JPS58215874A - Fitting device for solid-state image pickup element - Google Patents
Fitting device for solid-state image pickup elementInfo
- Publication number
- JPS58215874A JPS58215874A JP57098648A JP9864882A JPS58215874A JP S58215874 A JPS58215874 A JP S58215874A JP 57098648 A JP57098648 A JP 57098648A JP 9864882 A JP9864882 A JP 9864882A JP S58215874 A JPS58215874 A JP S58215874A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- circuit board
- printed circuit
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/042—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by a proximal camera, e.g. a CCD camera
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surgery (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biophysics (AREA)
- Physics & Mathematics (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Optics & Photonics (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
この出願の発明は固体撮像素子の取付は装置に関し、と
くに固体撮像素子パッケージとプリント基板との取付は
構造又はこの取付は構造に基づく固体撮像素子構体のレ
ンズ鏡筒又はカメラ本体への取付は構造に関する。そし
てこの出願の発Ｅ！Ａｆ′ｉ簡単な構成で、取付は精度
を上げる手段を主要な特徴とする。DETAILED DESCRIPTION OF THE INVENTION The invention of this application relates to a device for mounting a solid-state image sensor, and particularly relates to a structure for mounting a solid-state image sensor package and a printed circuit board, or a lens barrel or a lens barrel of a solid-state image sensor structure based on the structure for mounting the solid-state image sensor package and a printed circuit board. Attachment to the camera body is related to structure. And the issuance of this application! Af'i has a simple structure, and the main feature is a means of increasing mounting accuracy.
背景技術について
プリント基板と接続されている固体撮像素子をレンズ鏡
筒又はカメラ本体に取り付ける手段として技術常識上次
の３糧の手段が考えられる。Background Art As a means of attaching a solid-state image sensor connected to a printed circuit board to a lens barrel or a camera body, the following three means can be considered based on common technical knowledge.
その第１は、固体撮像素子パッケージに設けた固体撮像
素子の位置決め手段を案内としてこのパッケージ自体を
固定し、とのパックー−／’に溶着されるプリント基板
はなんらの固定手段を用いずに自由にしておく構造であ
る。第１図はその一例″を示すもので、１は固体撮像素
子パッケージでセラミック等で形成される。２は固体撮
像素子であって、例えば電荷結合素子よりなる。The first is that the package itself is fixed using the positioning means of the solid-state image sensor provided in the package as a guide, and the printed circuit board welded to the package can be freely moved without using any fixing means. It is a structure that keeps it in place. FIG. 1 shows an example of the package, in which 1 is a solid-state imaging device package made of ceramic or the like. 2 is a solid-state imaging device, for example, a charge-coupled device.
３は素子２を保護する保護ガラス、４は一パッケージ１
に設けた穴部で素子２の位置決め手段をなしている。５
は固体撮像素子２のための入出力用リード端子、６はプ
リント基板、７はプリント基板６上の各種素子、８は突
出ビン、９はカメラ本体から位置規制を受けて取り付け
られている地板であり、突出ビン８は地板９より突出し
、穴部４に嵌合する。すなわちパッケージ１は穴部４を
案内として地板９に固定され、一方プリント基板６はパ
ッケージ１に溶着されるのみでその端部は自由端になっ
ている。この取付は構造は、プリント基板６自体及び同
基板に装着される素子７０重量によシ、機械的衝撃が加
わった場合などにパッケージｌとプリント基板６との溶
着部にすべての力がかかるため溶着はがれが起りやすく
信頼性の面で欠点がある。3 is a protective glass that protects the element 2, 4 is a package 1
A hole provided in the hole serves as a positioning means for the element 2. 5
1 is an input/output lead terminal for the solid-state image sensor 2, 6 is a printed circuit board, 7 is various elements on the printed circuit board 6, 8 is a protruding bottle, and 9 is a base plate attached with position control from the camera body. The protruding bottle 8 protrudes from the base plate 9 and fits into the hole 4. That is, the package 1 is fixed to the base plate 9 using the hole 4 as a guide, while the printed circuit board 6 is only welded to the package 1 and its ends are free ends. This mounting structure is due to the weight of the printed circuit board 6 itself and the elements 70 mounted on the board, and because all the force is applied to the welded part between the package l and the printed circuit board 6 when a mechanical shock is applied. There is a drawback in terms of reliability because welding tends to peel off easily.
