JPS58209148A - Microcomputer - Google Patents

Abstract

PURPOSE:To miniaturize the constitution by loading a socket encasing a semiconductor memory storage of leadless chip carrier structure onto a socket encasing the micro-computer of the same structure. CONSTITUTION:With the socket 12 for an EPROM, a concave section encasing an EPROM 11 is formed, a pluraity of contacts 12a being in contact with the electrode of the ROM 11 are set up to the inside, and a plurality of contacts 12b being in contact with the electrode of the upper surface of the micro-computer 13 are fitted to a lower surface. With the socket 14 for the microcomputer, a concave section encasing the computer 13 is formed, and a plurality of contacts 14a being in contact with the electrodes of the side surface of the computer 13 are set up to the inside while an electrode 14b for loading to a printed board 16 is fitted to a lower surface. The sockets 12, 14 each encases the ROM 11 and the computer 13, are positioned and are fixed. Accordingly, the microcomputer can be constituted to a small-sized one.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a microcomputer in which a ROM and a RAM are directly connected to the microcomputer.

(2) Background of the technology Conventionally, a RAM or ROM has been connected to a microcomputer used in an electronic computing device, etc., but due to the need for miniaturization of the device, as shown in FIG. In order to increase the mounting density, R is installed on the microcomputer 2.
OM5j is said to be a method of mounting RAM. Furthermore, when it is desired to rewrite the contents of this ROM\DRAM as necessary, a replaceable EPROM 3 is used instead of the ROM or RAM, especially in the trial production stage. To rewrite this chorus, the contents of note 1 are erased by ultraviolet irradiation at 4Vc as shown in Figure 1a, and the inscription is written as shown in Figure 1A.
Connect socket 6 connected to EOM writer with cable 5 to E
This is done by fitting it into PROM3.

(3) Conventional technology and problems As mentioned above, when installing a microcontroller and an EPROM, it is technically difficult to connect the two directly. An EPROM is mounted through the interface as shown in the figure. However, the 7-socket EPR shown in Figure 2
OM3's! The connection with the pole is made on the entire flat surface, and in order to ensure the springiness of the connection spring 8, it is necessary to have a sufficient length t.As a result, the external shape of the socket 7 becomes large, and the spring 8' The lid 9 is required to suppress f, and the stopper 10 is required, resulting in an increase in size.

Therefore, since conventional microcomputers use the above-mentioned sockets, they have the disadvantage of being large in size.

(4) Purpose of the Invention In view of the drawbacks of the above-mentioned technology, it is an object of the present invention to provide a microcomputer that is smaller than the conventional one.

(5) Structure and object of the invention According to the present invention, on a socket containing a microcomputer having a leadless chip carrier structure having a plurality of electrodes on each side and top surface,
The semiconductor memory device assembly socket V accommodates a semiconductor memory device having a leadless chip carrier structure having a plurality of electrodes on one surface, and is removably mounted with a socket.
C is a semiconductor memory device) A contact for contacting the electrode of the semiconductor memory device is provided inside the recess for accommodating the device, and a plurality of contacts for contacting the electrode on the top surface of the microcomputer are provided on the bottom of the socket. In the socket of the microcomputer, a plurality of contacts 41 and 41 are provided in the front part of the recessed part 10i1 for housing the microcomputer, and a plurality of contacts contacting the electrodes of the microcomputer are provided on the bottom surface of the socket, and the contacts are connected to the pattern of the glint board on the bottom surface of the socket. This is achieved by providing a microcomputer that is characterized by having a plurality of electrodes arranged on it.

(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 3 is an exploded perspective view showing the structure of a microcomputer according to the present invention. In FIG. P1, 11 is E P ROD/l, 12 is gp
Existing socket, 13fl microcomputer, 14
71 indicates a computer socket.

EPROM11fl leadless chip carrier (LCC)
) structure, and its first surface rC has a plurality of electrodes 11a.
is provided. Microcomputer 13 is EPR
Like the OM, there is no LCC structure f, and electric fences 13a and 13b are provided on the side and top surfaces.

The EPROM socket 12 is provided with a recess for accommodating an EPROM, of which 111 [EPROM 11
The electrodes 11a (a plurality of contacts) 12a are printed, and the lower surface of the microcomputer 13 has a plurality of electrodes 11a [0! Contact) 12b (
The microcomputer socket 14 has almost the same shape as the EPROM socket 12, and is provided with a recess for accommodating the microcomputer 13. Surface electrode 13a [multiple contacts 14 in contact]
a is provided, and an electrode 14b (see FIG. 4) for mounting on the grid plate is provided on the lower surface.

Note that the microcomputer socket 14 is provided with an alignment pin 14c, and the EPROM socket 12 is provided with an alignment pin 14c.
is provided with an alignment hole into which the bottle 14c is inserted, so that the two can be aligned. FIG. 4 shows the structure of the microcomputer according to the present invention. It is an assembled sectional view.

In the same figure, 11 is an EPROM, 12 is an EPROM socket, 13 is a microcomputer, 14 is a microcomputer socket, 15 is a fixture, 16i printed board, 12 is a fl EPROM socket contact, and 12 is a bij-EPRO&i socket. A contact (14b) of the 14au microcomputer socket (14b) is an electrode (14b) provided on the underside of the socket and connected to the zetern of the printed circuit board (14).
C indicates the alignment bins.

The contacts 12a, 12b, and 14aU each have a spring property and come into contact with a mating electrode, and the electrode 14b on the lower surface of the -T microcomputer socket 14 is soldered to the pattern on the printed circuit board 16. There is.

The EPROM socket 12 and the microcomputer socket 14 accommodate the EPROMI 1 and the microcomputer 13, respectively, and are aligned by the alignment bin 14c and fixed by the fixing fittings 15 to obtain the microcomputer of the present invention C.

(7) Effects of the Invention As explained in detail above, by mounting a socket containing an EPROM of an LCC structure on a socket containing a microcomputer of the trxLccWI order of the present invention, the microcomputer of the present invention can be miniaturized. is,
Moreover, it is easy to attach and detach the EPROM, and the EPROM can be rewritten very easily, which is a great effect.

[Brief explanation of the drawing]

Fig. 1 is a drawing explaining how to replace an EPROM, Fig. 2 is a diagram showing the structure of a conventional EPROM socket, and Figs. FIG. 3 is an exploded view, and FIG. 4 is an assembled cross-section. In the drawing, 11 is an EPROM, and 12 is an EPROM1.
+3 socket, 13V: L microcomputer, 14
A socket for a microcomputer, a fixing metal fitting at 15,
16 shows Glint Lab. Patent applicant Fujitsu Ltd. Patent agent Akira Yoiki Patent attorney Kazuyuki Nishidate 1) Yukio Patent attorney Akira Yamaguchi 2 Figure 1 Figure 2

Claims (1)

[Claims] 1. A semiconductor memory device made of one leadless chip carrier having a plurality of T-poles on the side surface is placed on a socket housing a microcomputer made of one leadless chip carrier having a plurality of electrodes on the side and top surfaces respectively. The semiconductor memory device socket is provided with a plurality of contacts in contact with the electrodes of the semiconductor memory device on the inner side of the recess for accommodating the semiconductor memory device. The bottom of the socket is provided with a plurality of contacts that contact the top surface of the microcomputer mentioned above.
1' A plurality of contacts for contacting the electrodes of the microcomputer are provided inside the recess that accommodates the microcomputer, and a socket is provided on the bottom surface of the socket with a plurality of electrodes for connecting to the mother turn of the printed circuit board. A microcomputer featuring: