JPS582057Y2 - Semiconductor element mount structure - Google Patents

Description

[Detailed description of the invention] The present invention relates to a semiconductor element mounting structure in which a semiconductor element such as a diode is placed in a waveguide through which high-frequency radio waves pass through in electronic equipment such as oscillators and amplifiers, and in particular, the present invention relates to a semiconductor element mounting structure in which a semiconductor element such as a diode is placed in a waveguide through which high-frequency radio waves pass. It's about what you keep.

Conventionally, when holding a semiconductor element such as a diode in a waveguide, one electrode side of the semiconductor element is supported on a stud with a chuck mechanism or soldered individually, and the other electrode is The holder is placed on the side of the semiconductor device and the semiconductor element is held therebetween.

By the way, in general commercially available bill-shaped diodes, both electrodes are eccentric by a maximum of Q, about 2 mm due to manufacturing errors, so it is simply necessary to sandwich both electrodes of a semiconductor element between a stud and a holder as in the conventional structure mentioned above. In this case, it is not possible to absorb the eccentricity of both electrodes, and therefore there is a risk that bending stress will act on the semiconductor element and cause it to be damaged.

Furthermore, since the other electrode of the semiconductor element and the holder are in plane contact, there is a problem in that when vibration is applied from the outside, the contact portion between the two is shifted and the electrical characteristics become unstable.

The purpose of the present invention is to eliminate such problems.When fixing one electrode of a semiconductor element to a stud, it is aligned with the other electrode on the holder side to absorb the eccentricity of both electrodes. The other electrode of the semiconductor element is fitted into a tapered or arcuate recess at the tip of the holder to prevent the contact area between the two from shifting, and a spring force is applied to the holder to elastically press the semiconductor element. The present invention provides a semiconductor element mounting structure in which the holder itself is supported by the lid portion of the support body so as not to play laterally.

The present invention will be explained below with reference to embodiments of the drawings.

Fig. 1 shows an example in which the present invention is applied to an oscillator, in which a stud 3 is screwed into a rectangular waveguide 2 inside a housing 1, perpendicular to the middle of the rectangular waveguide 2 through which high-frequency radio waves pass. A support body 5 having a holder 4 is partially inserted and screwed therewith, and is configured to hold a semiconductor element as described later.

Further, a cavity 6 is attached to one side of the housing 1 in communication with the waveguide 2, and only a predetermined frequency of the oscillated radio wave is extracted from the cavity 6.

Next, in FIG. 2, a stud 3 is screwed into one of the mounting holes 7 of the housing 1 that are perpendicular to the waveguide 2, and one electrode 10a of the semiconductor element 10 is inserted into the electrode insertion hole 9 at the tip of the stud 3. Part of it is inserted and soldered.

In this case, the hole diameter of the electrode insertion hole 9 is in advance larger than the outer diameter of the electrode 10a by about 0.1 to 0.2 mm, and the electrode insertion hole 9 and the other electrode 10 on the holder side of the semiconductor element 10 are
b are aligned and soldered so that they are coaxial.

Further, a conical recess 11 tapered at 90' or 120° is formed at the tip of the holder 4 provided on the opposite side of the stud 3, and the electrode 10b of the semiconductor element 10 is fitted into this recess 11. Even when vibrations or the like are applied from the outside, the contact portions between the two are held so as not to shift from side to side.

A stepped hole 12 with a large diameter is formed around the holder 4 in the casing 1, and the cylindrical support 5 is partially inserted into the hole 12 and is screwed in place with a spacer 14 in between. A dielectric radial filter 15 and a radio wave absorber 16 are installed between the holder 4 and the support 5.

Further, the support body 5 is covered with a lid 17, and a spring 19 is provided between the lid 17 and the flange 18 of the holder 4 to elastically press the holder 4 toward the semiconductor element 10, and the end of the holder 4 is The insulating bushing 13 covered with the hole 8 of the lid 17
is tightly fitted into the

Thus, according to the semiconductor element mounting structure of the present invention, the electrode 10b on the holder side of the semiconductor element 10 and the holder 4 that presses it are aligned and coaxially contact each other, so that the eccentricity of both electrodes 10a and 10b is substantially eliminated. In this state, the bending stress as in the conventional case is no longer applied, and the durability of the semiconductor element 10 increases.

Further, the holder 4 is supported so as not to wobble by fitting into the hole 8 of the lid 17, and in this state, it is pushed by the spring force of the spring 19 so that the recess 11 at the tip fits into the electrode 10b of the semiconductor element 10. Therefore, the contact between the holder 4 and the electrode 10b becomes extremely reliable and stable, and the electrical characteristics are stabilized.

Therefore, the reliability of electronic devices such as oscillators is further improved.

Note that the shape of the recessed portion 11 at the tip of the holder 4 may be a hemispherical shape with an arc other than the tapered conical shape as in the embodiment.

[Brief explanation of the drawing]

FIG. 1 is a side view showing the appearance of an example of a transmitter to which the present invention is applied, and FIG. 2 is a sectional view showing an example of a semiconductor element mounting structure according to the present invention. 1... Housing, 2... Waveguide, 3...
...Stud, 4...Holder, 5...
・Support body, 6... Cavity, 7...
Mount hole, 8... Hole, 9... Electrode insertion hole, 10... Semiconductor element, 10 a, 10
b... Electrode, 11... Concave portion, 12...
... Hole, 13 ... Insulating bushing, 14.
... Spacer, 15 ... Radial filter, 16 ... Radio wave absorber, 17 ... Lid, 18 ... Flange, 19 ... ···screw.

Claims (1)

[Scope of utility model registration request] In a structure in which a stud is screwed into a mounting hole perpendicular to a waveguide of a casing, a spring force is applied to a holder, and the holder itself is supported by a lid portion of a support body,
One electrode of the semiconductor element is fixed to the stud in alignment with the other electrode on the holder side, and the tapered recess at the tip of the holder contacts the other cylindrical electrode. Semiconductor element mount structure.