevent the terminal 2 from coming out and a better sealing structure, and the shape shown in FIGS. 3(C) and (D) is ,
This is effective in obtaining a structure for preventing the terminal 2 from slipping out and a structure for preventing rotation.

上記の他に端子2の被固着部に適宜の形状の凹凸を設け
たり、あるいはローレット形状としたりしても同様の効
果が得られ、更に端子2自体が角柱形状であれば、それ
自体で回り止めの効果が得られる。
In addition to the above, the same effect can be obtained by providing an appropriate shape of unevenness or knurling on the fixed part of the terminal 2. Furthermore, if the terminal 2 itself has a prismatic shape, it can rotate by itself. Provides a stopping effect.

尚、上記突部22を設けた端子2に対しては、ペース1
の孔11の径寸法r1は突部22が内接し、端子2の軸
心を中心とする仮想円の径よりも若干大きく設定される
ことは言うまでもなく、この場合について前記端子2の
径寸法r2とは、上記仮想円の径寸法を言う。
Note that for the terminal 2 provided with the protrusion 22, the pace 1
Needless to say, the diameter r1 of the hole 11 is set to be slightly larger than the diameter of the virtual circle in which the protrusion 22 is inscribed and centered on the axis of the terminal 2. refers to the diameter dimension of the above-mentioned virtual circle.

上記した端子2の構造に於いて、突部22を設けたもの
に対して、第5図に示すように、ペース1の孔11を、
上記突部22の差し渡し径より若干大きな径を有する部
分11Aと、上記突部22の差し渡し径より若干小さく
、かつ端子2の径より若干大きな径を有する部分11B
との2段構造とすれば、当該孔11の構造と端子2の形
状との関係が端子2の埋設固定位置の位置決め手段とな
って好都合である。尚、第5図は2次成形加工処理前の
形状を示している。
In the structure of the terminal 2 described above, as shown in FIG. 5, the hole 11 of the paste 1 is
A portion 11A having a diameter slightly larger than the diameter across the projection 22, and a portion 11B having a diameter slightly smaller than the diameter across the projection 22 and slightly larger than the diameter of the terminal 2.
If the two-stage structure is adopted, the relationship between the structure of the hole 11 and the shape of the terminal 2 becomes a means for positioning the buried and fixed position of the terminal 2, which is convenient. Incidentally, FIG. 5 shows the shape before the secondary molding process.

また、本発明は、例えば中継端子のように、端子2がペ
ース1の表裏に貫通しない電子部品の製作に対しても実
施することができる。すなわち、第6図に示すように、
ペース1には表裏に貫通しない一面開口形状の孔11が
設けられておシ、ここに端子2を挿入して前記した2次
成形加工を施せばよい。この場合に於いても前記したよ
うに種(9) 種の回り止め構造、抜は止め構造を採ればより効果的で
ある。尚、第6図は2次成形加工後の形状を示している
Furthermore, the present invention can also be applied to the production of electronic components such as relay terminals in which the terminals 2 do not penetrate the front and back sides of the paste 1. That is, as shown in Figure 6,
The paste 1 is provided with a hole 11 having a non-penetrating opening on one side, and the terminal 2 may be inserted into the hole 11 to perform the above-mentioned secondary forming process. In this case as well, it is more effective if the seed (9) is provided with a structure that prevents the seed from rotating or being pulled out as described above. Incidentally, FIG. 6 shows the shape after the secondary molding process.

また、以上の実施例の説明では熱せられた成形型を使用
した場合について求めだが、成形型Fに超音波による振
動を与え、ペース1の材質自体の分子運動等による加熱
によって加工する所謂超音波加工によっても前記2次成
形加工が可能である。
In addition, in the above description of the embodiment, the results are obtained based on the case where a heated mold is used, but the so-called ultrasonic wave processing is performed by applying ultrasonic vibrations to the mold F and heating the material of PACE 1 itself due to molecular motion, etc. The above-mentioned secondary forming process is also possible by processing.

要はペース1の肉厚部12の部分成形(2次成形加工)
を経て端子2の封着を行う方法が本発明の要旨であり、
2次成形加工の手段及び端子形状、ペースの形状等の違
いが本発明の要旨を変更するものではない。
The key is to partially form the thick part 12 of Pace 1 (secondary forming process)
The gist of the present invention is a method of sealing the terminal 2 through
Differences in the means of secondary molding, the shape of the terminal, the shape of the paste, etc. do not change the gist of the present invention.

