JPS58199658A - Method and apparatus for cleaning soldering iron - Google Patents

Method and apparatus for cleaning soldering iron

Info

Publication number
JPS58199658A
JPS58199658A JP57084532A JP8453282A JPS58199658A JP S58199658 A JPS58199658 A JP S58199658A JP 57084532 A JP57084532 A JP 57084532A JP 8453282 A JP8453282 A JP 8453282A JP S58199658 A JPS58199658 A JP S58199658A
Authority
JP
Japan
Prior art keywords
soldering iron
molten solder
shaped member
strip
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57084532A
Other languages
Japanese (ja)
Inventor
Atsushi Kabe
加部 篤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP57084532A priority Critical patent/JPS58199658A/en
Publication of JPS58199658A publication Critical patent/JPS58199658A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02Soldering irons; Bits
    • B23K3/028Devices for cleaning soldering iron tips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To clean easily a soldering iron in a short time, by piercing the soldering iron into a slender band-like member which has heat resistance and elasticity, and is irregularly twined and continued. CONSTITUTION:When a soldering iron 1 to which molten solder 4 is adhering is pierced into a slender band-like member 6 contained in a vessel, the tip 1a of the soldering iron 1 goes into space since the slender band-like member 6 is irregularly twined and also continued, and the whole circumference of the soldering iron 1 is surrounded by the slender band-like member 6. In this state, when the soldering iron is made to execute a reciprocative motion upwards and downwards, the slender band-like member 6 scrapes off the molten solder 4 from the soldering iron 1 by its edge 6a. The scraped molten solder 4 is cooled by contacting with the slender band-like member 6, drops downwards gradually, is solidified, becomes powdery solder 4b, and collects in the bottom part of the vessel.

Description

【発明の詳細な説明】 本発明は、半田とての清掃方法及び装置に係り、特に不
規則に絡み合った細帯状部材中用いて溶融半田が付着し
た半田ごてを容易に清掃することができるようにした半
田とての清掃方法及び装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for cleaning a soldering iron, and in particular, it is possible to easily clean a soldering iron to which molten solder has adhered when used in irregularly intertwined strip-like members. The present invention relates to a method and apparatus for cleaning a soldering iron.

従来、電子部品の組立工場等において便用さnる半田ご
ては、銅の心金の表11にニッケルめっき或いは鉄めっ
きを施しであるため、半田とての先端部分が使用中に酸
化することはなく、従ってやすり等を用いて半田とての
表面を削る必要はない。
Conventionally, soldering irons conveniently used in electronic parts assembly factories, etc. have a copper core plated with nickel or iron, so the tip of the soldering iron oxidizes during use. Therefore, there is no need to use a file or the like to scrape the surface of the solder tip.

そこで従来は、第1図に示すように、半田とて1を、例
えば四角形の容器2に収容さn水を含ませたスポンジ3
に押し当てて清掃していた。しかしこの方法によると、
スポンジ3は一般に薄く、かつポーラスでおっても半田
とてlの突刺し力に対しては相当な抵抗力介示すため、
スポンジ3に半田とてlを突き刺して清掃することは不
可能である。このため必然的に半田とてlを図示のよう
に横倒しにして一面だけをまずスポンジ3に押し当てて
矢印A又はBの如く往復動させ、Fに矢印C又はDの如
く回転させてやらなけnば半田ごてlの全周に付着した
浴融半田4を取り除くことはできなかった。このため半
田ごて1の清掃に時間がかかると共4C−1%に半田と
てlの回転動作によって作業者の手が疲労し易いという
欠点があった。
Therefore, conventionally, as shown in FIG.
I was cleaning it by pressing it against it. However, according to this method,
Although the sponge 3 is generally thin and porous, it exhibits considerable resistance to the piercing force of the solder tip.
It is impossible to clean the sponge 3 by piercing it with a soldering tip. For this reason, it is necessary to turn the soldering tool L sideways as shown in the figure, press only one side against the sponge 3, move it back and forth as shown by arrow A or B, and then rotate it as indicated by arrow C or D at F. It was not possible to remove the bath melted solder 4 adhering to the entire circumference of the soldering iron l. Therefore, cleaning the soldering iron 1 takes time, and the operator's hands tend to get tired due to the rotating operation of the soldering iron 1.

