JPS5817722U - High voltage epoxy mold body - Google Patents
High voltage epoxy mold bodyInfo
- Publication number
- JPS5817722U JPS5817722U JP11109981U JP11109981U JPS5817722U JP S5817722 U JPS5817722 U JP S5817722U JP 11109981 U JP11109981 U JP 11109981U JP 11109981 U JP11109981 U JP 11109981U JP S5817722 U JPS5817722 U JP S5817722U
- Authority
- JP
- Japan
- Prior art keywords
- high voltage
- mold body
- epoxy mold
- voltage epoxy
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Organic Insulating Materials (AREA)
- Insulators (AREA)
- Insulating Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の斜視図、第２図は他の実施
例の斜視図である。
１・・・エポキシ絶縁筒、２・・・導電性接着剤、３・
・・導体棒、４・・・エポキシモールド体、５−・・環
状電極、６・・・導電性エポキシ樹脂。、FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a perspective view of another embodiment. 1... Epoxy insulating tube, 2... Conductive adhesive, 3...
...Conductor rod, 4--Epoxy mold body, 5--Annular electrode, 6--Conductive epoxy resin. ,
Claims (1)
、導電性接着剤を介して金属導体を挿入若しくは被嵌さ
せ両者を一体に固着させて成るこ−とを特徴とする高電
圧エポキシモールド体。A high voltage device characterized by being formed by inserting or fitting a metal conductor into a pre-formed epoxy clay body with no residual stress through a conductive adhesive and fixing the two together. Epoxy mold body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11109981U JPS5817722U (en) | 1981-07-28 | 1981-07-28 | High voltage epoxy mold body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11109981U JPS5817722U (en) | 1981-07-28 | 1981-07-28 | High voltage epoxy mold body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5817722U true JPS5817722U (en) | 1983-02-03 |
| JPS6136012Y2 JPS6136012Y2 (en) | 1986-10-20 |
Family
ID=29905440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11109981U Granted JPS5817722U (en) | 1981-07-28 | 1981-07-28 | High voltage epoxy mold body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5817722U (en) |
-
1981
- 1981-07-28 JP JP11109981U patent/JPS5817722U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136012Y2 (en) | 1986-10-20 |
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