JPS58185670A - Method for bondig wooden material - Google Patents

Abstract

PURPOSE:To provide a low-cost wood adhesive of a high bond strength, by a process wherein crude diphenyldiamine diisocyanate (MDI) is fractionated to give substantially pure MDI, and the residue given by further distillation of said MDI is used for a wood adhesive. CONSTITUTION:Phosgen is reacted with diphenylmethanediamine given by condensation of aniline with formalin in the presence of chlorobenzene, which is recovered after the reaction, to yield crude diphenylmethane diisocyanate (hereinafter referred to as MDI). The crude MDI is subjected to primary distillation to be separated into two fractions: substantially pure MDI and polymeric MDI. The former MDI is further subjected to secondary distillation to prepare pure MDI. The residue from the secondary distillation, either alone, dissolved in a solvent such as methyl acetate, or blended with a water-sol. urea resin, etc., is used as an adhesive for wooden materials such as particle board, plywood, etc.

Description

Detailed Description of the Invention: This is a method for bonding wood materials that can be used when manufacturing wood materials such as particle board, plywood, and laminated wood.
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Incyanate compound from Yorimine as an adhesive for wood materials,
In particular, polymeric MDI (pentanuclear,
(containing many polynuclear bodies such as tetranuclear bodies) have been used. MDI is obtained by converting diphenylmethanediamine 1 obtained by combining aniline and formalin, but the product K actually contains various polynuclear substances. Therefore, in order to obtain pure MDL industrially, it is currently first distilled and fractionated into almost pure MDL and polymeric MDI to produce -C. The raw materials for this polymeric &1DIij foam polycrethane,
Used as an adhesive for particle board. On the other hand, nearly pure μDI is further distilled and used for elastomers and the like, but the residue produced in the distillation process has been either concentrated and pulverized or burned. This is polymeric - DI is 70-80% for dinuclear and hexanuclear bodies.
However, the Jo period residue contains many hexanuclear bodies or more (sometimes over 90%).It also contains some waste such as iron, and is highly reactive.) This is because it could not be used as #ILplF for foamed Horikurukon because of its large rank.

This invention is for use in the above-mentioned fishing rod, namely, by primary distillation of the crude MDI obtained in the process of manufacturing '■ MDiji, 'Lk1! ! 1liA stylish MDI and polymeric MD
After dividing into L, it is further distilled to pure DL1 in the upper atmosphere, and the residue tO! ! A method for bonding wood materials, characterized by bonding the wood materials using the same method. A special # that has all the features of arriving at VT mandatory m1! Scope of FIit rice Il of wood materials listed in item 1! Swimming too hard. The method for bonding wood materials according to Patent St. 88% Paragraph 1, characterized in that the residue is dissolved in a solvent and used to bond the wood materials. Adhesion of wood materials as described in Section I! of patent aX, which is characterized by the use of a mixture of residue and polymeric MDI obtained by primary distillation. Method. y and 1-■ The residue is mixed with water-soluble acid** fat, water-soluble phenol 11 & 1. EMUL 737 A method for producing a wood material according to the scope of patent No. 1, characterized in that it is added to an adhesive such as a phenolic resin.

y is a uniform implementation term.

This invention will be explained in detail by way of examples.

In the 70-chart of Fig. 1i1FiMDI, diphenylmethanediamine obtained by combining aniline and formalin is phosgenated in the presence of lorpensane, and then chlorobenzene is recovered to obtain MDI of SAW.
By primary distillation of this MDL manufactured by @, the tl is divided into pure MDI and polymeric MDL. The pure MDI described above is further distilled to obtain pure MLI, and the residue produced during this distillation is utilized in the present invention.

The first method of use is to use the residue alone as an adhesive for wood materials. This method is the easiest and cheapest to use. Incidentally, in this invention, the term "used alone" also includes those in which the residue is made into a self-emulsifying type with a surfactant or the like.

The second method of use is to use the residual tril in a solvent such as methyl as a binder for wood materials. If this method is used, the viscosity can be adjusted using ciIn, and the workability is good.

The 6th usage @ is to mix it with MDL which is obtained by next steaming and use it as a wood material (D adhesive). Even with this method, the viscosity can be adjusted to 01. Yes, it has good workability.The fourth use is water-soluble urea resin, water-soluble phenol 41t[il, emulsion!! Added to adhesives such as phenolic resin, and used as an adhesive for wood materials. With this method, it is of course possible to adjust the viscosity igi*, and the characteristic sound of both adhesives to be mixed can be utilized.

In the present invention, the adhesion performance will be further improved if solid sediments such as iron are removed by applying a residual t*m film.

Since this invention is constructed as described above, it has the following effects.

■ It is extremely inexpensive as a nose item can be used.

■ Since there are many polynucleates, there is little penetration into the wood material, resulting in a high adhesive strength to the wood material. Moreover, since it contains many polynuclear bodies, it has high reactivity, can be coated with dark tSt during pressing, and can bond wood materials with higher moisture content than before.

