JPS58187142U - スプ−ルケ−ス - Google Patents

スプ−ルケ−ス

Info

Publication number
JPS58187142U
JPS58187142U JP8507582U JP8507582U JPS58187142U JP S58187142 U JPS58187142 U JP S58187142U JP 8507582 U JP8507582 U JP 8507582U JP 8507582 U JP8507582 U JP 8507582U JP S58187142 U JPS58187142 U JP S58187142U
Authority
JP
Japan
Prior art keywords
spool
container
height
inner bottom
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8507582U
Other languages
English (en)
Japanese (ja)
Other versions
JPH019157Y2 (enrdf_load_stackoverflow
Inventor
柏木　修
一色　喜美雄
村岡　徳夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP8507582U priority Critical patent/JPS58187142U/ja
Publication of JPS58187142U publication Critical patent/JPS58187142U/ja
Application granted granted Critical
Publication of JPH019157Y2 publication Critical patent/JPH019157Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP8507582U 1982-06-08 1982-06-08 スプ−ルケ−ス Granted JPS58187142U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8507582U JPS58187142U (ja) 1982-06-08 1982-06-08 スプ−ルケ−ス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8507582U JPS58187142U (ja) 1982-06-08 1982-06-08 スプ−ルケ−ス

Publications (2)

Publication Number Publication Date
JPS58187142U true JPS58187142U (ja) 1983-12-12
JPH019157Y2 JPH019157Y2 (enrdf_load_stackoverflow) 1989-03-13

Family

ID=30093988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8507582U Granted JPS58187142U (ja) 1982-06-08 1982-06-08 スプ−ルケ−ス

Country Status (1)

Country Link
JP (1) JPS58187142U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0183769U (enrdf_load_stackoverflow) * 1987-11-24 1989-06-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0183769U (enrdf_load_stackoverflow) * 1987-11-24 1989-06-05

Also Published As

Publication number Publication date
JPH019157Y2 (enrdf_load_stackoverflow) 1989-03-13

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