第２の手段は、固体撮像素子パッケージ１とプリント基
板６との溶着精度を上げてプリント基板６をレンズ鏡筒
又はカメラ本体へ取り付け、固定する構造である。第２
図はその一例を示すもので、地板９より突出しているビ
ン１０とプリント基板６とがビス１１により固定されて
いる。この構造では固体撮像素子３の位置精度を保持で
きないので、第２図中１２で示すような調整機構により
調整する必要がある。The second means is a structure in which the printed circuit board 6 is attached and fixed to the lens barrel or the camera body by increasing the precision of welding the solid-state image sensor package 1 and the printed circuit board 6. Second
The figure shows an example, in which a bottle 10 protruding from a base plate 9 and a printed circuit board 6 are fixed with screws 11. Since this structure cannot maintain the positional accuracy of the solid-state image sensor 3, it is necessary to perform adjustment using an adjustment mechanism as shown at 12 in FIG.
第３の手段は、固体撮像素子パッケージ１け位置決め手
段により位置規制を行ない、さらにプリント基板６をも
固定する構造であって、例えば第２図において地板９と
パッケージ１とを、例えば第１図と同様に地板９に設け
た突出ビン８を穴部４に嵌合することにより、固定し、
位置決めを行なう構造がこれＫＭ当する。この取付は構
造ではパッケージ１とプリント基板６との双方を固定す
るので、熱の影響を受けた場合などに溶着部に応力が加
わり、溶着はがれが起りやすく、信頼性の而で難点があ
る。The third means is a structure in which the position of the solid-state image sensor package 1 is regulated by means for positioning the single solid-state image sensor package, and also fixes the printed circuit board 6. For example, the base plate 9 and the package 1 in FIG. Similarly, by fitting the protruding pin 8 provided on the main plate 9 into the hole 4, it is fixed,
The structure that performs positioning corresponds to KM. Since this mounting structure fixes both the package 1 and the printed circuit board 6, stress is applied to the welded part when it is affected by heat, and the welded part is likely to peel off, which poses a problem in terms of reliability.
この出願の発明の目的
こＯ出願の第１の発明は、上記の欠点を生ずることなく
、簡単な構成で、固体撮像素子の取付は精度を上げるこ
とができる取付は装置を提供することを目的とする。Purpose of the invention of this application The first invention of this application is to provide a mounting device that does not have the above-mentioned drawbacks, has a simple configuration, and can increase the accuracy of mounting a solid-state image sensor. shall be.
さらにこの出願の第１の発明は、固体撮像素子を使用す
るカメラの小型化、軽量化をはかり、信頼性の面でも安
定した取付は装置を提供することを目的とする。Furthermore, the first invention of this application aims to reduce the size and weight of a camera using a solid-state image pickup device, and to provide a device that can be mounted stably in terms of reliability.
また第２及び第３の発明は、上記の目的に加え、固体撮
像素子をレンズ鏡筒又はカメラ本体に取り付けるに当た
り、調整機構を用いることなく、精度高く取り付けるこ
とができる取付は装置を提供することを目的とする。In addition to the above-mentioned objects, the second and third inventions provide a mounting device that can mount a solid-state image sensor to a lens barrel or a camera body with high accuracy without using an adjustment mechanism. With the goal.