以上、詳細に説明したように本発明に係る固着方法によ
れば接着剤などの部材を使用することなく端子の封着を
行うことができるので端子の固着工程が単純化されるば
かシでなく、この方法によって接着剤に適さない樹脂に
端子を固着することも容易である等の効果が得られる。
As explained in detail above, according to the fixing method according to the present invention, terminals can be sealed without using materials such as adhesives, so the process of fixing terminals is not only simplified but also simple. This method provides the advantage that it is easy to fix the terminal to a resin that is not suitable for adhesives.

また、本発明によれば電子部品本体に接着剤等の混入が
ないた(10) め、特に電磁継電器等の機構的電子部品に対して本発明
は一層効果的である。
Further, according to the present invention, there is no mixing of adhesive or the like into the main body of the electronic component (10), so the present invention is particularly effective for mechanical electronic components such as electromagnetic relays.

以上の説明では、本発明を電磁継電器に実施した例を中
心に述べだが、熱可塑性樹脂のペースに端子を埋設固着
するものであればどのような電子部品に対しても本発明
を実施することができる。
In the above explanation, the present invention was mainly applied to an electromagnetic relay, but the present invention can be applied to any electronic component as long as the terminal is embedded and fixed in a thermoplastic resin paste. I can do it.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(4)、(B)は従来例を示す側面図及び底面図
、第2図〜第6図は本発明の詳細な説明する図であり、
第2図(A) 、 (B)は本発明を実施した電子部品
の側面図及び底面図、第3図(4)〜(D)は本発明に
よる加工方法を要部の断面図で示した図、第4図(A)
〜の)は種々の端子形状について本発明を駅間する要部
断面図、第5図及び第6図は他の実施例を説明する要部
断面図でおる。 1・・・ベース 11 (IIA、IIB)・・・端子挿入孔12・・・
肉厚部     2・・・端子21・・・溝     
  22・・・突部F・・・2次成形用成形型 で1・
・・成形用自みf2・・・側壁面 第1図 べ 第2図 (A)(δ) 第5図   第6図 (D) 第4図 (A)     (8) (c)     (o> 手続補正書 昭和弊年ケ月)2 事件との関係  出 願 人 4、代理人 住 所  東京都千代田区丸の内2丁目6番2号丸の内
へ重洲ビル330ム 戸二〜 7、補正の対象 明細1の発明の詳細な説明の欄 8、補正の内容   別紙のとおり 補    正    書 本願明細書中下記事項を補正いたします。 記 1、第3頁2行目に 「フラ・ツク塗付」とあるを 「フラックス塗付」と訂正する。 2、第3頁6〜7行目に 「フラ・ソクスの・・・・・付着から、」とあるを「フ
ラックスや溶剤の電磁継電器本体9、特に接点部への付
着から、」と訂正する。 3、第4頁13〜14行目に 「本発明を・・・・・実施例について」とあるを「本発
明の実施例を」と訂正する。 4、第5頁7行目に 「とい5゜)12は」とあるを [という。)、12は」と訂正する。 5、第8頁7行目及び10行目に 「第3図」とあるをそれぞれ 「第4図」と訂正する。 6、第5頁lO行目に 「側面図」とある全 「側壁面」と訂正する。
FIGS. 1(4) and 1(B) are a side view and a bottom view showing a conventional example, and FIGS. 2 to 6 are diagrams explaining the present invention in detail,
Figures 2 (A) and (B) are side and bottom views of an electronic component implementing the present invention, and Figures 3 (4) to (D) are cross-sectional views of essential parts of the processing method according to the present invention. Figure, Figure 4 (A)
Figures 5 and 6 are sectional views of essential parts for explaining other embodiments of the present invention with respect to various terminal shapes. 1...Base 11 (IIA, IIB)...Terminal insertion hole 12...
Thick part 2...Terminal 21...Groove
22...Protrusion F...Mold for secondary molding 1.
... Forming surface f2... Side wall surface Fig. 1 Fig. 2 (A) (δ) Fig. 5 Fig. 6 (D) Fig. 4 (A) (8) (c) (o> Procedure Amendment (Relationship to the case) Applicant 4, Agent Address 2-6-2 Marunouchi, Chiyoda-ku, Tokyo, 330m, Shigesu Building 2-7, Particulars subject to amendment 1 Column 8 of Detailed Description of the Invention, Contents of the Amendment As shown in the attached document, the following matters in the specification of the application will be amended. In the second line of page 1 and 3, the words ``Fla-tsuku coating'' have been corrected to ``Flux coating.'' 2. On page 3, lines 6 to 7, the phrase "from the adhesion of flux and sox" is corrected to "from the adhesion of flux and solvent to the electromagnetic relay body 9, especially the contact parts." . 3. On page 4, lines 13 and 14, the phrase "about the embodiments of the present invention" is corrected to read "the embodiments of the present invention." 4. On page 5, line 7, it says ``Toi 5゜) 12 is''. ), 12 is corrected. 5. On page 8, lines 7 and 10, the words ``Figure 3'' are corrected to ``Figure 4.'' 6. On page 5, line 10, the word "side view" is corrected to "side wall surface."

