JPS58184744A - Semiconductor cassette - Google Patents

Semiconductor cassette

Info

Publication number
JPS58184744A
JPS58184744A JP6629282A JP6629282A JPS58184744A JP S58184744 A JPS58184744 A JP S58184744A JP 6629282 A JP6629282 A JP 6629282A JP 6629282 A JP6629282 A JP 6629282A JP S58184744 A JPS58184744 A JP S58184744A
Authority
JP
Japan
Prior art keywords
cassette
semiconductor
electronic apparatus
contact
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6629282A
Other languages
Japanese (ja)
Inventor
Haruhisa Kato
晴久 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP6629282A priority Critical patent/JPS58184744A/en
Publication of JPS58184744A publication Critical patent/JPS58184744A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure

Abstract

PURPOSE:To enable to detect easily the attached condition to an electronic apparatus, and to enable to discriminate the kind of a cassette by a method wherein conductive members to come in contact with the electronic apparatus electrically at two points or more are provided, and when the members are made in the attached condition to the electronic apparatus, the contacts are made in the conducting condition mutually. CONSTITUTION:Hooks 1a for fixation to an electronic apparatus are protruded at the lower parts of the confronting sides of the upper case 1 of a semiconductor cassette. The case 1 is engagingly fixed with a lower case 2. The inside of the case is constructed of connectors 3, a semiconductor element 4 and a detecting plate 5, and the connectors 3 conduct between the electronic apparatus and the element 4. The tips at both the edge parts bent in the L-shape of the detecting plate 5 are fixed to engaging holes, and are led out outside of the cassette to form the contact terminals 5c, 5d. Patterns 6a, 6c are provided on the lower face f a printed substrate 6 and come in contact with the terminals 5c, 5d, and are made in the conducting condition by the detecting plate 5. Moreover discrimination of the kind of the cassette can be attained by changing the positions of the contact terminals.

Description

【発明の詳細な説明】 本発明は、半導体カセット、特に半導体素子を収納し、
電子機器本体と着脱可能な半導体カセットに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a semiconductor cassette, in particular a semiconductor cassette containing a semiconductor element,
The present invention relates to a semiconductor cassette that is detachable from an electronic device body.

従来、電子式卓上計算機、電子式学習機等の電子機器に
おいてメモリー機能の増設、プログラムの変更等に用い
られ、電子機器本体と着脱可能なROM等の半導体素子
を含む半導体カセットは電子機器本体との装着状態を容
易に確認できない為、装若時の誤装着或いは装着後の振
動等による脱落を感知できず、電子機器の誤動作等の不
具合を生ずる事があった。また、情報収納量が増大した
場合にこれに伴ない半導体カセットの種類も豊富となり
所望の半導体カセットを選択する作業も困難を極めてい
た。
Conventionally, semiconductor cassettes containing semiconductor elements such as ROM, which are removable from the main body of the electronic device, are used to expand memory functions, change programs, etc. in electronic devices such as electronic desktop calculators and electronic learning machines. Since it is not possible to easily check the mounting condition of the device, it is not possible to detect whether the device is installed incorrectly during re-installation or if it falls off due to vibrations after installation, which can lead to problems such as malfunction of electronic devices. Furthermore, as the amount of information stored increases, the variety of semiconductor cassettes also increases, making it extremely difficult to select a desired semiconductor cassette.

したがって、本発明は以上の事情に鑑み成されたもので
、電子機器との装着状態を容易に検出でき、カセットの
種類を容易に識別できる様にした半導体カセットを提供
する事を目的とする。
Therefore, the present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor cassette in which the state of attachment to electronic equipment can be easily detected and the type of the cassette can be easily identified.

本発明は、上記の目的を達成する為に電子機器と少なく
とも2点以上電気的に接触する接点端子を有する導電性
部材を設け、電子機器と装着状態の時は接点端子間は導
通状態となる構造を採用した。
In order to achieve the above object, the present invention provides a conductive member having contact terminals that are in electrical contact with an electronic device at at least two points, and when it is attached to the electronic device, the contact terminals are in a conductive state. structure was adopted.

以下図面に基づき本発明の一実施例を詳細に説明する。An embodiment of the present invention will be described in detail below with reference to the drawings.

第1図は本発明の一実施例である半導体カセットの構造
を示すもので、同図において符号1で示すものは半導体
カセットの上ケースである。
FIG. 1 shows the structure of a semiconductor cassette according to an embodiment of the present invention, and the reference numeral 1 in the figure is the upper case of the semiconductor cassette.