着たスポンジ3の表面や穴の中には溶融半田4が固化し
たものやその他の不純物が詰まって比較的短期間に12
川できなくなるので不経済であった。
The surface and holes of the worn sponge 3 are clogged with solidified molten solder 4 and other impurities, and the sponge 3 becomes stained in a relatively short period of time.
It was uneconomical because the river could no longer be drained.

更圧はスポンジ3には常圧水を含ませておがなけnばな
らないため、水の補給にも気を使わなければならず甚だ
面倒であ一す、手作業による半田付は工程の作業能率を
向上させる上で半田とての清掃作業はかなりの障害とな
っていた。
To apply additional pressure, the sponge 3 must be soaked in normal pressure water, so you have to be careful about replenishing the water, which is extremely troublesome. Manual soldering is a process step. The cleaning work of soldering irons has been a considerable obstacle in improving efficiency.

本発明は、上記した従来技術の欠点を除くためになされ
たものであって、その目的とするところは、溶融半田が
付着した半田ごてを単に突き刺して上下方向に往復動さ
せるだけで容易に、かつ短時間で半田ごてを清掃できる
ようKすることである。即ち従来用いられて来たスポン
ジに代えて、耐熱性及び弾性を有し不規則に絡み合って
J4L続する細帯状部材中に半田ごてを突き刺すことに
よって同時VC半田とての全表面をv′llr桶できる
ようにすることであり、またこ′t1によって信崎中に
半田ごてを回転さぞる必要性をなくシ、作業者の手の疲
労を軽減させることである。ナに他の目的は、半田ごて
から増り除かn、た浴融半田を細帯状部材で冷却し、な
から落下させることで、清掃装置の半永久的な反復使用
を可能とし、コストの低誠を図ることである。また他の
目的は、水の使用を小壁とすることによって清掃装置の
維持管理を容易化し、こ1らJ7ことによって手作業に
よる半田付は工程の作業能率を向−トさせることである
The present invention has been made to eliminate the drawbacks of the prior art described above, and its purpose is to easily pierce the soldering iron with molten solder and move it back and forth in the vertical direction. , and to clean the soldering iron in a short time. That is, instead of using a sponge that has been used in the past, a soldering iron is inserted into a heat-resistant and elastic thin strip member that is irregularly intertwined and connected, and the entire surface of the VC solder is simultaneously soldered to v'. This also eliminates the need to rotate the soldering iron during Shinsaki, thereby reducing the fatigue of the operator's hands. Another purpose is to cool the melted solder from the soldering iron with a thin strip-shaped member and let it fall from the soldering iron, thereby making it possible to use the cleaning device semi-permanently and repeatedly, thereby reducing costs. It is to aim for low sincerity. Another purpose is to facilitate maintenance of the cleaning device by reducing the use of water, and to improve the efficiency of the manual soldering process.

喪するに本発明方法は、血+Sa及び弾性を有し不規則
VC絡み台って連続する細帯状部、材中に溶融半田が付
着した半田とてを突き刺し、往1リル;1づせることで
前記細帯状部材のエツジで該溶融午111をはぎ取り、
はぎhノらn、た該kj融半田T萌配線帝状部材で冷却
しながら固化させて下方に落下させて内11記半田ごて
を清掃−すること分喘、徴とするものであり、また本発
明装置は、耐熱性及び弾性を有し不規則に絡み合って連
続する細帯状部材と、該細帯状部材を収容する容器とを
flMえ、該容器は上部が開口して前記細帯状部材が露
出し、該細帯状部材に洞融半田力i付着した半田ごてを
突き刺して往復動させることで計半田ごてを清掃するよ
うに構成したことをIVi徴とするものである。
In other words, the method of the present invention is to pierce a solder tip with molten solder adhered to the continuous narrow band-like part of the irregular VC entanglement base having blood + Sa and elasticity into the material, and then apply it once. and peel off the melted material 111 at the edge of the narrow strip-shaped member,
This is a symptom of cleaning the soldering iron described in item 11 by solidifying the melted solder T while cooling it with a metal member and dropping it downward. Further, the device of the present invention includes a heat-resistant and elastic strip-shaped member that is irregularly intertwined and continuous, and a container that accommodates the strip-shaped member, and the container is open at the top and the narrow strip-shaped member is The IVi characteristic is that the soldering iron is exposed and the soldering iron with the melted solder force i attached to the thin strip-like member is pierced and reciprocated to clean the soldering iron.