この出願の発明の構成
この出願の第１の発明は、固体撮像素子パッケージと；
この固体撮像素子パッケージに設けられた固体撮像素子
の位置決め手段（例えば穴部４）と；プリント基板と；
このプリント基板の面と固定関係にある板状部材（例え
ば金属板片１３）と蟇この板状部材に設けられ、かつ前
記固体撮像素子パッケージに設けられた位置決め手段と
共働する第１の位置規制手段（例えば突出ビン１４）と
ジを具える固体撮像素子の取付は装置を特徴とする。Structure of the invention of this application The first invention of this application includes a solid-state image sensor package;
Positioning means (for example, hole 4) for the solid-state image sensor provided in the solid-state image sensor package; a printed circuit board;
A plate-like member (for example, metal plate piece 13) fixed to the surface of the printed circuit board and a first position provided on the plate-like member and cooperating with positioning means provided on the solid-state image sensor package. The mounting of the solid-state imaging device is characterized by a restricting means (for example, a protruding bottle 14) and a mounting device.
また第２の発明は、上記の特徴に加え、レンズ＠筒又は
カメラ本体に設けられ、かつ前記の位置決め手段又は第
１の位置規制手段と共働して前記の固体撮像パッケージ
、プリント基板及び板状部材を含む構体を該レンズ鏡筒
又はカメラ本体に取り付ける手段（例えば地板９に設け
られた穴部１６）を特徴とする。In addition to the above-mentioned features, a second invention provides the solid-state imaging package, the printed circuit board, and the board, which are provided on the lens@tube or the camera body and cooperate with the positioning means or the first position regulating means. It is characterized by a means (for example, a hole 16 provided in the base plate 9) for attaching the structure including the shaped member to the lens barrel or the camera body.
さらに第３の発明は、上記第１の発明の特徴に加え、前
記板状部材に設けられた第２の位置規制手段（例えば穴
部１５）と、レンズ鏡筒又はカメラ本体に設けられ、か
つ前記第２の位置規制手段と共働して前記の固体撮像素
子パッケージ、プリント基板及び板状部材を含む構体を
該レンズ鏡筒又はカメラ本体に取り付ける手段（例えば
ビン１０）とを特徴とする。Furthermore, a third invention provides, in addition to the features of the first invention, a second position regulating means (for example, hole 15) provided in the plate member, and a second position regulating means provided in the lens barrel or the camera body, and The present invention is characterized by means (for example, a bin 10) for attaching the structure including the solid-state image sensor package, printed circuit board, and plate member to the lens barrel or camera body in cooperation with the second position regulating means.
上記において後記の実施例における図示の部材の引用は
なんらこの出願の発明の範囲を限定するものではなく、
この出願の発明は前記の特許請求の範囲の記載内におい
て適宜変更できるものである。とくに第１ないし第３の
発明における位置決め手段と第１の位置規制手段、第２
の発明における位置決め手段もしくは第１の位置規制手
段と前記構体をレンズ鏡筒もしくはカメラ本体に取り付
ける手段、又は、第３の発明における第２の位置規制手
段と前記構体をレンズ鏡筒もしくけカメラ本体に取り付
ける手段のように１共働関係にある２つの手段は、一方
がビン、他方がこのビンが嵌合する穴部である態様を可
とするが、これらは相対的な関係であって、２つの手段
のいずれにビンを設けてもよく、−またいずれに穴部を
設けてもよい。In the above, the reference to the illustrated members in the examples below does not limit the scope of the invention of this application in any way,
The invention of this application can be modified as appropriate within the scope of the claims set forth above. In particular, the positioning means, the first position regulating means, and the second position regulating means in the first to third inventions.
A means for attaching the positioning means or the first position regulating means and the structure to a lens barrel or a camera body in the invention, or a camera body in which the second position regulating means and the structure are also attached to the lens barrel in the third invention. Two means that are in a cooperating relationship, such as a means for attaching to a bottle, can be configured such that one is a bottle and the other is a hole into which the bottle fits, but these are relative relationships, Either of the two means may be provided with a bottle - and either may be provided with a hole.
以下第３図以降を参照してこの出願の発明を具体化した
具体例について説明する。下記の説明け、？４１の発明
の具体例及び＠２、第３の発明の具体例の順序で行なう
。A specific example embodying the invention of this application will be described below with reference to FIG. 3 and subsequent figures. Please explain the following? This will be carried out in the order of the 41st specific example of the invention and the 2nd and 3rd specific example of the invention.
