JPS58209294A - Transducer - Google Patents

Abstract

PURPOSE:To make a transducer extremely smaller and thinner in size, by housing an impedance conversion element in a housing part provided for a insulation base board which constitutes the transducer. CONSTITUTION:A fixed electrode 3 consisting of an electrode 1 and a high polymer dielectric layer 2, and a supporting ring 17, which surrounds the fixed electrode 3 with a specified intervals, are formed on the upper surface of an insulation base board 16. At the end of the ring 17, an oscillating film 6 composed of an insulation film 18 and conductive film 19 is stretched by putting a specified distance from the electrode 3. On the lower surface of the base board 16, an earth electrode 21 and output electrode 20 to be connected to an impedance conversion element 8 housed in a housing hole 23 of the base board 16 are formed. Since the impedance conversion element is housed by using the thickness of the insulation board 16, it can be made to be smaller in size.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a transducer suitable for electronic microphones and the like.

[Technical background of the invention] A transdicoli, for example, an electret type microphone, as shown in FIG. The configured fixed electrode 3 is supported on the upper opening of a cylindrical base 4, and a membrane ring 7 on which a vibrating membrane 6 is stretched is stacked on the upper edge of this base 4 via a spacer ring 5). , the human lead 9 of the impedance conversion element 8 housed in the cylindrical base 4 is brought into contact with the lower surface of the electrode 1; : Connect the output lead 10 of A to the circuit pattern 12 of the Norint board 11 based on the + side opening of the cylindrical base 4. The ring 5 and the cylindrical base 4 are covered with t! (“I bent the m'lli on the bottom of the 4 units 4” (-・C).

Reference numerals 14 and 15 indicate an external output terminal J implanted in the pudding l-M board 11 and a sound hole provided in the case 134Z. ``This electret type'' Nden 1] Nichrophone is,
The sound signal is transmitted through a capacitance change according to a change in the distance between the fixed electrode 3 and the vibrating membrane 6, and the impedance NJ? The data is then output to the outside.

[Problems with the Background Art] However, the conventional T-leftlet type microphone configured as described above requires a tube to house the impedance conversion element 8 between the fixed electrode 3 and the printed circuit board 11. Since the shape base 4 is required, there is a drawback that the shape inevitably becomes large.

In addition, in addition to the fixed electrode 3 and the membrane ring 7, many other components such as the spacer ring 5, the base 4, and the printed M base 11 are stacked together, and the case 13 is further placed on the stack to integrate the components. As the number of components increases, the dimensional accuracy of each component tends to vary, and the airtightness between component parts becomes insufficient, resulting in uneven characteristics.The assembly process also requires careful attention, making the work complicated. It was not suitable for making sake.

[Object of the Invention] The present invention has been made to eliminate such drawbacks, and is directed to a transformer incorporating an impedance conversion element.
Accordingly, the object of the present invention is to provide an inexpensive transformer which is extremely small in size, simple in structure, and suitable for commercial production.

[Summary of the Invention] In order to achieve this object, the present invention forms an electrode on a biased insulating substrate, and a vibrating membrane is mounted on the front surface of the electrode at a constant interval of I force. The input terminal of the impedance conversion element 1-1 is electrically connected to the electrode of LJ and t, and the impedance conversion element 1-1 is electrically connected to the electrode of 2; iu fJ is stored in the storage section p)
~'/Insulation that makes up Susujiusa! 4 board J'j d
) and then transform the impedance into this insulating substrate.
By accommodating the transducer J-+j (1) 47, it is possible to reduce the size of the transducer, especially its thinness, and the direction of collapse.4. (1)
[Embodiments of the Invention] The details of the present invention will now be explained with reference to the drawings.

Note that the parts common to the conventional example are ←2(, 1 and 1).

FIGS. 3 and 4 are a vertical cross-sectional view and a bottom view, respectively, showing one embodiment of the sensor of the present invention, using an electret type 1 to type 1-type microphone as an example.

In the figure, the insulating substrate 16 has a flat, same-root shape, and an electrode 1 having a smaller diameter than the insulating substrate 16 is formed in the center of one main surface (in the figure).

A fixed electrode 3 is formed by depositing an electret polymer M electric layer 2 on the upper surface of the electrode 1 .

