JPS5821193Y2 - Diagonal wiring printed circuit board - Google Patents

Description

[Detailed description of the invention] The present invention is a diagonal wiring pattern, more specifically, a meandering diagonal wiring pattern that has through holes on XY orthogonal lattice points and has different oblique angles in the X and Y directions. The present invention relates to a printed circuit board having:

In addition, a through-hole land with a wide tolerance for dimensional accuracy and suitable for high-density wiring is realized.

Previously, the inventors of the present invention have proposed a diagonal wiring pattern in which the diagonal angles in the X and Y directions are different, as shown in FIG. 1 (Japanese Patent Application No. 53103453).

That is, through holes H1□, H1 on the XY orthogonal grid points
2, H13...H21, H22, H23...
... are arranged, and the wiring pattern P1. P2
．． P3. P4...... has only one diagonal movement between adjacent lattice points arranged in the X direction (for example, between through holes H1□ and HI3), but between lattice points arranged in the Y direction (for example, between through holes H1 □ and H2□) has a regularity in which two lines run diagonally.

In other words, each pattern advances by one lattice interval in the Y direction, while it traverses diagonally at a rate of two lattice intervals in the X direction.

Of course, the portion PX of each wiring pattern running between the grid points in the X direction
...They have the same inclination angle and are parallel to each other.

The portions Py running between the grid points in the Y direction also have the same inclination angle and are parallel to each other.

Therefore, naturally, a portion Px, which runs between the grid points in the X direction of each wiring pattern, and a portion Py, which runs between the grid points in the Y direction,...
. . . differs from the normal 45° skew pattern in that the skew angle is different.

According to a wiring pattern having such regularity, it is easier to increase the wiring density compared to a conventional XY orthogonal pattern or a 45° diagonal pattern.

However, with such an asymmetrical diagonal turn, a sufficient distance between each adjacent pattern can be secured as an effect of high density, but the distance d between each through-hole land L and its adjacent pattern is It is said that there is not enough
A new problem has appeared.

As is clear from FIG. 2, this problem becomes more noticeable as the number of patterns passing between grid points in the Y direction increases to 3 or 4 or more.

Of course, if the diameter of the through hole or land is made smaller, the distance d
Although it is possible to increase
This appears as a problem of land misalignment between each layer.

The present invention eliminates these problems and proposes a through-hole land with a large area that can ensure sufficient spacing between each through-hole land and the wiring pattern adjacent to it.
The purpose is to realize asymmetric diagonal wiring with excellent wiring efficiency.

In order to achieve this objective distantly, in the present invention, one diagonal wiring pattern runs between grid points arranged in the X direction,
In a printed circuit board having a diagonal wiring pattern in which each wiring pattern meanders avoiding each lattice point with a regularity such that two or more diagonal wiring patterns pass between the lattice points arranged in the Y direction, the through-hole land is It is formed to have an outer edge along at least one of a pattern portion passing between lattice points arranged in the X direction on both sides of a bending point of the wiring pattern and a pattern portion passing between lattice points arranged in the Y direction.

FIG. 3 is a plan view of a printed circuit board showing an embodiment of the present invention, and the oblique angle of the wiring pattern corresponds to that in FIG.
It moves by one lattice interval in the X direction, whereas it moves by two lattice intervals in the X direction.

In this figure, two adjacent wiring patterns P2. P
The land shape will be explained based on the through-hole land L1 sandwiched between the three holes.

C2 and C3 are wiring patterns P2. P3 is the bending point of the surface wiring pattern P2. The portion surrounded by both side portions P2X and P2Y of the bending points C2 and C3 of P3 and P ax and P3y is shaped like a parallelogram.

The outer edge shape of the land is such that portions L2XL3x adjacent to the X-direction inter-lattice point portions P2X and P3X of the wiring pattern are parallel to the corresponding portions P2X and P3X of the wiring pattern, respectively.

In addition, the Y-direction inter-lattice point portions P2y, P3y of the wiring pattern
A portion L2y adjacent to .

L3y are the corresponding portions P2y and P3y of the wiring pattern, respectively.
They are parallel to each other.

Then, the distance d between each corresponding part of the wiring pattern and the land is:
The dimensions are such that the minimum gap necessary to maintain insulation between the wiring pattern and the land is ensured.

This land shape is the wiring pattern part P that surrounds it.
2X.

A parallelogram similar to a certain shape of P 2Yz P 3x + P 3y is used, but the points e and e' shown by chain lines are as follows.
Since it is not necessary, only the dimensions n and n' necessary for the land are left and the other parts are cut out.

According to such a polygonal land L1, the effective area as a land becomes larger by the area of the corners 1 to 6 outside the circle, compared to the general circular land l shown by the chain line.

Therefore, compared to a circular land, it is easier to absorb dimensional errors caused by drill misalignment during drilling.

However, wiring pattern P2. The gap between P3 and P3 is also ensured to have sufficient dimensions necessary for insulation.

The lemon-shaped land L2 in FIG. 3 is a modified example of the polygonal land L1, and the corners 2, 3, and 5.6 of the polygonal land L1 are cut off to give roundness and the sharpest corner. It is formed into an almost lemon shape, leaving only parts 1 and 4.

In this case as well, since the sharpest corners 1 and 4 remain, the effect of expanding the land area is quite large, and since the surface is rounded as a whole, it is easy to form the land by etching. Become.