第１の発明の具体例について（第３図、第４図）
第３図及び第４図はこの出願の第１及び第３の発明を具
体化した固体撮像素子の取付は装置を示し、前掲各図と
同一符号を付した部分は基本的に同一の構成及び作用を
有する。第３図及び第４図において、１３Ｖｉこの出願
の発明の特１
徴のひとつである板状部材の一例としての金属板片であ
って、プリント基板６に固着されている。なお板状部材
はプラスチック板片であってもよい。１４け突出ビンで
あって金属板片１３より突出し、固体撮像素子の位置規
制手段を形成する。すなわち突出ビン１４がこの出願の
発明における第１の位置規制手段の具体例である。Concerning specific examples of the first invention (Figs. 3 and 4) Figs. 3 and 4 show an apparatus for mounting a solid-state image sensor embodying the first and third inventions of this application, and the above-mentioned Parts given the same reference numerals as in each figure basically have the same configuration and function. 3 and 4, 13Vi is a metal plate piece as an example of a plate-like member, which is one of the features of the invention of this application, and is fixed to the printed circuit board 6. In FIG. Note that the plate member may be a plastic plate piece. There are 14 protruding bins that protrude from the metal plate piece 13 and form position regulating means for the solid-state image sensor. That is, the protruding bottle 14 is a specific example of the first position regulating means in the invention of this application.
１５は金属板片１３に形成された穴部で地板９より突出
しているビン１０と係合する。地板９はカメラ本体から
位置規制を受けてカメラ本体に取り付けられる。この構
成により突出ビン１４と穴部１５とは位置精度を高度に
保つことができる。そのためには、例えば金属板片１３
をプレス抜きする際に突出ビン１４の挿入孔と穴部１５
を同時に打ち抜けばよい。そして突出ビン１４を上記の
挿入孔に挿入し、さらにこの突出ビン１４に固体撮像素
子パッケージ１の穴部４を挿入して取り付け、パッケー
ジ１のリード端子５とプリント基板６とを溶着する。こ
のようにすれば、固体撮像素子３と金属板片１３の穴部
１５との関係がきわめて精度の高い状態で、パッケージ
１が取り付けられ、かつリード端子５とプリント基板６
との溶着部は機械的衝撃又は熱の影響による応力を受け
ることなく安定に溶着されている。Numeral 15 is a hole formed in the metal plate piece 13 and engages with the bottle 10 protruding from the base plate 9. The base plate 9 is attached to the camera body under position control from the camera body. With this configuration, the positional accuracy of the protruding bottle 14 and the hole 15 can be maintained at a high level. For this purpose, for example, the metal plate piece 13
The insertion hole of the protruding bottle 14 and the hole part 15 are
All you have to do is punch through them at the same time. Then, the protruding pin 14 is inserted into the insertion hole, and the hole 4 of the solid-state image sensor package 1 is inserted into the protruding pin 14 to attach it, and the lead terminals 5 of the package 1 and the printed circuit board 6 are welded. In this way, the package 1 is attached with the relationship between the solid-state image sensor 3 and the hole 15 of the metal plate piece 13 being extremely accurate, and the lead terminal 5 and the printed circuit board 6 are
The welded portions with the welded parts are stably welded without being subjected to stress due to mechanical shock or thermal effects.
