JPS5819356A - Method for molding heat-resistant polymer - Google Patents

Abstract

PURPOSE:To melt-mold an arom. polyamide under mild conditions, by adding a high-boiling arom. compd. to an amorphous arom. polyamide. CONSTITUTION:0.1-40pts.wt. high-boiling arom. compd. having a b.p. of 200 deg.C or higher such as beta-naphthol is added to 100pts.wt. amorphous arom. polyamide having a glass transition point of 150-400 deg.C, an inherent viscosity of 0.5-3 and a repeating unit of the formula wherein Ar, is an arom. group, a heterocyclic group or a bivalent group composed of these groups in combination (these groups may be substituted with alkyl, cycloalkyl, aryl, alkoxy or halogen); two carbonyl groups attached to Ar1 are bonded to different two carbon atoms of Ar1; Ar2 is the same as Ar1, and Ar1, Ar2 may be the same or different groups; two N atoms attached to Ar2 are bonded to different two carbon atoms of Ar2. The mixture is molten by heating it, and extruded or compression-molded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for molding heat-resistant polymers, and more particularly to the heat-melt molding of substantially non-quality aromatic polyamides.

Generally, aromatic polyamides have excellent heat resistance, chemical resistance,
It has mechanical and electrical properties, and it can be said that there is an extremely large demand for it in fields that require these properties. However, similar to other aromatic heat-resistant resins such as polyamide-imide and polyimide, aromatic polyamide has an extremely high melt viscosity, or its melting point and decomposition temperature are close to each other, so it has not been used as a thermoplastic resin. It is quite difficult to perform conventional heat melt molding. Therefore, special compression molding is required to produce molded products, which results in poor productivity and difficulty in obtaining molded products with complex shapes. Furthermore, since it is difficult to obtain uniform molded products, the physical properties often cannot fully express the original characteristics of the resin, and therefore, they are only used in small quantities for special purposes. Among aromatic polyamides, crystalline polyamides such as meta-phenylene isophthalamide and para-phenylene terephthalamide have particularly excellent physical properties, but the moldability of these polyamides is extremely poor. It can be said that it is almost impossible to perform heat melt molding. Therefore, these crystalline aromatic polyamides are first processed into thread or cotton by processing a polymer solution, and then
Fibers, fabrics, and synthetic materials generally have extremely poor moldability and solvent solubility, so these resins are either subjected to heat-melt molding in the state of their precursor polyamic acid, or processed into a polymer solution containing polyamic acid. It is used in cast film molding, as a phenol, and as an adhesive. However, in these molding processes, it is difficult to remove the water produced as a by-product due to the ring-closing reaction of the amic acid moiety by chemical or physical means, and in the case of solution processing, removal of both water and solvent becomes a problem. The management of molding conditions, post-cure conditions, etc. to obtain uniform, void-free molded products is also complicated, resulting in poor productivity and high equipment costs. And because the cost of the molded product is high, its uses are limited.

On the other hand, several methods have been proposed for subjecting these high-performance heat-resistant resins to hot melt molding. For example, Japanese Patent Application Publication No. 17
-3'l'l'l A describes the heating melt molding method of aromatic polyamideimide containing an aromatic heterocyclic compound, and Tokko Shosa/-Kota 0 Otsu 7 describes the carbonization of aromatic benzenoids. Although heat-melt molding methods for aromatic polyamide-imide containing hydrogen-based compounds have been shown, it has also been shown that these methods are completely inapplicable to aromatic polyamides and aromatic polyimides.

The inventors of the present invention have completed the present invention as a result of intensive study on a method for manufacturing a hot-melt molded product that retains particularly the excellent properties of aromatic polyamide.

That is, the present invention is characterized by heating and melt-molding a non-quality aromatic polyamide consisting of seven or more types of repeating structural units represented by general formula (I) in the coexistence of a high-boiling aromatic compound. This is a method for molding heat-resistant polymers.

(-oc-Ar, -CONH-hr2-NH-1-CI
) However, in formula (I), Ar and Ar2 each have the following meanings.

Ar: A covalent group consisting of an aromatic or heterocyclic group or a combination thereof, or a group further substituted with an alkyl group, a cycloalkyl group, an aryl group, an alkoxy group, an atom, etc. In the above formula, Ar
The co carbonyl groups bonded to , are bonded to two different carbon atoms contained in Ar, respectively.

