JPS58204870A - Glass ceramic composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a glass/ceramic composition, and particularly to a glass/ceramic composition for electronic component mounting substrates.

(2) Prior Art and Problems In electronic components, when wiring between elements becomes complicated, many intersections are required, and multilayer wiring has been developed as a technology for handling this problem, and its development is still progressing today. In particular, the multi-wiring method in which the conductor is embedded in the ceramic substrate is suitable for pressure control, has a small distribution valley k, has excellent mechanical and thermal strength, has few surface irregularities, and basically has a layered structure. It has excellent features such as no restrictions on numbers, and is attracting the most attention for use in complex hybrid ICs and LSIs.

Today, alumina (At20x, usually 9 Q w
(purity greater than t%) is utilized. The reason for this is that it has excellent properties such as mechanical and thermal strength and thermal conductivity, but it also has a high dielectric constant (approximately 10.
5) When the board size is increased and the number of layers is increased to '1', there is a problem that the capacitance cannot be ignored due to the substantial increase in wiring length, making it unsuitable for high-speed circuits. .

Although this capacitance problem is particularly serious in multilayer wiring boards, it is clear that it is not necessarily limited to such cases.

(3) Purpose of the Invention In view of the above-mentioned prior art, the present invention provides a ceramic (glass/ceramic) substrate with low dielectric constant for mounting electronic components that has mechanical, thermal strength and other general properties. In addition, it is intended to provide a ceramic acid lath ceramic composition (C-L1 silk composition) (c-) which exhibits a particularly low VC1 rate.

(4) Structure of the invention In order to achieve the above object, the present invention has a VC1 chemical composition of 5i0245 to 65 wt% and M of 08 to 25 wt%.
%, and 5i02 consisting of 8-55 wt% CaOl
- To provide a glass/ceramic composition comprising MgO-Cp, O glass 3 (1 to 80 wt%) and At205211 to 70 wt%.

That is, in the present invention, Az2o5 has high strength but high dielectric constant, and transparent glass has low strength but low electric constant, so by appropriately combining these elements, strength,
Obtaining a glass-ceramic composition with a dielectric constant of t'fi A/f Explanation 1. f (7 and 1'' is actually 17 in town.
℃i11 tk ) is selected from four points.

However, the composition ratio of glass and Az2O3 of the present invention is
This was determined through experiments based on the four points of finding a suitable glass, ceramic, and resin composition. Conceptually speaking, the microscopic structure of the glass-ceramic composition according to the present invention is such that glass fills the spaces between grains of alumina (p, t2ns>), depending on the composition.

Hereinafter, the present invention will be described in detail based on embodiments.

(5) Invention Example 810245.8 wt%, MgCO313.3 wt%
, and CaCO340.9wt in platinum Rugge about 1
Melt by heating to 450°C and rapidly cool to 5i0261 wIi
%, MgO 8.5 wt %, and CaO 30.5 wt % 8102-MgO--CaO glass was made and pulverized to an average particle size of several μm at t7, which was used as a glass raw material in the following experiment.

The above glass 1750. ! i' and Az2o3 (average particle diameter number 1tm) 1750p and pine □da (butyral),
Possible? Mll, \, 1111!1 Wet milled with glue and solvent (methanol), and used the doctor blade method to obtain a width of 100wn and a thickness of 0.
, 7 vtm] After drying, a 60 m0 sheet was punched out from the flat part. This sheet 3
Sheet rune - c1 temperature 1 = J 50℃, pressure month t) OK,
'-2 for about 5 minutes, and then boiled in an electric furnace in an atmosphere of 11νL7fco. It was heated to about 900 to IJOQ'C, and in the second summer, it was held for about 5 hours to melt it.) The 41 iso components and carbon content in the glass disappeared into the base metal, and the 1 () 125Ll ~+
Sinter at 4o
It was slowly cooled at a rate of 5 fl L/hr, and the dimensions after firing were approximately 50 m' and approximately 1.5 mm thick.

In this way, the glass/ceramic composition was made by J.
Based on IS standard, fi8 fW rate, heat transfer rate 24, glue 'jM rate (average of 25C to 1tJOc), body 1k u
L rA, and bending strength were measured and L7 was measured on 7.
Vitrified laminated resin compositions of comparative examples were prepared by changing only d+d and d, and the strength 1171 of them was measured. The results are summarized in a table.

As is clear from 6, aluminum 620~7 (1wt4 text is made of lath 31+~H(I wt% V(-
Then, - lower the electric rate and -5,0-7,6),
We were able to obtain a glass-ceramic composition vI that was 70% (4 times better) in terms of loss σ and other properties.

(6) Effects of the Invention As is clear from the above explanation, the present invention (Cd) has a low electrical resistance due to the glass-ceramic composition, and can be used in VCs such as multi-wiring boards. A wiring board material that prevents deterioration of performance at both speeds is provided, and it is possible to increase the area and number of boards.

[Brief explanation of the drawing]

The attached drawings are diagrams of the temperature treatment for sintering employed in the embodiments of the present invention.

Claims (1)

[Claims] l Chemical composition is 840245-65 wt%, Mg0
5102-MgO-CaO glass 30-80 wt% consisting of 8-25 wt-chi and CaO 18-55 wt-chi
A glass/ceramic composition comprising 520 to 70 wt% of Az2O.