第２及び第３の発明の具体例について（第３図〜第５図
）
上記のように固体撮像素子パッケージ１とプリント基板
６とが安定に溶着されるので、次の課題はカメラ本体へ
の取付けを精度よく行なうで゛
こと釈あるが、第２の発明によれば、第５図に示すよう
に、突出ビン１４を延長して、カメラ本体から位置規制
を受けて取り付けられている地板９に設けた穴部１６に
嵌合させている。また第３の発明によれば、前記第２の
位置規制手段の一例である穴部１５に、地板９より突出
しているビン１０を挿入し、ビス１１によって固定して
いる。いずれの場合もなんら調整機構を介さずに固体撮
像素子パッケージ１、プリント基板６及び金属板片１３
を含む構体をカメラ本体に精度高く取り付けることがで
きる。Concerning specific examples of the second and third inventions (Figs. 3 to 5) Since the solid-state image sensor package 1 and the printed circuit board 6 are stably welded as described above, the next problem is to attach them to the camera body. Although it is possible to perform the mounting with high precision, according to the second invention, as shown in FIG. It is fitted into a hole 16 provided in. According to the third aspect of the invention, a bottle 10 protruding from the base plate 9 is inserted into the hole 15, which is an example of the second position regulating means, and is fixed with a screw 11. In either case, the solid-state image sensor package 1, printed circuit board 6, and metal plate piece 13 are assembled without any adjustment mechanism.
can be attached to the camera body with high precision.
上記の具体例においてビンと穴部とを設ける部材を前記
と逆にしても（例えば第４図においてパッケージ１にビ
ン１４を設け、金属板片１３に穴部４を設ける。）、同
等の効果を奏するものであり、また上記の説明はカメラ
本体に固体撮像素子を取り付ける場合について行なった
が、レンズ鏡筒側に玉同様な手段により取り付けるこ、
とができる。なお固体撮像素子２０面をレンズ光軸に対
して垂直に保ちいわゆる光軸倒れを少なくするためには
、例えば第４図においてビン１０及び穴部１５をそれぞ
れ３個以上設け、ビン１０の金属板片１３に相対する端
面で形成せられる平面がレンズ光軸に対して十分垂直と
なるよ−う各端面を加工すればよい。Even if the members providing the bottle and the hole in the above specific example are reversed (for example, in FIG. 4, the package 1 is provided with the bottle 14, and the metal plate piece 13 is provided with the hole 4), the same effect can be obtained. Although the above explanation was made regarding the case where the solid-state image sensor is attached to the camera body, it is also possible to attach it to the lens barrel side using the same means as a ball.
I can do that. In order to keep the surface of the solid-state image sensor 20 perpendicular to the lens optical axis and to reduce so-called optical axis inclination, for example, as shown in FIG. Each end face may be processed so that the plane formed by the end face facing the piece 13 is sufficiently perpendicular to the optical axis of the lens.
この出願の発明の効果
この出願の第１の発明は、上記の構成及び作用を有する
ので、固体撮像素子の位置精度を高く保持することがで
き、かつそのリード端子とプリント基板との溶着部が機
械的衝撃又は熱の影響による応力が加わることたく安定
した状態に保持される。そしてこれにより固体撮像素子
を使用するカメラの小型化及び軽量化をはかり、信頼性
を向上させることができる。Effects of the invention of this application The first invention of this application has the above-described configuration and operation, so that the positional accuracy of the solid-state image sensor can be maintained at a high level, and the welded portion between the lead terminal and the printed circuit board can be maintained at a high level. It is maintained in a stable state without stress due to mechanical shock or thermal effects. As a result, a camera using a solid-state image sensor can be made smaller and lighter, and its reliability can be improved.
また第２及び第３の発明は、上記第１の発明を基礎とし
て、固体撮像素子をレンズ鏡筒又はカメラ本体に対しな
んら調整機構を介さずに取り付けることができる。Further, the second and third inventions are based on the first invention, and allow the solid-state imaging device to be attached to the lens barrel or the camera body without using any adjustment mechanism.