Ar: A group similar to Ar, which is the same as or different from Ar, and in the above formula, each nitrogen atom bonded to Ar2 is bonded to a different number of carbon atoms contained in Ar2.

To explain the above Ar and Ar more specifically, each of them is a divalent group consisting of an aromatic group, a heterocyclic group, or a combination thereof. When two or more of these groups are combined, for example, C., which has a direct carbon-carbon bond, is alkylene, I II
11RQO - or a different alkyl group, cycloalkyl group, aryl group. ) may be bonded via °C.

The non-quality aromatic polyamide in the present invention is a copolymer consisting of seven or more types of repeating structural units represented by the general formula (I), which exhibits a glass transition in the range from room temperature to 500°C. The aromatic polyamide has a crystalline melting point but no crystalline melting point. Here, the glass transition point and crystal melting point are measured using a differential scanning calorimeter (DSC).
When measuring the DSC curve by increasing the temperature of It is read as the melting point. The non-grade aromatic polyamide according to the present invention is preferably one having a glass transition point in the range of 750°C to 00°C, particularly in the range of 200'C to 330°C, from the viewpoint of moldability. Note that the above-mentioned polyamide was particularly selected because good molding is difficult even when the method of the present invention is applied to a crystalline polyamide different from the above-mentioned polyamide.

The manufacturing method of such aromatic polyamide is not limited (it may be manufactured by any method, but it is usually preferably derived from an aromatic diamine and an aromatic dicarboxylic acid halide, and In addition, compounds derived from aromatic diisocyanates and aromatic dicarboxylic acids are also good.In the case of the former, for example, methyl-co-pyrrolidone and diphenyl sulfone are reacted in a polar solvent such as dimethylacetamide at room temperature or at a low temperature of 10°C or less. Aromatic polyamides can be obtained by reacting in various polar solvents at temperatures ranging from 70θ℃ to 2Sθ℃.Also, aromatic polyamides include block copolymers with repeating structural units of the same or different types, or starting materials with co- or more types of repeating structural units. An alternating copolymer or a random copolymer consisting of is preferable.The logarithmic viscosity (θ/thi, concentrated sulfuric acid solution, 30°C) of these non-quality aromatic polyamides should be 0.3 or more, preferably 1 or more. is desirable from the viewpoint of physical properties such as various strengths of the molded product, and in practice, a number of 3 or less is sufficient.

In addition, the high boiling point i-group compound in the present invention refers to a high boiling point,
Preferably, it is an aromatic hydrocarbon or a heterocyclic compound having a boiling point of 200°C or more, and more specifically, the aromatic hydrocarbon is a mononuclear or polynuclear compound having a boiling point of 200°C or more and having at least 7 pesozenoid rings. These are benzenoid compounds or substituted products thereof with hydroxyl group, ether group, carbonyl group, cyano group, amino group, sulfone group, etc.

Heterocyclic compounds are those in which seven or more terror atoms (especially nitrogen and sulfur) are introduced to form an aromatic ring.
Furthermore, aromatic hydrocarbons or complex ring compounds in which the same heterocycles are combined, or substituted products thereof with hydroxyl groups, ether groups, carbonyl groups, cyano groups, amino groups, sulfone groups, etc., and compounds with a boiling point of 200°C or higher. be.

Some specific examples of these high-boiling aromatic compounds include: Examples of aromatic hydrocarbons include β-naphthol, dark alcohol, α-naphthol, alcohol, and di-t-naphthol.
Butyl-p-cresol, Co.

Co-isopropylidene bisphenol, p-phenylphenol, B'-dichlorodiphenyl ether, benzophenone, O-hydroxybenzophenone, anthraquinone, tac'-dichlorodiphenylketone, %4'-bis(dimethylamino)benzophenone, co-hydroxybenzophenone xypenzophenone, p-cyanodiphenyl ether, tada'-diaminodiphenyl ether, Kug-l-dichlorodiphenyl ether, diphenyl sulfone, 'l, 'I'-9 chlordiphenyl sulfone,
<z'-diaminodiphenylsulfone, <z'-diaminodiphenylsulfone, <z'-diaminodiphenylsulfone,
dimethylamino)diphenylmethane, %4'-diaminodiphenylmethane, triphenylamine, <4+'-bis(2-chloroanilino)methane, triphenylphosphine, tricresyl phosphate, triphenylphosphite, di-n-butyl phthalate , diphenyl terephthalate, etc., and the heterocyclic compounds include, for example, N-phenylpyrrole, cophenylated indole, cophenylbenzofuran, N-phenylimidazole, N-methylbenzimidazole, λ, S-diphenyloxazole, left-methyl Benzothiazole, N-phenylpyrazole, benzotriazole, cophenylbensotriazole, /-phenyl-12,'1-triazole, Z3-diphenyl-1,2,'l-triazole, cophenylpyridine, 3. o-diphenylpyridazine, cophenylpyrazine, co, ri o-triphenyl-8-) riazine, co, 1It-diamino-o-methyl-8-) liazine, 1.2. '! Examples include -benzotriazine, benzyl cyanuric acid, coumarin, benzo-1'l-thiadiene, -hydroxyquinoline, cubenzoylquinoline, benzoquinoline, acridine, phenanthridine, phenanthroline, and the like. Among these high-boiling aromatic compounds, phenylphenol, diphenylmethane, diphenyl ether, diphenylsulfone compounds, and N-1-substituted imidazole, triazole, oxazole, and triazine compounds are particularly preferred from the viewpoint of improving processability.