この上ケース1の対向する側面下部には電子機器(不図
示)との固定用フック1a(一方の側面側は不図示)が
突設されており、この固定用フック1aには後述する検
出板5の両端部を嵌入固定する嵌合孔1bがそれぞれ穿
設されている。この上ケース1は中央部に溝2aを有す
る下ケース2と機械的に1茨合固定されて一体となって
おり、これら上ケース1.下ケース2は主にプラスチッ
ク等の絶縁性部材より形成されている。
A hook 1a (one side is not shown) for fixing an electronic device (not shown) is protruded from the lower part of the opposing side of the upper case 1, and this fixing hook 1a has a detection board (described later). Fitting holes 1b into which both end portions of 5 are fitted and fixed are formed respectively. The upper case 1 is mechanically fixed to a lower case 2 having a groove 2a in the center and is integral with the upper case 1. The lower case 2 is mainly made of an insulating material such as plastic.

このケース1,2内の内部構造は後述するコネクタ3.
半導体素子4.及び検出板5より構成されており、コネ
クタ3は周知の如く電子機器と半導体素子4とを導通さ
せるもので絶縁部材3aと導1−JOi、部材3bとを
交互に積層して形成され、上ケース1と下ケース2とに
よりそれぞれ両側(二形成された間隙(不図示)(;嵌
合され固定されている。
The internal structure inside these cases 1 and 2 will be explained later in the connector 3.
Semiconductor element 4. As is well known, the connector 3 connects the electronic device to the semiconductor element 4, and is formed by alternately laminating an insulating member 3a, a conductor 1-JOi, and a member 3b. The case 1 and the lower case 2 are fitted and fixed on both sides (two gaps (not shown)), respectively.

このコネクタ3の導電部材3b上には半導体素子4の各
端r4 aが各々載置され、位置ずれしない、  よう
にコネクタ3と上ケース1とによって押えられている。
Each end r4a of the semiconductor element 4 is placed on the conductive member 3b of the connector 3, and is held down by the connector 3 and the upper case 1 so as not to be displaced.

更ニ、こ)半導体素子4と下ケース2との間には本発明
を実現するための金属等の導電物質より形成される検出
板5が設けられており、この検出板5は下ケース2の上
面中央部に設けられた溝2aに嵌入され、L字状に折曲
した両端部の先端は前述した上ケース1の嵌合孔1bに
嵌入固定されカセット外部に引き出され、接点端子5c
、5dを形成している。
Furthermore, a detection plate 5 made of a conductive material such as metal for realizing the present invention is provided between the semiconductor element 4 and the lower case 2. It is fitted into a groove 2a provided in the center of the upper surface, and the tips of both ends bent into an L-shape are fitted and fixed into the fitting holes 1b of the upper case 1 and pulled out to the outside of the cassette, and the contact terminals 5c
, 5d.

次に第2図には、す、上の如く構成された半導体カセッ
トが電子機器と正常に装着している状態が示されており
、同図において符号6で示すものは電r機器のプリント
基板であり、このプリント基板6に穿設された孔6aの
縁に上ケース1のフックla、laが係合し電子機器に
装着されている。
Next, FIG. 2 shows a state in which the semiconductor cassette configured as above is normally attached to an electronic device. The hooks la, la of the upper case 1 are engaged with the edges of the holes 6a formed in the printed circuit board 6, and the upper case 1 is attached to the electronic device.

このプリント基板6の上面側にはデータの受は渡し及び
電源供給等を半導体素子4へ行なうパターン6bが設け
られており、コイ・フタ3と接触している。
A pattern 6b for receiving and transmitting data and supplying power to the semiconductor element 4 is provided on the upper surface side of the printed circuit board 6, and is in contact with the coil lid 3.

一方、プリント基板6の下面側には各々独立したパター
ン6c、6dが設けられており、検出板5の接点端子5
c、5dとそれぞれ接触している。
On the other hand, independent patterns 6c and 6d are provided on the lower surface side of the printed circuit board 6, and the contact terminals 5 of the detection plate 5
c and 5d, respectively.

すなわち、このパターン6c、6dは検出板5を介して
導通状態となっており、どの導通状態を電子機器側で検
出することにより半導体カセットと電子機器との装着状
態を検出することが出来る。
That is, the patterns 6c and 6d are in a conductive state via the detection plate 5, and by detecting which conductive state is on the electronic device side, it is possible to detect the mounting state of the semiconductor cassette and the electronic device.