第１図及び第２図はこの出願の発明と比較対照すべき固
体撮像素子の取付は装置の側面図、装置の分解斜視図、
第５図はこの出願の発明を具体化した固体撮像素子の取
付は装置の他の具体例の側面図である。
図中１は固体撮像素子のパッケージ、２は固体撮像素子
、４はパッケージ１に設けた穴部、５は入出力リード端
子、６はプリント基板、９は地板、１０は地板９に設け
たビン、１３は金属板片、１４は突出ピン、１５は金属
板片１３に設けた穴部、１６は地板９に設けた穴部であ
る。FIGS. 1 and 2 show a side view of the device, an exploded perspective view of the device, and a side view of the device, an exploded perspective view of the device,
FIG. 5 is a side view of another specific example of a device for mounting a solid-state image sensor embodying the invention of this application. In the figure, 1 is the package of the solid-state image sensor, 2 is the solid-state image sensor, 4 is the hole provided in the package 1, 5 is the input/output lead terminal, 6 is the printed circuit board, 9 is the base plate, and 10 is the bottle provided on the base plate 9. , 13 is a metal plate piece, 14 is a protruding pin, 15 is a hole provided in the metal plate piece 13, and 16 is a hole provided in the base plate 9.
Claims (3)
子パッケージに設けられた固体撮像素子の位置決め手段
と、 プリント基板と、 このプリント基板の面と固定関係にある板状部材と、 この板状部材に設けられ、かつ前記固体撮像素子パッケ
ージに設けられた位置決め手段と共働する第１の位置規
制手段と、 を具える固体撮像素子の取付は装置。(1) A solid-state image sensor package, a positioning means for the solid-state image sensor provided in the solid-state image sensor package, a printed circuit board, a plate-like member fixed to the surface of the printed circuit board, and a plate-like member fixed to the surface of the printed circuit board. A solid-state imaging device mounting apparatus comprising: a first position regulating means provided and cooperating with a positioning means provided on the solid-state imaging device package.
の位置決め手段と、 プリント基板と、 このプリント基板の面と固定関係にある板状部材と、 この板状部材に設けられ、かつ前記固体撮像素子パッケ
ージに設けられた位置決め手段と共働する第１の位置規
制１手段と、 レーンズ鏡筒又はカメラ本体に設けられ、かつ前記の位
置決め手段又は第１の位置規制手段と共働して前記の固
体撮像素子パッケージ、プリント基板及び板状部材を含
む構体を該レンズ傭筒又はカメラ本体に取り付ける手段
と、を具える固体撮像素子の取付は装置。(2) a solid-state image sensor package; a positioning means for the solid-state image sensor provided in the solid-state image sensor package; a printed circuit board; a plate-like member fixed to the surface of the printed circuit board; a first position regulating means provided and cooperating with the positioning means provided on the solid-state image pickup device package; and a first position regulating means provided on the Lanes lens barrel or the camera body and said positioning means or first position regulating means. and a means for attaching a structure including the solid-state image sensor package, a printed circuit board, and a plate member to the lens barrel or camera body in cooperation with the solid-state image sensor package.
の位置決め手段と、 プリント基板と、 このプリント基板の面と固定関係にある板状部材と、 この板状部材に設けられ、かつ前記固体撮像素子パッケ
ージに設けられた位置決め手段と共働する第１の位置規
制手段と、 この板状部材に設けられた第２の位置規制手段と、 レンズ鏡筒又はカメラ本体に設けられ、かつ前記第２の
位置規制手段と共働して前記の固体撮像素子パッケージ
、プリント基板及び板状部材を含む構体を該レンズ鏡筒
又はカメラ本体に取り付ける手段と、 を具える固体撮像素子−の取付は装置。(3) A solid-state image sensor package, a positioning means for the solid-state image sensor provided in the solid-state image sensor package, a printed circuit board, a plate-like member fixed to the surface of the printed circuit board, and a plate-like member fixed to the surface of the printed circuit board. a first position regulating means provided on the solid-state image sensor package and cooperating with the positioning means provided on the solid-state image pickup device package; a second position regulating means provided on the plate-like member; and a second position regulating means provided on the lens barrel or the camera body. a means for attaching a structure including the solid-state image sensor package, a printed circuit board, and a plate-like member to the lens barrel or camera body in cooperation with the second position regulating means; The device is attached to the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57098648A JPS58215874A (en) | 1982-06-09 | 1982-06-09 | Fitting device for solid-state image pickup element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57098648A JPS58215874A (en) | 1982-06-09 | 1982-06-09 | Fitting device for solid-state image pickup element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215874A true JPS58215874A (en) | 1983-12-15 |