Further, the boiling point of these compounds is 20θ°C or higher as described above, but preferably 2gO°C or higher, particularly 300°C or higher from the viewpoint of obtaining a uniform molded product. There is no particular upper limit to this boiling point, but generally a boiling point below 00°C is sufficient.

When aromatic diamine is used as a starting material for producing the non-grade aromatic polyamide used in the present invention, for example, meta-phenylene diamine, para-phenylene diamine, 2. 'I-)-Toluylene diamine, B-Toluylene diamine, '-Diaminodiphenyl ether,...? , 4”-diaminodiphenyl ether, 6ψ-
Diaminodiphenylmethane, 11. lI′-diaminodiphenylsulfide, tac′-diaminodiphenylsulfone, benzidine, ψ-diaminoazobenzene, N,
v-Meta-phenylenebis(meta-aminobenzamide), N',N'-bis(3-aminophenyl)isophthalamide, 2,! ;-His (hal-7 minophenyl)
-i 3. II-oxadiazole, co,2'-paraphenylenebis(5-aminobenzoxazole),
2-diaminopyridine, co, left-diamino-7a, oxadiazole, 2-C3'-aminophenyl)-teraminobenzoxazole, λ, lI-diamino-6
-Methyl-s-triazine, λ, diamino-6-phenyl-s-triazine, para-bis(lI-aminophenoxy)benzene, meta-bis(lI-aminophenoxy)benzene, 3. Examples include kudiaminobenzanilide and bis(guaminophenyl)diethylsilane. These may be used alone or as a mixture. On the other hand, when diisocyanates are used, diamines in which two incyanate groups are bonded to the organic residues are used.

When an aromatic dicarboxylic acid halide is used as the other component, for example, isophthalic acid chloride, terephthalic acid chloride, diphenyl ether-44'-dicarboxylic acid chloride, diphenylsulfone-dicarboxylic acid chloride, etc.
Dicarboxylic acid chloride, biphenyl-dicarboxylic acid chloride, thiophenco, S-dicarboxylic acid chloride, biridine, O-dicarboxylic acid chloride, naphthalene, 6-dicarboxylic acid chloride, biphenylmethane-bis-trimeric imide Acid chloride, 444t'-diphenyl ether-
Examples include bis-trimellitic imidic acid chloride. These may be used alone or as a mixture. On the other hand, when a dicarboxylic acid is used, one in which two carboxylic acid groups are bonded to the organic residue of dicarboxylic acid parite is used.

The high boiling point aromatizing food added when carrying out heat melt molding of aromatic polyamide by the method of the present invention is suitable for 100 parts by weight of aromatic polyamide from the viewpoint of improving moldability and physical properties of the obtained molded product. 1. The amount is usually in the range of 07 to 110 parts by weight, and θS-5 parts by weight is particularly preferred.

The method of addition is not particularly limited, and any method may be used as long as it can be mixed uniformly by the time the molding is completed. The mixed polymer is normally a solid, the same as the polymer itself. In addition, when heating and melting molding a coarsely mixed polymer in powder form, it is of course possible to directly feed the coarsely mixed powder into a molding machine and process it, but in general, it is possible to improve the uniformity of the mixture and to For convenience in supplying the strands to other plants or handling them, it is preferable to form them into molten strands using an extruder and then to form them into chips. In this case, the type of aromatic compound,
By changing the amount, it is possible to control the moldability and workability of the polyamide and the properties of the resulting molded product. In order for the molded article of the present invention to maintain excellent heat resistance, it is necessary to select the aromatic compound to be added that has as high a boiling point as possible, high heat resistance, and good compatibility with the polymer. It is desirable to suppress the amount to the minimum amount necessary for molding the polymer.

