JPS58189093U - solder wire - Google Patents
solder wireInfo
- Publication number
- JPS58189093U JPS58189093U JP8742382U JP8742382U JPS58189093U JP S58189093 U JPS58189093 U JP S58189093U JP 8742382 U JP8742382 U JP 8742382U JP 8742382 U JP8742382 U JP 8742382U JP S58189093 U JPS58189093 U JP S58189093U
- Authority
- JP
- Japan
- Prior art keywords
- solder wire
- solder
- solder part
- wire
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例のはんだ線の半径方向の断面
図、第２図は第１図に示すはんだ線の製造装置を示す図
、第３図はボビンに巻装されたはんだ線を示す図、第４
図及び第５図は第１図に示すはんだ線を用いた自動はん
だ付けを示す図、第６図は本考案の他の実施例のはんだ
線の半径方向の断面図である。
１：はんだ線、２：はんだ部分、３：芯線。Figure 1 is a radial cross-sectional view of a solder wire according to an embodiment of the present invention, Figure 2 is a diagram showing the solder wire manufacturing apparatus shown in Figure 1, and Figure 3 is a solder wire wound around a bobbin. Figure 4 showing
5 and 5 are diagrams showing automatic soldering using the solder wire shown in FIG. 1, and FIG. 6 is a radial cross-sectional view of the solder wire according to another embodiment of the present invention. 1: solder wire, 2: solder part, 3: core wire.
Claims (1)
部分の軸方向に被包され上記はんだ部分より融点が高（
かつ巻取り自在な芯線とを具備することを特徴とするは
んだ線。The linear solder part and the solder part are covered in the axial direction of the solder part and have a higher melting point than the solder part (
A solder wire characterized by comprising a core wire that can be freely wound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8742382U JPS58189093U (en) | 1982-06-14 | 1982-06-14 | solder wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8742382U JPS58189093U (en) | 1982-06-14 | 1982-06-14 | solder wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58189093U true JPS58189093U (en) | 1983-12-15 |
Family
ID=30096140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8742382U Pending JPS58189093U (en) | 1982-06-14 | 1982-06-14 | solder wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010082599A1 (en) * | 2009-01-19 | 2010-07-22 | 株式会社日本スペリア社 | Wire solder, method of feeding the same and apparatus therefor |
-
1982
- 1982-06-14 JP JP8742382U patent/JPS58189093U/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010082599A1 (en) * | 2009-01-19 | 2010-07-22 | 株式会社日本スペリア社 | Wire solder, method of feeding the same and apparatus therefor |
| EP2380695A1 (en) * | 2009-01-19 | 2011-10-26 | Nihon Superior Co., Ltd. | Wire solder, method of feeding the same and apparatus therefor |
| CN102281987A (en) * | 2009-01-19 | 2011-12-14 | 日本斯倍利亚社股份有限公司 | Wire solder, method of feeding the same and apparatus therefor |
| EP2380695A4 (en) * | 2009-01-19 | 2013-09-11 | Nihon Superior Co Ltd | Wire solder, method of feeding the same and apparatus therefor |
| JP5635913B2 (en) * | 2009-01-19 | 2014-12-03 | 株式会社日本スペリア社 | Wire solder and its supply method and supply device |
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