JPS5821832A - Apparatus for supplying semiconductor part - Google Patents
Apparatus for supplying semiconductor partInfo
- Publication number
- JPS5821832A JPS5821832A JP12013381A JP12013381A JPS5821832A JP S5821832 A JPS5821832 A JP S5821832A JP 12013381 A JP12013381 A JP 12013381A JP 12013381 A JP12013381 A JP 12013381A JP S5821832 A JPS5821832 A JP S5821832A
- Authority
- JP
- Japan
- Prior art keywords
- receiving portion
- stem
- parts
- rubber film
- stems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
この発明は、半導体装置の製造工程において、半導体装
置の部品を供給する半導体製造装量に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to semiconductor manufacturing equipment for supplying components of a semiconductor device in a semiconductor device manufacturing process.
半導体装１には、各種製造処理工程を経て半導体素子が
形成され、さらにこの半導体素子がパッケージングされ
てなる。このような半導体装置の製造工４！、尋におい
て、各製造工程に対応する部品を供給する装置が必゛皮
であり、特に半＝！ｉｔ体葉子を保護し、外部配）癖と
接続するためのワイヤポンディングを行う際のパッケー
ジング工程でに、信頼性の高い部品を確実に供給するこ
とが重要となる。従来このよう外部品を供給する装作は
、第１図に示すように通常日６榊造で金属からなる受皿
ｆ１ｔ′ｌＸ１ノを備え、この受皿部１１に７−１１９
品が設定される。ざらに、この受皿部１１に振動を与え
る振動部１２が設けられ、この振動部１２の振動と受皿
部１１の傾斜によって受皿部ＩＩ内の部品が１１１１次
受皿部１ノと接続されているダクト等からなる供給ライ
ンに送り出される。上記受皿部１１ば、通常階層構造の
連続するライン１３を有し、このライン１３に部品が設
４．ｆｌ、され、上記振動が与えられることによって部
品は上から下へと移動する。A semiconductor element is formed in the semiconductor device 1 through various manufacturing processes, and this semiconductor element is further packaged. Manufacturer 4 of such semiconductor devices! , it is essential to have equipment that supplies parts corresponding to each manufacturing process, especially for semi-finished products! It is important to ensure the supply of reliable components during the packaging process when performing wire bonding to protect the IT body and connect it to external components. Conventionally, as shown in FIG. 1, such a device for supplying external parts is usually equipped with a metal saucer f1t'lX1 made of 6-sakaki construction, and this saucer part 11 has a 7-119
item is set. Roughly speaking, a vibrating part 12 is provided which gives vibration to this saucer part 11, and the components in the saucer part II are connected to the 1111-order saucer part 1 by the vibration of this vibration part 12 and the inclination of the saucer part 11. It is sent out to a supply line consisting of etc. The saucer portion 11 has a continuous line 13 with a normal hierarchical structure, and parts are installed in this line 13. fl, and by applying the above vibration, the part moves from top to bottom.
このような供給装置によって１例えばバイポーラトラン
・ゾスタのノぐッケージング用ステムをパッケージング
工程に供給する場合、このステムが上記供給装置の受皿
部１１に設置され、振動部１２から振動が与えられるこ
とによって、上記工程の必要な位置に送シ出されるもの
である。ところで、このステムは、通常第２図に示すよ
うに放熱効果を有し、金属からなる基板２１からなり、
この基板２１にはトランジスタ等を固定させるマウント
部２２が備えられている。さらに外部配線と接続される
リード端子２３が設けられ、このリード端子２３と上記
マウント部２２のトランジスタ等とがデンディングワイ
ヤによって接続される。このときリード端子２３は、通
常基板２１に絶縁がラス２４を介して固定される。When using such a supply device to supply, for example, a bipolar trans-zosta stem for packaging to a packaging process, this stem is installed in the tray section 11 of the supply device and vibration is applied from the vibrating section 12. It is then delivered to the required position for the above process. By the way, this stem usually has a heat dissipation effect as shown in FIG. 2, and is made of a substrate 21 made of metal.