The substantially non-grade aromatic polyamide obtained by the present invention can be used in various structures as heat-resistant fibers, films, or engineering resins by utilizing its excellent properties, especially heat resistance, mechanical, and electrical properties. It has applications in materials, mechanical parts, electrical and electronic parts, etc. In addition, when processing these molded products, various fillers such as glass fiber,
Glass cloth, asbestos, whiskers, metal fibers, carbon fibers, crystalline aromatic polyamide fibers, silica powder, alumina powder, carbon black, acid clay, calcium carbonate,
A reinforced molded product can also be produced by appropriately mixing barium sulfate or the like.

According to the present invention, the hot melt molding conditions are in the range of 2G0°C-+OO°C in extrusion molding, but if no filler is mixed or the amount of filler is less than 20% by weight, Preferred extrudates are obtained between 230°C and 320°C. Furthermore, when producing a thick molded product by injection molding, a molding machine used for molding ordinary engineering resins is used, at a temperature of 2gθ℃ to 330℃, and an injection pressure of g o OkgA.
~/! ; Can be easily molded within the range of 00 kg/cII. In addition, when producing thick molded products by compression molding, the temperature is 10θ℃~30θ℃, 50kgA~200kg
l? /d, a uniform void-free molded product can be obtained. Furthermore, it goes without saying that it can be extruded into a sheet or film, and can be subjected to various powder moldings.

As mentioned above, the feature of the present invention is to use a substantially non-grade aromatic polyamide that can fully exhibit the excellent properties of aromatic polyamide, and to add a small amount of high-boiling aromatic compound to this as a processing aid. By adding it as an agent, aromatic polyamides, which were conventionally difficult to heat and melt mold, can now be melt molded under mild conditions in the same way as ordinary thermoplastic resins.

EXAMPLES The actual state of the present invention will be explained below with reference to examples, but the present invention is not limited only by these examples.

Various physical property values in the present examples and comparative examples were determined by the following measurement methods.

Heat deformation temperature: ASTM-D og g (/g ot kVd) Tensile strength: ASTM-D 3 g Bending strength: ASTM-D790 Glass transition point: Finely ground polymer powder or extruded pellet using a differential scanning calorimeter /θ in nitrogen atmosphere, heating rate g'
It is expressed as the temperature at which the baseline shift occurs when the DSC curve is measured by raising the temperature at C/1 nin.

Crystal melting point; expressed as the endothermic peak temperature in the high temperature range of the above measurement.

Decomposition start temperature: Using a differential calorimeter, 10ynr7 of polymer powder was heated for 10's under an air flow (flow rate of about 1101JAnin).
nin (7) 70 curve and DT while increasing the temperature at the heating rate
A. Measure the curve. Some volatilization due to adsorbed moisture is observed between room temperature and 300°C, followed by a weight loss process due to decomposition and volatilization of the resin. Therefore, the weight at 300°C was considered to be the weight of only the resin, and the temperature at which a decrease in % weight was observed based on this weight was defined as the decomposition start temperature.

Logarithmic viscosity (η1nh); In (t/lo) η1nh=□, where tO: flow time of the solvent in the viscometer;
t: flowing time of a dilute polymer solution in the same solvent in the same viscometer, C: concentration in grams of polymer in 100 ml of solvent. In the examples, 0, /11 polymer 7
The concentration of 100 ml of concentrated sulfuric acid is shown as the value measured at a temperature of 30°C.

Example/In a 4-hole Sl flask equipped with a stirrer, a reagent inlet, and a nitrogen gas inlet, 2. 'l-Toluylenediamine and 2
．． 215.3 G of a mixture of go to 20 mol of O-toluylene diamine was dissolved in 2 g and 63 ml of dehydrated and dried N,R-dimethylacetamide (DMA). After completely dissolving, add isophthalic acid chloride 3! while stirring under water cooling. ; Add 7.3 g in solid form at once. After the addition, the mixture was stirred for several hours while cooling with water. After that, DMA100 more
The resulting solution was added little by little to 4 times the volume of methanol under strong stirring to precipitate the polymer, which was then filtered off. The filtered polymer was further washed with stirring and filtered three times in 100ml of methanol, and then 75%
It was dried for 3 hours at 0°C under a reduced pressure of ~3wa'H& to obtain a white powder polymer 'I'13f;i. The logarithmic viscosity of this polymer was /3S. In addition, the glass transition point of this polymer is 2°C, and the decomposition starting temperature is 'l
It was 05'C. This polymer is defective and D
No endothermic peak due to crystal melting was observed in SC measurement, and no crystallinity was observed in X-ray diffraction.