| JPH0465587B2 JPH0465587B2 (en) | 1992-10-20 |
Family
ID=14225316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57098648A Granted JPS58215874A (en) | 1982-06-09 | 1982-06-09 | Fitting device for solid-state image pickup element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58215874A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60144256U (en) * | 1984-03-05 | 1985-09-25 | キヤノン株式会社 | Image sensor structure |
| FR2599921A1 (en) * | 1986-06-06 | 1987-12-11 | Thomson Csf | RELATIVE POSITIONING SYSTEM OF SEVERAL MATRIX SOLID SENSORS EQUIPPED WITH A CAMERA |
| FR2602623A1 (en) * | 1986-08-08 | 1988-02-12 | Thomson Csf | System for locking by sealing the relative positioning of the matrix CTD sensors fitted to a camera |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5151217A (en) * | 1974-10-30 | 1976-05-06 | Matsushita Electric Ind Co Ltd | |
| JPS53143516U (en) * | 1977-04-18 | 1978-11-13 | ||
| JPS574657A (en) * | 1980-06-11 | 1982-01-11 | Hitachi Ltd | Position control and attachment of solid state scanning element |
-
1982
- 1982-06-09 JP JP57098648A patent/JPS58215874A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5151217A (en) * | 1974-10-30 | 1976-05-06 | Matsushita Electric Ind Co Ltd | |
| JPS53143516U (en) * | 1977-04-18 | 1978-11-13 | ||
| JPS574657A (en) * | 1980-06-11 | 1982-01-11 | Hitachi Ltd | Position control and attachment of solid state scanning element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60144256U (en) * | 1984-03-05 | 1985-09-25 | キヤノン株式会社 | Image sensor structure |
| FR2599921A1 (en) * | 1986-06-06 | 1987-12-11 | Thomson Csf | RELATIVE POSITIONING SYSTEM OF SEVERAL MATRIX SOLID SENSORS EQUIPPED WITH A CAMERA |
| FR2602623A1 (en) * | 1986-08-08 | 1988-02-12 | Thomson Csf | System for locking by sealing the relative positioning of the matrix CTD sensors fitted to a camera |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465587B2 (en) | 1992-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10353216B2 (en) | Optical unit with shake correction function and its manufacturing method | |
| US4859847A (en) | Photo detector adjustment device | |
| US6351288B1 (en) | Sensor tilt control for a digital camera | |
| US5640207A (en) | Camera for high-speed imaging | |
| JPS58215874A (en) | Fitting device for solid-state image pickup element | |
| JPS61118707A (en) | Solid-state image pickup device | |
| US6308010B1 (en) | Wiring structure of an image stabilizer | |
| JP4194449B2 (en) | Solid-state image sensor holding structure | |
| JPS60130413U (en) | Camera light receiving element position adjustment device | |
| US5033844A (en) | Camera employing automatic focusing unit | |
| JPH04167232A (en) | Photodetector device | |
| JPS57152767A (en) | Picture reader | |
| US20230224589A1 (en) | Optical unit with shake correction function | |
| JPS58210764A (en) | Fitting device for solid-state image pickup element supporting body | |
| JP2004053305A (en) | Optical distance measuring apparatus | |
| JPS62128265A (en) | Mounting method for image sensor | |
| JPH03259691A (en) | Solid-state image pickup element | |
| JPH0721004Y2 (en) | Solid-state image sensor mounting mechanism | |
| JPH0744128Y2 (en) | Linear sensor mounting device | |
| JPS61245773A (en) | Video camera | |
| US6567616B2 (en) | Temporary retaining structure for light projecting or receiving devices of AF apparatuses | |
| JPH04367806A (en) | Optical sensor head | |
| JPS6120466A (en) | Picture reading device | |
| JPH02154211A (en) | Semiconductor laser holding device | |
| JPH0862480A (en) | Lens assembling structure of range finder and lens position adjusting method |