JPS58191658U - 発光素子リ−ドフレ−ムの樹脂液塗布装置 - Google Patents

発光素子リ−ドフレ−ムの樹脂液塗布装置

Info

Publication number
JPS58191658U
JPS58191658U JP1982089692U JP8969282U JPS58191658U JP S58191658 U JPS58191658 U JP S58191658U JP 1982089692 U JP1982089692 U JP 1982089692U JP 8969282 U JP8969282 U JP 8969282U JP S58191658 U JPS58191658 U JP S58191658U
Authority
JP
Japan
Prior art keywords
resin liquid
light emitting
emitting device
liquid coating
lead frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982089692U
Other languages
English (en)
Inventor
永「淵」　辰彦
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1982089692U priority Critical patent/JPS58191658U/ja
Publication of JPS58191658U publication Critical patent/JPS58191658U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は発光素子リードフレームを一部省略して示す正
面図、第２図は発光素子リードフレームの要部を示す斜
視図、第３図ａ　”−ｃは従来のプレディップ工程を示
す説明図、第４図はプレディップ工程後の発光素子リー
ドフレームの要部を示す斜視図、第５図は本考案の実施
例における発光素子リードフレームの樹脂液塗布装置の
使用状態を一部断面で示す斜視図である。 １１・・・真空容器、ｆｌａ・・・底板、ｌｌｂ・・・
蓋、１２・・・ヒンジ、１３・・・パレット受は台、１
４・・・樹脂液槽、１５・・・支持棒、１６・・・樹脂
液、１７・・・パレット、１８・・・発光素子リードフ
レーム。 第３図　　　　　　１　　　′ ２１ １「 第４図 ？９８ ｓ−４１ｇ

Claims (1)

    【実用新案登録請求の範囲】
  1. 開閉自在な蓋を有する真空容器と、該真空容器内に配設
    され、複数の発光素子リードフレームか装着されたパレ
    ットを支持するパレット支持部材と、前記真空容器内に
    、収容された樹脂液が前記リードフレームと離接するよ
    うに上下動可能に配設された樹脂液槽とを具備したこと
    を特徴とする発光素子リードフレームの樹脂液塗布装置
    。
JP1982089692U 1982-06-16 1982-06-16 発光素子リ−ドフレ−ムの樹脂液塗布装置 Pending JPS58191658U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982089692U JPS58191658U (ja) 1982-06-16 1982-06-16 発光素子リ−ドフレ−ムの樹脂液塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982089692U JPS58191658U (ja) 1982-06-16 1982-06-16 発光素子リ−ドフレ−ムの樹脂液塗布装置

Publications (1)

Publication Number Publication Date
JPS58191658U true JPS58191658U (ja) 1983-12-20

Family

ID=30098285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982089692U Pending JPS58191658U (ja) 1982-06-16 1982-06-16 発光素子リ−ドフレ−ムの樹脂液塗布装置

Country Status (1)

Country Link
JP (1) JPS58191658U (ja)

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