When 300 g of this polymer powder was mixed with p-phenylphenol powder/Sg and put into a small extruder (2.0% Da, screw L = 20, CA = 12°, cylinder temperature 370°C), a light brown color was formed. A strand was obtained, which was further pelletized using a cutter. The resin extrusion rate was /IIOfi//0 minutes. In addition, this pellet was compression molded (300℃, 10 minutes, !; OK
The physical properties of the brown transparent press sheet obtained were as follows.

Heat deformation temperature: 232°C Tensile strength: / / 30 Wan Bending strength: / 5 g OkgA Comparative Comparison Example The processability of the polymer obtained in Example / without adding any additives is investigated using compression molding and a small extruder. and below,
Although compression molding of amorphous aromatic polyamide is possible, the molding conditions are strict, and the melt viscosity is extremely high in terms of melt flowability using an extruder. It turns out that extrusion processing is quite difficult.

Compression moldability: J4tX#7Xθ3 core a flat plate mold heating temperature pressure between flat plate molds (kg/cIl) 2gO, 10
，! 0 Non-uniformity with many non-melting parts o, io
, 200 Same as above 300.10.30 Same as above 300.10.100 Some unmelted parts, non-uniform 300.10.200 Complete melting, uniform brown transparent extrusion moldability; yI20'X, extruder, screw L / D = 20. C24 = 72 cylinders / Extrusion amount Properties 2A
0 300 300 Hardly possible to melt extrude, 2
g0 3 Hiro0 3'10 30~q0-Ushio Inamajimaru.

Examples 2 to g, Comparative Examples Using the same equipment as in Example, a polymer of qgog was produced in the same manner as in Example, except that half of the isophthaloyl chloride was replaced with terephthaloyl chloride. . The logarithmic viscosity of this polymer is /37, the glass transition point is 2 A O'C, and the decomposition onset temperature is 4/2.
'C. Furthermore, it was confirmed by DSC and X-ray diffraction measurements that this polymer was defective. This polymer is heated at 300℃.

A brown transparent sheet was obtained by compression molding at 200 kg/crIL for 70 minutes. The above production was carried out 5 times to prepare about II kg of polymer, and each qoog powder was uniformly mixed with each gg of the following compound powder, or the polymer alone was extruded in the same manner as in Example. A uniform transparent pellet was obtained. Using this pellet, the physical properties of a press sheet obtained by compression molding in the same manner as in Example were measured.

The extrusion amount and physical properties of the press sheet are shown in Table/.

As is clear from the table, by adding a small amount of a high-boiling aromatic compound, the melt fluidity of the polymer is significantly improved, and it can be molded using a normal molding machine without any problems. Furthermore, due to the plasticizing effect of the additive on the polymer, the glass transition point and heat distortion temperature were slightly lower than those of the unadded polymer, but no other decrease in mechanical strength was observed.

Additives; p-phenylphenol, diphenylsulfone, kuku'
-diaminodiphenylsulfone, each q'-bis(2-chloroanilino)methane, each q'-diaminodiphenyl ether, N-methyl-benzimidazole 1.2. ll
-Diamino-ot-methyl-8-triazine.

Example? Using equipment similar to Example/, isophthalic acid 300.
79C1g10mol), toluylene diisocyanate (
2, 'I and co, O pair of gO, 20 molti mixture)/70.2g<0.9773 mol), 1AIIl
-Diphenylmethane diisocyanate 2q 6g (Q9
773 mol), isophthalic acid monosodium salt/3. A
OfjCo, 0723 mol) and dry N-methyl-two-pyrrolidone (NMP) 397! ; mix 720 ml
The reaction was carried out at ℃ for 9 hours. The reaction became noticeable when the contents reached gθ°C, and carbon dioxide gas was actively generated, and when the temperature reached 700°C, the viscosity of the solution increased considerably. /20'C, the solution turned brown, and after 2 hours it became a deep brown and extremely viscous state, with almost no carbon dioxide gas being observed. After reacting for an additional 2 hours, the viscosity rose to such an extent that it interfered with stirring when it was cooled to room temperature, so a total of 300 m1
Intermittent dilutions were made with NMP. After cooling, the polymerization solution was poured into 9 times the volume of strongly stirred methanol to precipitate the polymer, and the filtered polymer was thoroughly washed with methanol and dried under reduced pressure for 3 hours at ISO 300°C to give a yellow color. Brown polymer powder! :109 was obtained. The logarithmic viscosity of this polymer was /Sl. The glass transition point of this polymer was J9°C, and the decomposition initiation temperature was tI/Otsu°C.