This substrate 21 is provided with a mount portion 22 for fixing transistors and the like. Further, a lead terminal 23 is provided to be connected to external wiring, and this lead terminal 23 and the transistor or the like of the mount section 22 are connected by a ending wire. At this time, the lead terminal 23 is usually fixed to the substrate 21 via the insulating lath 24.
このようなステムが上記供給装置に設置され、振動が与
えられる場合、ステムが供給装置の受皿部１１″！、た
は他のステムと衝突することによって、ステムの絶縁ガ
ラス２４の一部が微細粉の状態で分離し、受皿部１１内
に放置されることがある。この微細粉のガラスが摂動に
よってステムのマウント部２２才たけリード端子２３の
がンディング面に付着すると、トランジスタ等のマウン
ト甘たにワイヤ＋ｌ？ンディングの信頼性を著しく低下
させる障害が発生する。このよう々点をγ）Ｔ決するた
めに、従来供給装置ｅｔの受皿部１１の少なくともステ
ムが接触する部分に、例えば表面が柔らかく１弾力性の
あるネオグレンゴム膜（クロロプレンゴム）を設置、こ
のネオグレンゴム膜によってステムと受皿部の直接の衝
突を防止し、さらにステム間の衝突によって生じたガラ
スの微細粉を吸着させ、振動によって、ガラスの微細粉
がステムの上記デンディング面等に付着することを防ぎ
、上記のような障害を防止することが行なわれている。When such a stem is installed in the above-mentioned feeding device and vibration is applied, the stem collides with the saucer portion 11'' of the feeding device or with other stems, causing a portion of the insulating glass 24 of the stem to become fine. It may separate in powder form and be left in the saucer part 11.If this fine powder glass adheres to the mounting surface of the stem mount part 22 and the lead terminal 23 due to perturbation, it may cause damage to the mounting of transistors, etc. However, a failure occurs that significantly reduces the reliability of the wire + l? A soft and elastic neo-grain rubber membrane (chloroprene rubber) is installed, and this neo-grain rubber membrane prevents direct collision between the stem and the saucer, and also adsorbs fine glass powder caused by collision between the stems, and by vibration, Measures have been taken to prevent fine glass powder from adhering to the denting surface of the stem, thereby preventing the above-mentioned problems.
しかしながら、このネオプレンゴム膜は摩耗しやすいた
め、摩耗したゴムの微細粉がステムのマウント而または
リード端子のデンディング面に付着して、上記と同様に
マウントまたはワイヤがンディングの信頼性を低下させ
る欠点がある。However, this neoprene rubber membrane is prone to wear, and fine particles of worn rubber can adhere to the stem mount or lead terminal dending surface, reducing the reliability of the mount or wire termination as described above. There are drawbacks.
この発明は上記の事情を鑑みされたもので、半導体装置
の製造工程において、ステム等の部品にガラスおよびゴ
ム等の微細粉が付着することを目的とする。The present invention was developed in view of the above-mentioned circumstances, and an object of the present invention is to prevent fine powder of glass, rubber, etc. from adhering to parts such as stems in the manufacturing process of semiconductor devices.
以下図面を参照してこの発明の一実施例について説明す
る。第３図は、その構成を示すもので、前記第１図に示
すと同様に、円錐構造で金属からなる受皿部１１を備え
、この受皿部１１の少なくともステム等の部品が接触す
る部分に高耐摩耗性のゴム膜であるウレタンゴム膜３１
が設けられる。そして、この受皿部１１に振動を与える
ための振動部Ｉ２を備え、この振動と受皿部１１の傾斜
によって受皿部１１に設置されたステムが順次に受皿部
１１と接続されたダクト等からなる供給ラインに送シ出
される。An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 shows its configuration. Similar to the structure shown in FIG. Urethane rubber film 31 which is a wear-resistant rubber film
is provided. A vibrating part I2 is provided for applying vibration to the saucer part 11, and a stem installed in the saucer part 11 is sequentially connected to the saucer part 11 by the vibration and the inclination of the saucer part 11. It is sent to the line.