例えば、検出板の接点端子5c、5dのどちらが一方、
或いは両方がパターン6c、6dと接触不良を起こして
いればパターン6c、6d間は非導通状態となり、これ
を検出して半導体カセットが正常に装着されていないこ
とを表示ランプを点灯する等の公知の技術手段により電
子機器側で操作者に対して報知することが可能である。
For example, which one of the contact terminals 5c and 5d of the detection plate is the other?
Alternatively, if both have poor contact with the patterns 6c and 6d, there will be a non-conduction state between the patterns 6c and 6d, and this will be detected to indicate that the semiconductor cassette is not properly installed by lighting an indicator lamp or other known method. It is possible to notify the operator on the electronic equipment side using the following technical means.

また、本発明は上述した電子機器との装着状態を検出す
るだけでなく、半導体カセットの種類を識別することも
可能である。すなわち、第3囚人。
Furthermore, the present invention is capable of not only detecting the mounting state of the electronic device described above, but also identifying the type of semiconductor cassette. Namely, the third prisoner.

(I3)に示す如く互いに異なる数の接点端子を有する
検出板5′、5“、5″をそれぞれ異なる半導体カセッ
トに組み込むことにより識別することが可能となる。例
えば接点端子5c、5d、5eを有する検出板5′を組
み込んだ半導体カセットを”A″として、これを第3図
(A)に示す電子機器のプリント基板6′に装着した場
合は、プリント基板6′の下面側に形成されたパターン
6c、6j、64!はそれぞれ検出板5′の接点端子5
c、5表、5eと接触し導通状態となるが、検出板5“
を組み込んだ半導体カセット(例えばこれを”B”とす
る)を装着した場合は、パターン6c、6dとは検出板
5“の接点端子5c、5dを介して導通状態となるが、
パターン6eは非導通状態となる。一方、検出板5″を
組み込んだ半導体カセットを”C″′として、これを装
?:1“した場合は、パターン6c、6eとが検出板5
″′の接点端子5c、5eにより導通状態となり、パタ
ーン6dが非導通状態となる。
As shown in (I3), by incorporating detection plates 5', 5'', and 5'' having mutually different numbers of contact terminals into different semiconductor cassettes, identification becomes possible. For example, if a semiconductor cassette incorporating a detection plate 5' having contact terminals 5c, 5d, and 5e is designated as "A" and is mounted on a printed circuit board 6' of an electronic device shown in FIG. 3(A), the printed circuit board Patterns 6c, 6j, 64 formed on the lower surface side of 6'! are the contact terminals 5 of the detection plate 5', respectively.
c, 5 table, and 5e come into contact and become conductive, but the detection plate 5"
When a semiconductor cassette incorporating a semiconductor cassette (for example, this is referred to as "B") is installed, the patterns 6c and 6d are electrically connected via the contact terminals 5c and 5d of the detection plate 5".
The pattern 6e becomes non-conductive. On the other hand, if the semiconductor cassette incorporating the detection plate 5'' is set as ``C'''' and it is equipped with ?:1'', the patterns 6c and 6e are
The contact terminals 5c and 5e of ``'' are in a conductive state, and the pattern 6d is in a non-conductive state.

すなわち、パターン6d、6eとパターン6cとの導通
、非導通状態を検出することにより半導体力セラ)A、
B、Cの種類を検出することが可能となる。例えば第1
表に示す如く導通状態を”1″非導状態な0″として、
パターン6d、6eとパターン6cとの関係を1ビツト
の2進コードとして電子機器側が半導体力セ、ツ)A、
B、Cの種類を識別し、これに基づいて表示等の公知の
技術手段により操作者に対して報知することが出来る。
That is, by detecting the conduction and non-conduction states between the patterns 6d and 6e and the pattern 6c, the semiconductor power cera)A,
It becomes possible to detect types B and C. For example, the first
As shown in the table, the conductive state is "1" and the non-conductive state is 0.
The relationship between patterns 6d, 6e and pattern 6c is set as a 1-bit binary code by the electronic equipment side.A)
The types of B and C can be identified, and based on this, the operator can be notified by known technical means such as display.