Furthermore, it was confirmed by DSC and X-ray diffraction measurements that this polymer was defective.

2. Conophorimer powder lloog. A mixture of gg of 'l-diamino-O-methyl-8-triazine was added and mixed using an extruder in the same manner as in Example to obtain transparent dark brown pellets. The amount of resin extruded was 209/10 minutes.

In addition, a press sheet having a thickness of 3.2% was prepared by compression molding similar to that in Example, and its physical properties were measured. The physical property values are shown below.

Heat distortion temperature; 23 ll'C Tensile strength; / 0! ; 3kWa1 bending strength; /3
70kl/cd Comparative Example 3 When the processability of the polymer obtained in Example 9 without adding any additives was investigated using compression molding and a small extruder in the same manner as in Comparative Example, the following results were obtained. It is clear that special molding conditions are required and that extrusion processing is quite difficult under normal conditions.

Compression moldability: 2'ly, 10x0.32an flat plate mold, 70,200 mm, some unmelted parts, non-uniformity: 30
0, /θ, 10θ Same as above 30
θ, 10.200 Complete melting, uniform brown transparent extrusion moldability; Gray 0% extruder, Screw L/D =; 10
, C/R;=/, 2 cylinders out -/! -2, Die/Extrusion amount Properties 2gθ 3t0 3
Guso-t,, o - Autopsy death Moeji Mamo Example 10
．． //, Comparative Example tS An aromatic polyamide was synthesized in the same manner as in Example 9 using the monomer composition shown in Table 1. It was confirmed by DSC and X-ray diffraction measurements that these polymers were defective.

These polymer powders, ;toog and Tac'-diaminodiphenylsulfone 209 were added and mixed, and the processability was evaluated using an extruder in the same manner as in Example 1. The results are shown in Table 1.

Comparative Example 3. Processability when each polymer does not contain the above additives. Indicated by 'l.

As is clear from the results in the table, the effect of tata'-diaminodiphenylsulfone as a processing aid is remarkable and it can be seen that the melt processability is greatly improved.

Comparative Example Metaphenylenediamine/ was prepared in the same manner as Example B/
g6.9g and isophthalic acid chloride 3! ;0. '1g
Polymetaphenylene isophthalamide was synthesized using The obtained polymer had a ηinh of //9.

This polymer has a glass transition point of 320"G crystal melting point r
It was confirmed by DSC measurement that it was a crystalline polyamide exhibiting a temperature of 20°C. Compression molding was also attempted using this polymer at 3SO°C and 00 kg/A for 20 minutes, but it did not melt, resulting in a non-uniform and brittle sintered sheet. Furthermore, extrusion molding of 70 parts of various high-boiling aromatic compounds used in the present invention was added to 100 parts of this polymer using the same extruder as in Example 1, but none of the results showed results. At temperatures below 1IOθ°C, extrusion in a molten state could not be performed, and at temperatures above this, decomposition occurred due to residence in the extruder for a long time, and molding could not be performed.

Claims (1)

[Scope of Claims] / Characterized by heating and melt-molding a non-quality aromatic polyamide consisting of seven or more types of repeating structural units represented by the general formula (r) in the coexistence of a high-boiling aromatic compound. A method for molding a heat-resistant polymer. (-QC-Ar, -CONH-Ar2-NH-)
(I) However, in formula (I), Ar and Ar each mean the following. Ar: A covalent group consisting of an aromatic or heterocyclic group or a combination thereof, or a group in which these groups are further substituted with an alkyl group, cycloalkyl group, aryl group, alkoxy group, halogen atom, etc. In the above formula, Ar1
The carbonyl groups bonded to Ar are each bonded to two different carbon atoms contained in Ar. Ar: A group similar to Ar, which is the same as or different from Ar, in which the two nitrogen atoms bonded to Ar in the above formula are bonded to different carbon atoms contained in Ar2, respectively. ing.