[Example 1J Pure D-King manufactured by Nippon Polyurethane (trade name: Millione) The solid precipitate was removed from the residue produced in distillation fJi, which is the purification process for obtaining MTi, using a filter to obtain a liquid residue (1111). Next. Using this residue, the thickness was 15cm under the following conditions.

I built Hima 0870 Birdy Crubot Tom t*.

Chip moisture content 15% Heat pressure temperature 150°C Heat pressure 251 Adhesive agent addition rate (surface layer 6% by weight relative to chip weight, inner layer 4% by weight Heat pressure time 2 minutes, 25 minutes, 5 minutes, 4 minutes [implementation] Example 2] Liquid residue of Example 1 and Holimelink MD as adhesive
I (manufactured by Nippon Polyurethane, product name Millionate MRφ6
3ta was made on particle board under the same conditions as in Example 1 except that a mixture of 00) and t5:5 was used.

[Comparative Example 1] Per-cycle board C was manufactured under the same conditions as in Example 1, except that Holimelink MDI (manufactured by Nippon Polyurethane, trade name: Millionate MRφ600) was used as the adhesive.

[Example 6] The adhesive used in Example 1 was replaced with water-soluble phenol 411i.
Using an adhesive that has been added and stirred at a solid content ratio of 10% to the lubricant marking agent, a thickness of 15-0 and a specific gravity of 0.70 are obtained under the following conditions.
Particle board D was manufactured.

Chip moisture content 5% Heat pressure temperature 180℃ - Pressure specific force 50kQ stimulant added (based on chip weight) Surface layer 10% Inner layer 8% Heat pressure time 6 minutes, 6.5 minutes, 4 minutes, 5 minutes [ Example 4] The adhesive used in Example 2 was replaced with water-soluble phenol
Adhesive L7' for 1* was prepared by adding and stirring 10% solid content to 81il shaking agent (the others were manufactured using particle board tta under the same conditions as in Example 6).

[Comparative Example 2] The adhesive used in Comparative Example 1 was replaced with *soluble phenolic resin
Adhesive 1* with 10% solid content added and stirred
Particle board p was used under the same conditions as Example 6.
t-manufactured.

The 1-meter peel strength, fudama bending strength, and residual value L (JIS 43 test) of particle boards A to F manufactured in Examples 1 to 4 and Comparisons 111 and 2 were measured. The results are shown in Table 1 and Table 2.

Table 1 [Example 5] Adhesive used in Example 6: 100% Amount: 11K Flour: 10%
Using 5 parts by weight of wood powder and 5 parts by weight of wood flour as an adhesive, a mixture of 511 m1 in thickness and 1 iut was manufactured under the following conditions.

Lauan veneer for top plate thickness 1. Owm 15% lauan veneer for medium board Thickness 6.2 - 0% adhesive application amount
1901//rd (single side) cold pressure 10
%l Heat pressure for 20 minutes 10%1 120
℃ 2 minutes, 2.5 minutes, 6 minutes [Example 6] 10 I of wheat flour was added to 100 parts by weight of the adhesive used in Example 4.
[A plywood kit was made under the same conditions as in Example 5 except that an adhesive prepared by mixing and stirring 5 liters of wood flour was used.

[Comparative Example 6] Plywood JtgM was prepared under the same conditions as in Example 5, except that 100 parts by weight of the adhesive used in Comparative Example 2, 10 parts by weight of wheat flour, and 5 parts by weight of wood flour were mixed and stirred for the adhesive. Built.

Examples 5 and 6 ζ produced according to Comparative Example 1j
, kl, JtD adhesion, wood breakage, half-kJA81 type, were determined to be constant by repeat test. The results are shown in Table 5VC.

-s Procedural amendment (formality) August 1981 Ke Ll Commissioner of the Patent Office l! Sugiwa Daidono 2. Name of the invention Brush strokes on wooden slats 3. Person who makes corrections Patents related to the case: Applicant As per attached sheet ■ R table-5J on page 11 of the specification (D Mugi sK.

Insert the next horizontal grain and aS term.

"41 Brief explanation of drawing ml1rj M D l flowchart. 1 or more

Claims (1)

[Claims] ■ Diphenylmethane diisocyanate (hereinafter referred to as MDI) Crude MDI obtained in 't*takiru m@
Almost pure MDI and polymeric MD
After fractional distillation to I, the residue produced when the above is further distilled to almost pure MDil can be used to bond wood percussion.
Characteristic method of bonding wood materials. ■ The method for bonding wood materials described in Paragraph 1 of Patent No. 8, characterized in that the residue is used alone to bond the wood materials. ■ Gluing wood materials using the residue dissolved in a solvent 1-2 A special feature of the product 1st
Method of gluing wood materials as described in section. (1) A method of gluing wood materials by using a mixture of a cormorant and a polymeric resin obtained by primary distillation. ■ Examination *Claim No. 111I characterized by the use of soluble urea resins, water-soluble phenolic resins, emulsion-made phenolic resins, etc. added to adhesives.
Method of gluing wood materials as described.