JPS58187145U - Wafer transfer arm - Google Patents
Wafer transfer armInfo
- Publication number
- JPS58187145U JPS58187145U JP8465282U JP8465282U JPS58187145U JP S58187145 U JPS58187145 U JP S58187145U JP 8465282 U JP8465282 U JP 8465282U JP 8465282 U JP8465282 U JP 8465282U JP S58187145 U JPS58187145 U JP S58187145U
- Authority
- JP
- Japan
- Prior art keywords
- transfer arm
- wafer transfer
- wafer
- sectional shape
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図から第３図は、本考案の一実施例を説明するもの
で、第１図は、のせ部付近の搬送アームの平面図、第２
図は、第１図のＡ−Ａ視断面図、第３図は、第１図のＢ
−Ｂ視断面図である。
１０・・・・・・アーム、１１・・・・・・のせ部。1 to 3 are for explaining one embodiment of the present invention.
The figure is a sectional view taken along line A-A in Figure 1, and Figure 3 is a cross-sectional view taken along line B in Figure 1.
-B is a sectional view. 10... Arm, 11... Rest part.
Claims (1)
送アームにおいて、前記のせ部の断面形状を、テーパ状
に上方に開口すると共に、底部の寸法が前記ウェーハの
許容寸法公差より決まる最小寸法よりも小さく、かつ、
開口部の寸法がウェーハの許容寸法公差より決まる最大
寸法よりも大きい断面形状としたことを特徴とするウェ
ーハ搬送アーム。 ２−前記のせ部を板を折曲して形成した実用新案登録請
求の範囲第１項記載のウェーハ搬送アーム。 ３ 前記板を摩擦係数の小さい材料とした実用新案登録
請求の範囲第２項記載のウェーハ搬送アーム。[Claims for Utility Model Registration] 1. A wafer transfer arm in which the arm is provided with a wafer resting part, the cross-sectional shape of said resting part being tapered upward, and the dimensions of the bottom part being equal to the permissible dimensions of said wafer. smaller than the minimum dimension determined by tolerance, and
A wafer transfer arm characterized in that the cross-sectional shape of the opening is larger than the maximum dimension determined by the allowable dimensional tolerance of the wafer. 2- The wafer transfer arm according to claim 1, wherein the mounting portion is formed by bending a plate. 3. The wafer transfer arm according to claim 2, in which the plate is made of a material with a small coefficient of friction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8465282U JPS58187145U (en) | 1982-06-09 | 1982-06-09 | Wafer transfer arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8465282U JPS58187145U (en) | 1982-06-09 | 1982-06-09 | Wafer transfer arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58187145U true JPS58187145U (en) | 1983-12-12 |
Family
ID=30093582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8465282U Pending JPS58187145U (en) | 1982-06-09 | 1982-06-09 | Wafer transfer arm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187145U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5017330U (en) * | 1973-06-11 | 1975-02-25 |
-
1982
- 1982-06-09 JP JP8465282U patent/JPS58187145U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5017330U (en) * | 1973-06-11 | 1975-02-25 |
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