このような部品供給装歎において、ステムが受皿部１１
に設置され、この受皿部１１に振動部１２から振動が与
えられると、ステムが移動し始める。このとき、ステム
と接触する受皿部５−
１１の部分には、弾力性のあるウレタンゴム）１１°ｙ
３ノが設けられていることによって、ステムと受皿部１
ノが衝突して、ステムの第２図に示す絶縁がラス２４の
一部が微細粉となって分離することを防ぐことができる
。さらに、ステム間の衝突によって、ステムの絶縁がラ
ス２４の一部が微細粉となって分離した場合、このガラ
スの微細粉は、ウレタンゴム膜３１に付着して、ステム
のリード端子のワイヤボンディング面等にガラスの微、
ＩＩＢ粉が付着することを防ぐことができる。なお、こ
の場合、ウレタンゴム膜３１表面は１通常３時間または
４時間毎にアルコール系等の薬品を用いて、清浄され、
その時付層したガラスの微細粉を取り除く必砦がある。In such a parts supply device, the stem is connected to the tray portion 11.
When vibration is applied to this saucer part 11 from the vibrating part 12, the stem starts to move. At this time, the portion of the saucer portion 5-11 that comes into contact with the stem is covered with elastic urethane rubber) 11°y.
By providing 3 holes, the stem and saucer part 1
This can prevent part of the lath 24 from breaking into fine powder and separating the insulation shown in FIG. 2 of the stem due to the collision. Further, when the stem insulation is separated by a part of the lath 24 becoming fine powder due to a collision between the stems, this fine glass powder adheres to the urethane rubber film 31 and connects the wire bonding of the stem lead terminal. Fine glass on the surface, etc.
It is possible to prevent IIB powder from adhering. In this case, the surface of the urethane rubber film 31 is cleaned with a chemical such as alcohol every 3 or 4 hours.
At that time, it is necessary to remove the fine powder from the glass that has formed.
また、ウレタンゴム膜３１は、その表面が比較的硬く、
高耐摩耗性であるため、振動によって移動するステムと
接触しても摩耗して、ゴムの微細粉を生じることが非常
に少ない。従って、ステムの２・２図に示すマウント部
２２またはリード端子２３のボンディング面に、ゴム微
細粉が６一
付着して、ステムに設危されるトランジスタ等のマウン
ト貰たはワイヤボンディングのイ河頼性を低下させるこ
とを防止できる。Further, the surface of the urethane rubber film 31 is relatively hard,
Due to its high abrasion resistance, even when it comes into contact with a stem that moves due to vibration, it is very unlikely to wear out and produce fine rubber powder. Therefore, fine rubber powder may adhere to the bonding surface of the mount portion 22 or lead terminal 23 shown in Figures 2 and 2 of the stem, causing damage to the mount of transistors etc. placed on the stem or failure of wire bonding. This can prevent reliability from decreasing.
このようなウレタンゴム膜３１をイ］する部品供給装置
によって、半導体装置製造組立作業を行う際の半導体装
置の不良発生率を下記の表に示す。The following table shows the failure rate of semiconductor devices when manufacturing and assembling semiconductor devices using a component supplying device that supplies the urethane rubber film 31 as described above.
但し半導体装置の数量を５００個とした場合である。上
記表（１）から明らかな様に、受皿部１１にウレタンゴ
ム膜を設けた部品供給装置では、半導体装置の製造工程
において、マウントおよびがンディング不良率は０であ
υ、高信頼度の半導体装置を製造できる。力お、受皿部
１１にゴム張りなしの場合に、マウント不良率が０であ
るのは、マウント不良が主としてゴム膜の摩耗によるゴ
ムの微細粉がステムのマウント部に刺着するためである
９、従って、受皿部１１に他の摩耗しやすいネオルン、
シリコンおよびパイトン（商品名で真空装置等のパツキ
ン用ゴムに使用されている）などのゴム膜が設けられた
供給装・ｅｊでは、マウントの不良が発生しやすく、逆
に主としてステムのガラス微細粉がリード端子のポンデ
ィング面に付着して起きるデンディングの不良は比較的
少なくすることができる。However, this is a case where the number of semiconductor devices is 500 pieces. As is clear from Table (1) above, in the component supply device in which the urethane rubber film is provided on the saucer portion 11, the mounting and bonding defect rate is 0 in the semiconductor device manufacturing process, and the high reliability semiconductor We can manufacture devices. In addition, when the saucer part 11 is not covered with rubber, the mount failure rate is 0 because the mount failure is mainly due to fine rubber particles sticking to the stem mount part due to abrasion of the rubber film9. , Therefore, the saucer portion 11 contains other easily worn neon,
Supply devices/ejs equipped with rubber films such as silicone and PYTON (trade name used for packing rubber for vacuum equipment, etc.) are prone to mounting defects, and conversely, glass fine powder in the stem is likely to occur. Dending defects caused by adhering to the bonding surface of the lead terminal can be relatively reduced.