A conductive support ring 17 is formed at one edge of the -1 end of the insulating base &16 to surround the fixed mold &3'' at a predetermined interval.This support ring 17 is made of the same material as the electrode 1. At the outer end, a vibrating membrane 6 is formed by forming a conductive thin film 19 on the lower surface of an insulating film 18 by vaporization or the like.
9 is brought into contact with the support ring 17, and the fixed mold 8A3
They are strung up in front of each other at predetermined intervals.

Note that the support ring 17 is thicker than the fixed electrode 3 and functions as a support layer for the vibrating membrane 6 and a spar 11 ring.

An output electrode 20 is formed on the other main surface (lower surface in the figure) of the insulating substrate 16, and an electrically insulated ground conductor 44i21 is formed so as to surround the output electrode 20. The support ring 17 and the ground electrode 21 are connected to a connecting lead 22.

A storage hole 23 is formed in the insulating substrate 1 (5) near the circumferential surface of the electrode 1 (Jj, this storage hole 2
3 houses an impedance conversion element 8 such as a FET transistor. Input terminal of impedance conversion element 8 'd l, i Strawman horn lead 9
is connected to the electrode 1 of the fixed electrode 3 by soldering, and the output lead 10 is connected to the output electrode 20 of the insulated electrode 1 by soldering. .

In this electret type 1-1 phone, c 1. 'd The drawing room between the constant electric current 3 and the vibration WIA 6 changes, and the output voltage according to the change in the voltage W is impedance-converted to the output electrode 20 and the ground electrode 21 connected to the support 111IJ link]7 is output as the output end.

The reflex 1-let type condenser microphone of the present invention constructed as described above has an impedance conversion element 8.
is housed in the storage hole 23 formed in the insulating substrate 16, so that the volume of the impedance conversion system 8 can be absorbed by using the thickness of the insulating foot plate 16. The impedance conversion element (J, f, -) can be compactly stored in the insulating substrate 16 without using the stand 4, and the size and thickness can be significantly reduced.

Particularly in recent years, as the impedance conversion element 8 has become smaller in size with advances in semiconductor technology, it can be sufficiently accommodated within the insulating substrate 16.

In addition, the luctoret type condenser microphone D of the present invention
Since the insulator is composed of the electrode 1 adhered to the insulating substrate 161 and the support ring 17 which also serves as a spacer ring, the number of component parts is greatly reduced, and as is clear from the vJ manufacturing method described in 4 below. Characteristics are uniform (“Productivity is also good.

Below, the J leftlet type condenser microphone of the present invention [
An example of one method for manufacturing one phone will be described.

First, as shown in FIG.
26 is neglected.

Then, as shown in FIG. 6, the electrode 1Jj and the support ring 17 surrounding it are formed from the conductive layer 24 on the upper surface of the double-sided print l-1;4 plate 26 by a conventionally known chemical treatment such as etching. Forming J-ru /J, 1・Conductive layer 2 on the surface
From No. 5 onwards, the output electrode 20 and the ground electrode 21 are formed in the same manner by photo-Tampling or the like.

Note that the electrode 1 and the like can also be formed by chemical processing or mechanical processing such as cutting.

Next, as shown in FIG. 7, the upper surface of the electrode 1 surrounded by the support ring 17 is shaved and thinned by a conventionally known method, and then a 1/6'' dielectric layer is formed. Deposit and add this? The fixed electrode 3 is constructed by converting J and rills 1 to 1 to 1 and 1 to 1 and 1 to la, etc., respectively. The Hatake molecular dielectric layer may be formed into a leftlet in advance.

Thereafter, as shown in FIG. 8, a storage hole 23 is bored through the insulating substrate 16J3 and the 7-wire conductor 21 around the fixed mold 143, and an impedance conversion element r8 is inserted into the storage hole 23. At the same time, the input/output leads 9 and 10 are connected to electrode 1 d3 and output electrode 20, respectively.
On the other hand, the vibrator 6 is stretched over the end of the support ring 17, and the support ring 17 and the
The storage hole 23, which is completed by connecting one piece, may be drilled in the double-sided one-lint board 26 shown in FIG.