This lemon-shaped land L2 also has portions L3yjL4y along the Y-direction interlattice point portions P3y and P4y of the wiring pattern, and is basically based on the same idea as the polygonal land L1.

By the way, there is no particular problem in areas where the wiring pattern is not drawn out from the polygonal land L1 or the lemon-shaped land L2, but if the connection between the wiring pattern P1 and the land L3 is made at the position shown by the broken line t1, for example, the etching of the pattern may occur. Problems arise in formation.

That is, the lead-out pattern indicated by the broken line t1 is based on the common knowledge that the lead-out patterns are connected toward the center of the land (the center of the through hole), but according to this, the apex 1' of the land and the lead-out pattern t1 are connected. An acute-angled depression 7 is formed between them.

If such an acute-angled recess exists, the pattern becomes constricted, or in some cases, the pattern is interrupted, making it difficult to etch as expected, and is considered undesirable in terms of pattern design.

The present invention solves the problem of acute recesses caused by the use of polygonal lands or lemon-shaped lands as follows.

That is, when connecting the land L3 to the wiring pattern P1, the lead pattern is arranged so that the apex 1' of the land is included within the width of the lead pattern T1, as shown by the solid line T1.

This eliminates the etching problem since sharp depressions are not formed between the land and the lead-out pattern.

In this case, the pullout pattern T□ is shifted in position to include the apex 1' of the land, so that it is connected toward a position away from the center of the land, unlike in the past, but this causes particular problems. There is no risk that this will occur.

Another drawer pattern T2 indicated by a chain line. T3 is also an example in which the apex 1' is placed within the pattern width as described above.

Pattern T4 includes adjacent lands L4. In a layer with no pattern passing between adjacent lands L4.L5. L5
In this case, the land vertex closest to pattern T4 is vertex 6 on the left land L4 and vertex 3 on the right land L5, so these vertices 6, 3 The pattern T4 has lands L4 . It is formed offset from the center of L5.

In the case of a hexagonal land, there are six vertices where there is a risk of forming an acute recess with the drawer pattern.
In the case of the lemon-shaped land L2, there are only two locations, but in this case as well, formation of an acute-angled depression can be prevented in the same manner as in the case of the hexagonal land.

As mentioned above, each wiring pattern P,, P2... is designed to meander, avoiding grid points, with one wire between the grid points in the X direction and multiple wires between the grid points in the Y direction. However, depending on the layer of the printed circuit board, or depending on the wiring position even within the same layer, even if the wiring is straight without meandering, it may not overlap with the land.

In such a case, it is best to route the wires in a straight line so as to take the shortest route.

In that case, the oblique angle of the pattern is for each pattern Pi, P
2..., in other words, in the case of pattern P1, one cycle of meandering (for example, bending points C1 and C
This is the angle of the line 8 connecting the sections (between I2).

Therefore, if a straight line pattern runs in the direction of line 8, the outer sides L1x and L1y of land L6 adjacent to it
is not parallel to the straight line pattern.

In such a case, the outer edge LIX close to the straight line pattern
. It can also take up a large area.

In other words, the linear outer edge of any one of the lands is aligned with the linear pattern, and the lemon-shaped land L
It also applies to case 2.

As described above, according to the present invention, the land shape is made into a polygon or a lemon shape based on the polygon, and the area adjacent to the meandering pattern at the outer edge of the land is made to follow the meandering pattern. It is possible to secure a sufficient insulation distance between wiring patterns, and to realize a wide land that can sufficiently accommodate positional deviations during through-hole drilling.

Therefore, by applying the present invention, it becomes easy to put into practical use a printed circuit board with an asymmetric meandering pattern as shown in FIGS. 1 and 2.

[Brief explanation of the drawing]

Figures 1 and 2 are diagrams showing the meandering wiring pattern of a printed circuit board previously proposed by the inventors of the present invention, and Figure 3 is a through-hole land shape according to the present invention applied to the meandering wiring printed circuit board. It is a figure which illustrates various examples. In the figure, Pl, P2...... are meandering wiring patterns, C2, C3, C1□, C1□ are bending points, L, L
2... is through hole land, LIX, L
1y, L2X, L2y, L3X, L3y, L
4/ is a side along the adjacent wiring pattern of the land, and 7 is an acute recess.

Claims (2)

[Scope of utility model registration request] (1) Through holes are provided on xy orthogonal lattice points, and one diagonal wiring pattern passes between the lattice points arranged in the X direction, whereas multiple diagonal wiring patterns pass between the lattice points arranged in the Y direction. In a printed circuit board that has a diagonal wiring pattern in which each wiring pattern meanders around each grid point based on the regularity that the wiring pattern passes through, the pattern is moved from between grid points arranged in the X direction to between grid points arranged in the Y direction. The wiring pattern is bent at a position where the passing direction of the wiring pattern changes, and the through-hole land is formed by a pattern passing between the lattice points arranged in the X direction of the wiring pattern and a pattern passing between the lattice points arranged in the non-Y direction. A diagonal wiring printed circuit board, characterized in that it is formed to have an outer edge along at least one side. (2) At the connection between the through-hole land and the diagonal wiring pattern, at least one vertex of the through-hole land is included within the width of the connection pattern, and the angle between the outline of the land and the pattern is not acute. A diagonally wired printed circuit board according to claim (1) of the utility model registration, characterized in that the printed circuit board is formed as follows.