なお上記実施例において、受皿部１１に設けるゴム膜は
、ウレタンゴムに限ることなく、高耐摩耗性のゴムであ
れば他のものでもよい。In the above embodiment, the rubber film provided on the saucer portion 11 is not limited to urethane rubber, and may be any other rubber as long as it has high abrasion resistance.
以上詳述したように、この発明によれは半導体装置の製
造工程において、ステム等のＷＢ 品にガラスおよびゴ
ム等の微細粉が付着することを防止して、高信頼性の部
品を確実に供給できることによって、マウントおよびワ
イヤボンディングが確実になされる高信頼度の半導体装
置全製造できる。As detailed above, the present invention prevents fine powder such as glass and rubber from adhering to WB products such as stems in the manufacturing process of semiconductor devices, thereby ensuring the reliable supply of highly reliable components. By being able to do this, it is possible to manufacture highly reliable semiconductor devices in which mounting and wire bonding can be performed reliably.
′、）Ｖ
牙１図は従来の部品供給装置の概略的構成図、第２図は
ステムの概略的構成図、第３図はこの発明の一実施例に
係る部品供給ｇｉ；’ｔの概略的構成図である。
１１・・・受皿部、１２・・・振動部、２１・・・基板
、２２・・・マウント部、２３・・・リード端子、２４
・・・絶Ｅ＋ガラス、３１・・・ウレタンゴム膜。
出願人代理人 弁理士 鈴 江 武 彦９−
才１ 図
才２図',)V tusk 1 Figure 1 is a schematic diagram of a conventional component supply device, Figure 2 is a schematic diagram of a stem, and Figure 3 is a schematic diagram of a component supply device according to an embodiment of the present invention. It is a configuration diagram. DESCRIPTION OF SYMBOLS 11... Receiver part, 12... Vibration part, 21... Board, 22... Mount part, 23... Lead terminal, 24
...Zetsu E+glass, 31...Urethane rubber membrane. Applicant's agent Patent attorney Takehiko Suzue 9- years old 1st figure 2nd figure
Claims (2)
要な半導体装ｆ庁の部品を収納する受皿部と、この受皿
部から上記製造工程へ上記部品を供給するための振動を
発生する振動部とを具備し、上記受皿部の少なくとも上
記部品が接触する部分に高耐摩耗性を有するゴム膜が設
けられることを特徴とする半導体部品供給装置。(1) In the manufacturing process of semiconductor devices, a saucer part that stores the components of the semiconductor device necessary for each manufacturing process, and a vibrating part that generates vibrations for supplying the parts from the tray part to the manufacturing process. A semiconductor component supply device comprising: a rubber film having high abrasion resistance is provided on at least a portion of the saucer portion that contacts the component.
とする特許請求の範囲第１項記載の半導体部品供給装置
。(2) The semiconductor component supply device according to claim 1, wherein the rubber film is a urethane rubber film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12013381A JPS5821832A (en) | 1981-07-31 | 1981-07-31 | Apparatus for supplying semiconductor part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12013381A JPS5821832A (en) | 1981-07-31 | 1981-07-31 | Apparatus for supplying semiconductor part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5821832A true JPS5821832A (en) | 1983-02-08 |
Family
ID=14778780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12013381A Pending JPS5821832A (en) | 1981-07-31 | 1981-07-31 | Apparatus for supplying semiconductor part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0827432B2 (en) * | 1985-10-16 | 1996-03-21 | ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ | Wavelength selection element |
-
1981
- 1981-07-31 JP JP12013381A patent/JPS5821832A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0827432B2 (en) * | 1985-10-16 | 1996-03-21 | ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ | Wavelength selection element |
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