以下本発明を図面に示す実施例に基いて説明する。箒2
図に示すように、本発明に係る半田とてのmm装饋5は
、耐熱性及び弾性を有L7不規則に絡み合って連続する
細帯状f16を容器7に収容してなり、容器7は上部7
aが開口して細帯状部材6が賞出Eてふり、計細帝状部
材Ksfh融半田4が付着[、た半田とて1を突き刺し
て往復動させることで該半田ごてを清掃するように構成
されている。細帯V部材6と[7ては、黄銅の薄片、ス
テンレス鋼の薄片等のエツジを持つ錆びない金蝿の薄片
が好まし7い。また鍋底などを磨くための市販されてい
る金属性のたわしであってもよい。
The present invention will be explained below based on embodiments shown in the drawings. Broom 2
As shown in the figure, the mm soldering device 5 according to the present invention has heat resistance and elasticity L7, and continuous thin strips f16 intertwined irregularly are housed in a container 7, and the container 7 has an upper part. 7
a is opened and the thin strip-like member 6 is ejected, and the solder iron 1 is pierced and reciprocated to clean the soldering iron. It is composed of The strip V member 6 and [7] are preferably rust-free metal fly flakes with edges such as brass flakes or stainless steel flakes. Alternatively, a commercially available metal scrubbing brush for polishing the bottom of a pot or the like may be used.

容器7は、陶器、カラス、金輌、耐熱性プラスチックな
どが望まし、く、形状は円筒形に限らず四角形等でtI
うてもよい。
The container 7 is preferably made of ceramic, crow, metal, heat-resistant plastic, etc., and the shape is not limited to cylindrical, but may be rectangular, etc.
It's okay.

本発明は、上記のように構成さrl−?ふ・シ、9下そ
の作用e(ついて説明する。浴i牛田4の付着【7た半
…ごてlを容器7 K収答芒才げ:細帯状部材中の中に
突き刺1°と、該細帯状部材6tま、不玩則1/(絡み
合いかつ連続しているので、!%Nlも形成さjており
、#’!td+に半田とてlのSt AIi laが入
り込んで、牛H(ごてlの全一が細帯状部材6で囲繞さ
tlこの状態で半田とて1を」ニFK往伽訪aせること
で細帯状部材6ば、ヤのエツジ6arこよって溶融半田
4を半田ごてlからにぎ取る。そしてはぎ取らnた溶融
半田4i1を細帯状部材6に接触−Cること″によって
冷却場11ながら岐細蛍状部材VC付漸することzr<
*xtc下方に落下l、っつ固化[−7て粉状の半田4
bとなって、第2図に示すように容器7の底部7bK溜
る。溶融半田4が務ド中に細帯状部材(例えは黄銅)に
前層しないのは、半トロとてlのI1w%VCより7ラ
ツクスがとんでしまっていて、該細帯状部材VC1ユフ
ラックスが付着しないためである。
The present invention is configured as described above. Fu・shi, 9 below, its effect e (I will explain about it. Attachment of bath I Ushita 4 [7 tahan... trowel l to container 7 K response mantle: pierce 1° into the thin strip-like member. , the narrow strip-shaped member 6t is intertwined and continuous, so !%Nl is also formed, and the solder and St AIi la enters into #'!td+, and the H (The whole part of the iron 1 is surrounded by the thin strip-shaped member 6. In this state, by passing the soldering iron 1 to the FK, the thin strip-shaped member 6 is surrounded by the edge 6 of the iron, and the molten solder 4 is removed. Then, the stripped molten solder 4i1 is brought into contact with the narrow strip-shaped member 6, thereby attaching it to the narrow strip-shaped member VC while cooling the cooling field 11.
*xtc falls below l, solidifies [-7 and powdery solder 4
b, and the bottom 7bK of the container 7 accumulates as shown in FIG. The reason why the molten solder 4 is not applied to the thin strip-shaped member (for example, brass) during operation is that 7 lux has been removed from the I1w% VC of the semi-solid iron, and the thin strip-shaped member VC1 euflux is This is to prevent it from sticking.

