JPS58182426U - Wafer transfer device - Google Patents
Wafer transfer deviceInfo
- Publication number
- JPS58182426U JPS58182426U JP8053082U JP8053082U JPS58182426U JP S58182426 U JPS58182426 U JP S58182426U JP 8053082 U JP8053082 U JP 8053082U JP 8053082 U JP8053082 U JP 8053082U JP S58182426 U JPS58182426 U JP S58182426U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- electrode
- electrodes
- transfer device
- wafer transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Registering Or Overturning Sheets (AREA)
- Non-Mechanical Conveyors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はエアトラック方式搬送装置の概要図、第２図は
本考案によるウェハ自動搬送装置の構造概要を示す断面
図、第３図は第２図の上面図と電極切替回路図Ａおよび
極性切替方法の説明図Ｂである。
１・・・・・・ウェハ、２・・・・・・ウェハカセット
ホルダ、３・・・・・・台、４・・・・・・エアトラッ
ク、５・・・・・・ゴムベルト、６・・・・・・空気の
吹出し口、７・・・・・・ウェハホルダ１、８・・・・
・・テフロンコーティング、９．１０・・面電極、１１
・・・・・・リレーの接点、１２・・・・・・リレーの
コイル、１３・・・・・・スライダ、１４・・・・・・
整流平滑回路、１５・・・・・・変圧器。Fig. 1 is a schematic diagram of an air track type transfer device, Fig. 2 is a sectional view showing an outline of the structure of the automatic wafer transfer device according to the present invention, and Fig. 3 is a top view of Fig. 2, electrode switching circuit diagram A, and polarity. It is explanatory drawing B of the switching method. 1...Wafer, 2...Wafer cassette holder, 3...Unit, 4...Air track, 5...Rubber belt, 6... ...Air outlet, 7...Wafer holder 1, 8...
... Teflon coating, 9.10 ... Surface electrode, 11
...Relay contact, 12...Relay coil, 13...Slider, 14...
Rectifier and smoothing circuit, 15...Transformer.
Claims (1)
れ、その表面に絶縁膜コーティングを施した複数の平面
電極群と、これら各電極間のすき間から電極上方にある
ウェハを吹き上げるための空気供給装置と、上記電極群
に対してその並ぶ順に交互に極性の異る直流高電圧をウ
ェハ搬送方向に従って順に切替えて供給し、かつ切換速
度を可変とした電極切換装置および直流高圧電源とを具
備し、ウェハと電極間の静電吸引力による一方向への搬
送を行わせると共に、電極に加える電圧の切換速度の変
化によりウニ／、１搬送速度を可変としたことを特徴と
するウェハ搬送装置。A plurality of flat electrodes are arranged perpendicular to the wafer transport direction and parallel to each other, and the surfaces thereof are coated with an insulating film, and air is used to blow up the wafers above the electrodes from the gaps between these electrodes. A supply device, an electrode switching device that alternately switches and supplies DC high voltages of different polarities to the electrode groups in the order in which they are lined up according to the wafer transport direction, and has a variable switching speed, and a DC high voltage power supply. A wafer transport device characterized in that the wafer is transported in one direction by electrostatic attraction between the wafer and the electrode, and the transport speed is made variable by changing the switching speed of the voltage applied to the electrode. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053082U JPS58182426U (en) | 1982-05-31 | 1982-05-31 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053082U JPS58182426U (en) | 1982-05-31 | 1982-05-31 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182426U true JPS58182426U (en) | 1983-12-05 |
| JPS6211000Y2 JPS6211000Y2 (en) | 1987-03-16 |
Family
ID=30089672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8053082U Granted JPS58182426U (en) | 1982-05-31 | 1982-05-31 | Wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63245932A (en) * | 1987-03-31 | 1988-10-13 | Fujitsu Ltd | Method and apparatus for transporting wafer |
-
1982
- 1982-05-31 JP JP8053082U patent/JPS58182426U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63245932A (en) * | 1987-03-31 | 1988-10-13 | Fujitsu Ltd | Method and apparatus for transporting wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211000Y2 (en) | 1987-03-16 |
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