第1表 本実施例においては説明を容易にするために3個の異な
る半導体カセットの識別について述べたが検出板の接点
端子の数を増加することにより、3種類以上の識別を行
なう事も吋mlである。但し、この場合には2ビット以
上の2進コードにより電r−機器側が識別を行なう。
Table 1 In this embodiment, for ease of explanation, identification of three different semiconductor cassettes has been described, but by increasing the number of contact terminals on the detection plate, it is also possible to identify three or more types. ml. However, in this case, the electronic equipment side performs identification using a binary code of 2 bits or more.

以上の説明で明らかなように本発明によれば電子機器と
少なくとも2点以上電気的に接触する接点端子を有する
導電性部材を設け、接点端子間の導通状態を検出するこ
とにより、半導体カセットの誤装着による電子機器の誤
動作を防止でき、半導体カセットの選択作業も容易とな
るという効果がある。
As is clear from the above description, according to the present invention, a conductive member having contact terminals that electrically contacts an electronic device at at least two points is provided, and a conductive state between the contact terminals is detected. This has the effect of preventing malfunctions of electronic equipment due to incorrect mounting and facilitating the selection of semiconductor cassettes.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第4図はいずれも本発明の一実施例を説明する
もので、第1図は本発明による半導体カセットの構造を
示す分解斜視図、第2図は電子機器と装着している状態
を示す第1図のA−A’線に。 沿った半導体カセットの断面図、第3図(Al、 (B
)は他実施例を示す部分斜視図である。 1・・・上ケース      2・・・下ケース3・・
・コネクタ      4・・・半導体素子5 、5′
、s″、5//l、、、検出板   5c 、 5d 
、 5e ・−接点端子1・
Figures 1 to 4 all illustrate one embodiment of the present invention; Figure 1 is an exploded perspective view showing the structure of a semiconductor cassette according to the present invention, and Figure 2 is an exploded perspective view showing the structure of a semiconductor cassette attached to an electronic device. Line AA' in Figure 1 shows the state. A cross-sectional view of the semiconductor cassette along FIG. 3 (Al, (B
) is a partial perspective view showing another embodiment. 1... Upper case 2... Lower case 3...
・Connector 4...Semiconductor element 5, 5'
,s″,5//l,,,detection plate 5c, 5d
, 5e ・-Contact terminal 1・

Claims (2)

【特許請求の範囲】[Claims] (1)半導体素子を収納し、電子機器と着脱可能な半導
体カセットにおいて、前記電子機器と少なくとも2点以
上電気的に接触する接点端子を有する導電性部材を備え
、前記電子機器と装着状態の時前記接点端子間を導通状
態とすることを特徴とする半導体カセット。
(1) A semiconductor cassette that stores a semiconductor element and is detachable from an electronic device, including a conductive member having a contact terminal that makes electrical contact with the electronic device at at least two points, when the semiconductor cassette is attached to the electronic device. A semiconductor cassette characterized in that the contact terminals are electrically connected.
(2)前記接点端子間の導通状態を前記電子機器側で検
出することを特徴とする特許請求の範囲第1項に記載の
半導体カセット。
(2) The semiconductor cassette according to claim 1, wherein the electrical connection state between the contact terminals is detected on the electronic device side.
JP6629282A 1982-04-22 1982-04-22 Semiconductor cassette Pending JPS58184744A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6629282A JPS58184744A (en) 1982-04-22 1982-04-22 Semiconductor cassette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6629282A JPS58184744A (en) 1982-04-22 1982-04-22 Semiconductor cassette

Publications (1)

Publication Number Publication Date
JPS58184744A true JPS58184744A (en) 1983-10-28

Family

ID=13311597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6629282A Pending JPS58184744A (en) 1982-04-22 1982-04-22 Semiconductor cassette

Country Status (1)

Country Link
JP (1) JPS58184744A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579212A (en) * 1993-07-29 1996-11-26 Sun Microsystems, Inc. Protective cover for a silicon chip device and method relating thereto
JP2009194712A (en) * 2008-02-15 2009-08-27 Nec Infrontia Corp Portable terminal device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579212A (en) * 1993-07-29 1996-11-26 Sun Microsystems, Inc. Protective cover for a silicon chip device and method relating thereto
JP2009194712A (en) * 2008-02-15 2009-08-27 Nec Infrontia Corp Portable terminal device
JP4654422B2 (en) * 2008-02-15 2011-03-23 Necインフロンティア株式会社 Mobile terminal device

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