このように、半田ごて1を単に細帯状部材6に突き刺し
て上下に往復動させることKよって簡単に半田とて1を
清掃することができ、細帯状部材6には溶融半田4が全
く溶着し2ないので、#細帯状部材6は半永久的に使用
でき、しかも時折細帯状部材6を容器7から取り出して
底部7bに溜った粉状の半田4bを捨てnばよいから清
掃装置5自体の清掃も至って簡単である。
In this way, the soldering iron 1 can be easily cleaned by simply sticking the soldering iron 1 into the narrow strip-shaped member 6 and moving it up and down, and no molten solder 4 is welded to the narrow strip-shaped member 6. Therefore, the thin strip member 6 can be used semi-permanently, and all you have to do is take out the strip member 6 from the container 7 from time to time and discard the powdery solder 4b that has accumulated on the bottom 7b. Cleaning is also extremely easy.

本発明け、上記のように構成さn1作用するものである
から、溶融半田が付着した半田ごてを単に突き刺[、て
上下に往復動させるだけで容易に、かつ短時間で半田ご
てを清掃できる効果が得らfる。即ち、従来用いらnて
来たスポンジに代λ−て、耐熱性及び弾性を有し不規則
に絡み合って連続する細帯状部材中に半田ごてを突き刺
すことによって同時に半田とての全表面を清掃できると
いう効果がある。またこの結果清掃中に半田ごてを回転
させる必要がなくなるので、作業者の手の疲労を軽減さ
せることができる効果が得られる。更には半田とてから
取り除かf′した溶融半田を細帯状部材で冷却しながら
落下きゼることかできるので、悄掃装噴の半永久的な反
復使用が可能となり、コストの低械を因ることかで弯る
効果が得らする。また水の使Alが小型であるため、清
掃装肩の維持管理が容易イにさすることになり、こj−
らのことによって千作纂による半円付は工程の作条能率
を向上させることができるもので、産条上の利用性極め
て大なる発明である。
Since the present invention is configured and operates as described above, the soldering iron can be easily and quickly removed by simply sticking the soldering iron to which molten solder has adhered and moving it up and down. The effect of cleaning can be obtained. That is, instead of the conventionally used sponge, the entire surface of the soldering iron can be simultaneously soldered by piercing the soldering iron into a heat-resistant and elastic thin band-like member that is irregularly intertwined and continuous. It has the effect of being able to be cleaned. Further, as a result, there is no need to rotate the soldering iron during cleaning, which has the effect of reducing the fatigue of the operator's hands. Furthermore, since the molten solder removed from the solder tip can be cooled by the thin strip-shaped member and allowed to fall, it is possible to use the sweeping jet repeatedly semi-permanently, resulting in a low-cost machine. You can get the effect of bending. In addition, since the aluminum used for water is small, maintenance and management of the cleaning equipment becomes easier.
As a result, the semi-circle cutting technique developed by Chisaku was able to improve the efficiency of the process, making it an extremely useful invention for production lines.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例IK係る半田とての清#pt装着の佃相
状塾を示す斜袂1シ1、第2図及び第3図は本発明の実
姉例に優り、第2図は使用状塾を示す部分破断fll同
図第3図は細帯状部材による溶−半田のはぎ取り機構を
示す拡大剣祝図である。 1は半11ごて、1aは先端、4は溶融半田、5は半田
とての?lv掃装宙、6ij細帝状部材、6aは1 エツジ、7け容器、7aは上部であに、。 特許出願人  株式会社アザヒ化学研究所代理人 弁理
士  内 山 和 男
Fig. 1 shows a conventional example of IK with a solder plate attached to the front. FIG. 3 is a partially cutaway view showing the shape of the molten solder stripping mechanism using a thin strip-like member. 1 is the semi-eleven iron, 1a is the tip, 4 is the melted solder, and 5 is the solder iron? lv cleaning space, 6ij narrow tangular member, 6a is 1 edge, 7 containers, 7a is the upper part. Patent applicant: Azahi Chemical Research Institute Co., Ltd. Representative: Kazuo Uchiyama, patent attorney

Claims (1)

