JPS5818366U - Parts mounting board - Google Patents

Parts mounting board

Info

Publication number
JPS5818366U
JPS5818366U JP11107881U JP11107881U JPS5818366U JP S5818366 U JPS5818366 U JP S5818366U JP 11107881 U JP11107881 U JP 11107881U JP 11107881 U JP11107881 U JP 11107881U JP S5818366 U JPS5818366 U JP S5818366U
Authority
JP
Japan
Prior art keywords
mounting board
parts mounting
hole
substrate
adhesive surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11107881U
Other languages
Japanese (ja)
Inventor
秦 忠男
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP11107881U priority Critical patent/JPS5818366U/en
Publication of JPS5818366U publication Critical patent/JPS5818366U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の部品取付方法の説明断面図、第2図及び
第3図は従来の取付方法における逆フォーミングを説明
する平面図及び断面図、第4図は本考案の部品取付基板
を説明する断面図、第5図はその底面図、第6図はその
取付状態を示す斜視図である。 1・・・基板、3・・・部品、12・・・孔、13・・
・粘着面、14・・・粘着板。
Fig. 1 is a sectional view explaining the conventional component mounting method, Figs. 2 and 3 are a plan view and sectional view illustrating reverse forming in the conventional mounting method, and Fig. 4 is illustrating the component mounting board of the present invention. 5 is a bottom view, and FIG. 6 is a perspective view showing the installed state. 1... Board, 3... Component, 12... Hole, 13...
・Adhesive surface, 14...adhesive board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板両面を貫通する孔と、前記基板の片面に前記孔の内
部に粘着面が向けられた粘着板とを設け、部品を前記粘
着面に接着して前記孔の内部に装着するように構成した
ことを特徴とする部品取付基板。
A hole penetrating both sides of the substrate and an adhesive plate having an adhesive surface facing inside the hole are provided on one side of the substrate, and a component is attached to the adhesive surface and mounted inside the hole. A component mounting board characterized by:
JP11107881U 1981-07-28 1981-07-28 Parts mounting board Pending JPS5818366U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11107881U JPS5818366U (en) 1981-07-28 1981-07-28 Parts mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11107881U JPS5818366U (en) 1981-07-28 1981-07-28 Parts mounting board

Publications (1)

Publication Number Publication Date
JPS5818366U true JPS5818366U (en) 1983-02-04

Family

ID=29905421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11107881U Pending JPS5818366U (en) 1981-07-28 1981-07-28 Parts mounting board

Country Status (1)

Country Link
JP (1) JPS5818366U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5630783A (en) * 1979-08-22 1981-03-27 Tokyo Shibaura Electric Co Device for mounting chip element
JPS5667987A (en) * 1979-11-06 1981-06-08 Casio Computer Co Ltd Method of manufacturing circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5630783A (en) * 1979-08-22 1981-03-27 Tokyo Shibaura Electric Co Device for mounting chip element
JPS5667987A (en) * 1979-11-06 1981-06-08 Casio Computer Co Ltd Method of manufacturing circuit board

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