Claims (1)

【特許請求の範囲】 1 接続端子の固着部分に設けられ、かつ−上記接続端
子が挿入し得る径に設定された孔と、読札の周縁に設け
られ、かつ他の部分より厚く形成された肉厚部とを有す
るように、熱可塑性樹脂を成形してペースとし、該ペー
スの上記孔に接続端子を挿入したのち、上記肉厚部を上
記孔の径が縮少される方向に2次成形して上記接続端子
を上記ペースに固着するようにした接続端子の固着方法
。 2 孔がペースの表裏に貫通1〜でいる特許請求の範囲
第1項に記載の接続端子の固着方法。 3、孔がペースの一方の面に開口している特許請求の範
囲第1項に記載の接続端子の固着方法。 4、接続端子の被固着部を抜止め構造とした特許請求の
範囲第1項に記載の接続端子の固着方法。 5、 接続端子の被固着部を回り市め構造とした特許請
求の範囲第1項に記載の接続端子の固着方法。 6、接続端子の被固着部に突起体を形成し、孔を、接続
端子の上記突起体形成部分が挿入可能な部分と挿入不可
能な部分とで成る2段構造とした特許請求の範囲第1項
又は第2項に記載の接続端子の固着方法。 7.2次成形を、ペースが軟化溶融する程度に熱した成
形型により行うようにした特許請求の範囲第1項に記載
の接続端子の固着方法。 82次成形を、超音波成形型により行うようにした特許
請求の範囲第1項に記載の接続端子の固着方法。 9、接続端子が電磁継電器の外部接続端子である特許請
求の範囲第1項〜第8項のいずれかに記載の接続端子の
固着方法。
[Scope of Claims] 1. A hole provided in the fixed portion of the connecting terminal and set to a diameter that allows the connecting terminal to be inserted, and a hole provided in the peripheral edge of the reading tag and formed thicker than other portions. A thermoplastic resin is molded to form a paste so as to have a thick part, and a connecting terminal is inserted into the hole of the paste, and then the thick part is secondary molded in the direction in which the diameter of the hole is reduced. A method for fixing a connecting terminal by molding and fixing the connecting terminal to the paste. 2. The method for fixing a connecting terminal according to claim 1, wherein the holes penetrate through the front and back sides of the paste. 3. The method for fixing a connecting terminal according to claim 1, wherein the hole is opened on one side of the paste. 4. The method for fixing a connecting terminal according to claim 1, wherein the fixed part of the connecting terminal has a structure to prevent it from coming off. 5. The method for fixing a connecting terminal according to claim 1, wherein the part to be fixed of the connecting terminal has a rotating structure. 6. A protrusion is formed on the fixed portion of the connection terminal, and the hole has a two-stage structure consisting of a portion into which the protrusion formation portion of the connection terminal can be inserted and a portion into which it cannot be inserted. A method for fixing a connecting terminal according to item 1 or 2. 7. The method for fixing a connecting terminal according to claim 1, wherein the secondary molding is performed using a mold heated to an extent that the paste is softened and melted. 8. The method for fixing a connecting terminal according to claim 1, wherein the secondary molding is performed using an ultrasonic mold. 9. The method for fixing a connecting terminal according to any one of claims 1 to 8, wherein the connecting terminal is an external connecting terminal of an electromagnetic relay.
JP57105151A 1982-06-18 1982-06-18 Method of fixing connecting terminal Pending JPS58223227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57105151A JPS58223227A (en) 1982-06-18 1982-06-18 Method of fixing connecting terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57105151A JPS58223227A (en) 1982-06-18 1982-06-18 Method of fixing connecting terminal

Publications (1)

Publication Number Publication Date
JPS58223227A true JPS58223227A (en) 1983-12-24

Family

ID=14399713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57105151A Pending JPS58223227A (en) 1982-06-18 1982-06-18 Method of fixing connecting terminal

Country Status (1)

Country Link
JP (1) JPS58223227A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017135106A1 (en) * 2016-02-04 2017-08-10 株式会社東海理化電機製作所 Operation device and operation device control method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247227B2 (en) * 1972-12-04 1977-12-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247227B2 (en) * 1972-12-04 1977-12-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017135106A1 (en) * 2016-02-04 2017-08-10 株式会社東海理化電機製作所 Operation device and operation device control method

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