As described above, in the electret-type electret type micron according to the present invention, a double-sided printed circuit board 26 having a conductive layer 24 and 25 coated on the bidirectional surface of the insulating substrate 16 is used.
The electrode 1 and support ring 17 constituting the T leftlet type condenser microphone are formed from the conductive layer 24 on the top side, and the external horn electrodes such as the output electrode 20 and the ground electrode 21 are formed from the conductive layer 25 on the bottom side. Therefore, it is extremely thin, and the electrode 1 and the support ring 17 are not attached to the electrode 1 and the support ring 16 in advance.
In addition, the dimensional viscosity of each component becomes constant, and the airtightness between the components is also maintained for 11 minutes, making the characteristics uniform.

Since the input lead 9 of the impedance conversion cable 8 to be stored is located between the electrode 1 and the ground electrode 21, the human power lead 9 is shielded and has the advantage of being difficult to pick up external noise.

Furthermore, the double-sided printed circuit board 26 has the same +1. Since it is possible to form a large number of electrodes 1 and support rings 17 at the same time, it is possible to form a large number of electrodes 1 and support rings 17 at the same time.
It is possible to manufacture microphones, and the production of mackerel is also good.In addition, the 1L $J & 26 has division f stages such as perforations and V grooves. fluff,
Easily divisible.

In addition, in implementing the Electref 1 to 1-type Zino 0-only microphone of the present invention, it is not limited to the lifting platform that has the storage hole 23 and stores the impedance conversion system 8, but also has a relatively unbalanced use of the printed U board. 41 It is also possible to store the impedance conversion element 8 by IGt on the upper or lower surface of the insulating substrate 16 in four parts.The purpose of the present invention is to provide a storage part and store the impedance conversion element there ) is configurable.

[Effects of the Invention] As explained above, in the present invention, the impedance converting element is installed in the flat insulating base constituting the transformer, and is housed in the flat insulating base. With 2), the impedance conversion element can be held in i+J capacity, and the storage space for the impedance conversion cable can be absorbed by utilizing the thickness of the insulation base.
Extremely small and thin.

Furthermore, it is possible to form electrodes and support rings from the conductive layer that covers the insulating base, making it possible to improve the dimensions of the component parts and to make them airtight, resulting in stable characteristics and Since it is possible to use a printed circuit board, it has excellent resistance to ω.

In addition, if you use a double-sided printed circuit board with a conductive layer formed on the underside of the insulating layer, you can completely eliminate the lid 444jA (ζ
By forming external output electrodes such as output electrodes and ground electrodes, it is not only possible to shield the C1 impedance conversion element, but also when installing the transducer in electronic equipment, such as portable cassette tape recorders. It has become possible to connect directly to the circuit base, greatly improving mounting efficiency in electronic devices, and making a huge difference in the miniaturization of electronic devices.
Do 3.

It should be noted that the trans-dielectric of the present invention is limited to the configuration in which the polymer dielectric layer is formed on the fixed electrode, and can also be implemented in the configuration in which it is formed in the vibration 11Q. It is possible to implement Hiroji.

[Brief explanation of drawings]

FIGS. 1 and 2 are longitudinal cross-sectional views and exploded perspective views of a conventional transducer strip, -IJ, and FIGS. Figures, bottom views, and Figures 3-33 are T diagrams showing an embodiment of the J method for manufacturing the transformer 1-1 of the present invention shown in Figure 3. 1... Electrode 2... Polymer dielectric layer 3...
......Fixed electrode 4...Base 5...Spacer ring 6...
..... Vibration membrane 7 ..... Membrane ring 8 ..... Impedance conversion system element 1
6・・・・・・・・・Insulation base 17・・・・・・
......Support layer (support ring) 20...
...Output electrode (external output electrode) 21...
...I-Sumi pole (external output electrode) 23...
......Storage section 24.25...'4Electric layer 26...Double-sided printed circuit board attorney Patent attorney Jusu Yamasa - Figure 3 IU No. 4 Figure 5th Garden ＼＼ゝ8 ＃＃へ□ Ichigeto 21 and 16 ~ 21 16 21

Claims (1)

[Claims] In a transducer, an electrode is formed on an insulating substrate, a vibrating membrane is stretched over the front surface of the electrode at a predetermined distance, and an input terminal of an impedance conversion element is connected to the electrode. is housed in a housing provided in the insulating substrate.