【特許請求の範囲】 1 耐熱性及び弾性を有し不規則に絡み合うて連続する
細帯状部材中に溶融半田が付着した半田ごてを突き刺し
、往復動させることで前記細帯状部材のエツジで該溶融
半田をはぎ取り、はぎ取らrまた該溶融半田を前記細帯
状部材で冷却しながら固化させて下方に落下させて前記
半田ごてを清掃することを特徴とする半田とての清掃方
法。 2 耐熱性及び弾性を有し不規則に絡み合って連続する
細帯状部材と、核細帯状部材を収容する容器とを備え、
該容器は上部が開口して前記細帯状部材が露出し、該細
帯状部材に溶融半田が付着した半田ごてを突き刺して往
復動させることで該半田ごてを清掃するように構成した
ことを特徴とする半田とての清掃装置。
[Scope of Claims] 1. A soldering iron with molten solder adhered to it is inserted into a continuously irregularly intertwined strip-shaped member having heat resistance and elasticity, and is reciprocated to cause soldering at the edge of the narrow strip-shaped member. A method for cleaning a soldering iron, which comprises stripping off the molten solder, solidifying the molten solder while cooling it with the narrow strip-shaped member, and dropping the molten solder downward to clean the soldering iron. 2. Equipped with a heat-resistant and elastic strip-shaped member that is irregularly intertwined and continuous, and a container that accommodates the nuclear strip-shaped member,
The top of the container is open to expose the narrow band-like member, and the soldering iron with molten solder attached thereto is inserted into the narrow band-like member and moved back and forth to clean the soldering iron. A unique solder tip cleaning device.
JP57084532A 1982-05-18 1982-05-18 Method and apparatus for cleaning soldering iron Pending JPS58199658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57084532A JPS58199658A (en) 1982-05-18 1982-05-18 Method and apparatus for cleaning soldering iron

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57084532A JPS58199658A (en) 1982-05-18 1982-05-18 Method and apparatus for cleaning soldering iron

Publications (1)

Publication Number Publication Date
JPS58199658A true JPS58199658A (en) 1983-11-21

Family

ID=13833245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084532A Pending JPS58199658A (en) 1982-05-18 1982-05-18 Method and apparatus for cleaning soldering iron

Country Status (1)

Country Link
JP (1) JPS58199658A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60158352A (en) * 1984-01-28 1985-08-19 Hisayo Maeda Automatic blood analyzing, judging and displaying apparatus
JPS60126272U (en) * 1984-02-02 1985-08-24 白光株式会社 soldering iron tip cleaner
JPS6252080A (en) * 1985-09-02 1987-03-06 株式会社日立製作所 Stopper for magazine
JPS62101662U (en) * 1985-12-13 1987-06-29
US7866530B1 (en) * 2010-06-28 2011-01-11 Valeri Riachentsev Clean tip soldering station
US7870990B2 (en) 2005-04-29 2011-01-18 Sukhvinder Singh Dhanjal Cleaning a hot soldering iron tip using dry melamine sponge
CN104117752A (en) * 2013-04-25 2014-10-29 英业达科技有限公司 Electric soldering iron soldering station

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50101255A (en) * 1974-01-07 1975-08-11
JPS5498064U (en) * 1977-12-21 1979-07-11
JPS54163139U (en) * 1978-05-08 1979-11-15

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50101255A (en) * 1974-01-07 1975-08-11
JPS5498064U (en) * 1977-12-21 1979-07-11
JPS54163139U (en) * 1978-05-08 1979-11-15

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60158352A (en) * 1984-01-28 1985-08-19 Hisayo Maeda Automatic blood analyzing, judging and displaying apparatus
JPS60126272U (en) * 1984-02-02 1985-08-24 白光株式会社 soldering iron tip cleaner
JPH0216859Y2 (en) * 1984-02-02 1990-05-10
JPS6252080A (en) * 1985-09-02 1987-03-06 株式会社日立製作所 Stopper for magazine
JPS62101662U (en) * 1985-12-13 1987-06-29
US7870990B2 (en) 2005-04-29 2011-01-18 Sukhvinder Singh Dhanjal Cleaning a hot soldering iron tip using dry melamine sponge
US8109430B2 (en) 2005-04-29 2012-02-07 Sukhvinder Singh Dhanjal Cleaning a hot soldering iron tip using dry melamine sponge
US7866530B1 (en) * 2010-06-28 2011-01-11 Valeri Riachentsev Clean tip soldering station
CN104117752A (en) * 2013-04-25 2014-10-29 英业达科技有限公司 Electric soldering iron soldering station

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