JPS5817641A - Heating machine for sealing - Google Patents
Heating machine for sealingInfo
- Publication number
- JPS5817641A JPS5817641A JP11662881A JP11662881A JPS5817641A JP S5817641 A JPS5817641 A JP S5817641A JP 11662881 A JP11662881 A JP 11662881A JP 11662881 A JP11662881 A JP 11662881A JP S5817641 A JPS5817641 A JP S5817641A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- feeding
- heating
- temperature
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 title claims abstract description 20
- 230000004308 accommodation Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 17
- 239000005394 sealing glass Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010583 slow cooling Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 101150003530 Tsnax gene Proteins 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
- Furnace Details (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はガラス封止型ＩＣ等の封入工程に用いられる
封止用加熱機に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sealing heating machine used in the process of encapsulating glass-sealed ICs and the like.
ガラス封止型ＩＣ（以下サーディツプＩＣ）の封入工程
は、第１図、第２図を参照に説明すると、キャップ６と
前工程から送られてくる半製品との接着を行い、外気に
対してＩＣチップ３及びその接続部＠４による内部接続
部を保護して半導体ＩＣの信頼性を確保するものである
。その時キャップ６とペース２の接着面７Ｆｉキヤツプ
６の接着面に塗着された封止用ガラス５とペース２上面
に塗着された封止用ガラスの双方を加熱溶融させ、ＩＣ
リードフレーム１の内部リード部をサンドイッチして接
着させ形成される。キヤ、プロと半製品の接着は、地点
−３０℃以下の乾燥空気中で行なわれ、しかるにキャッ
プ６とベース２で囲まれた空間は低湿度の空気で満たさ
れ、ＩＣの信頼性が高く保たれる訳である。The encapsulation process for glass-sealed ICs (hereinafter referred to as cerdip ICs) is explained with reference to Figs. This protects the IC chip 3 and its internal connection by the connection part @4 to ensure the reliability of the semiconductor IC. At this time, both the sealing glass 5 applied to the adhesive surface of the cap 6 and the adhesive surface 7Fi of the cap 6 and the sealing glass applied to the top surface of the paste 2 are heated and melted, and the IC
It is formed by sandwiching and bonding the internal lead portions of the lead frame 1. The bonding between Kya, Pro and the semi-finished product is carried out in dry air at a temperature of -30°C or below, and the space surrounded by the cap 6 and base 2 is filled with low humidity air, which maintains the high reliability of the IC. This means that it is dripping.
従来この封入工程はベルト炉が使われていた。Traditionally, a belt furnace was used for this encapsulation process.
ベルト炉では前記加熱は、第３図に示すように、鋼製の
メツシーベルト１３（以下ベルト）上に封入用治具１２
を乗せ、ベルト１３の移動スピードを所定に保つことに
よって行なわれる。封入用治其１２上にはキャップ６が
下側に半製品が上備に、互いの位置関係を正確に出した
状態で載置される。In the belt furnace, as shown in FIG.
This is done by keeping the moving speed of the belt 13 at a predetermined level. On the enclosure jig 12, the cap 6 is placed on the lower side, and the semi-finished product is placed on the upper side, with the mutual positional relationship being accurately shown.
炉内空間１４は前記乾燥空気が満たされ、そこで製品が
加熱されサーディ、ブＩＣの封止が行なわれる訳である
。The furnace space 14 is filled with the dry air, the product is heated there, and the SAD and IC are sealed.
炉の内壁１６は加熱ヒーターｌＯによシ加熱され炉内空
間１４を囲んでいる。加熱の制御は炉内空間１４にその
検出端が置かれた熱電対８によってセンスされ行なわれ
、炉内温度が設定値に一致するように加熱ヒーターｌＯ
の発熱量がコントロールされている。この時製品１１の
加熱は内壁１６からの熱輻射と、炉内空間を満している
加熱された気体からの熱伝達及び加熱された封入用治具
１２からの熱伝導によシその主要熱量を吸収する。ここ
に、封入用治具１２の加熱も炉の内壁からの熱輻射及び
雰囲気からの熱伝達によって行なわれる。従って、加熱
方式が熱伝達及び熱輻射で□
あることによシ伝熱効率が悪く製品加熱に時間を要する
ばかシでなく湿度検出端が雰囲気中にある為温度設定値
をベルト炉中の場所によって詳細に決定しても、製品の
実際の温度とは差のあるものとなり製品の加熱冷却コン
トロールが非常に困難であった。然るに加熱炉は大型化
し、熱効率の悪さから無駄なエネルギーを費し、又製品
の変更時の条件決定等も非常な煩雑さを供うという欠点
になっていた。The inner wall 16 of the furnace is heated by a heater lO and surrounds the inner furnace space 14. Heating control is sensed by a thermocouple 8 whose detection end is placed in the furnace space 14, and the heating heater lO is controlled so that the furnace temperature matches the set value.
The amount of heat generated is controlled. At this time, the product 11 is heated by heat radiation from the inner wall 16, heat transfer from the heated gas filling the furnace space, and heat conduction from the heated enclosing jig 12, and its main amount of heat is absorb. Here, the heating of the enclosing jig 12 is also performed by heat radiation from the inner wall of the furnace and heat transfer from the atmosphere. Therefore, since the heating method uses heat transfer and heat radiation, the heat transfer efficiency is low and it takes time to heat the product.Since the humidity detection end is in the atmosphere, the temperature setting value can be adjusted depending on the location in the belt furnace. Even if the temperature is determined in detail, there will be a difference from the actual temperature of the product, making it extremely difficult to control the heating and cooling of the product. However, heating furnaces have become large in size, waste energy due to poor thermal efficiency, and are extremely complicated in determining conditions when changing products.
そこでこの発明の目的は熱効率のよい、製品温度コント
ロール性の良好な上記欠点を除いたＩＣ封止用加熱機を
提供することである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a heating machine for IC sealing which has good thermal efficiency and good product temperature controllability, and which eliminates the above-mentioned drawbacks.
すなわ゛ち本発明は、サーディツプＩＣ等の封止用加熱
機において、たとえばＩＣキャップを下側に、Ｉ Ｃリ
ードを含む半製品を上側にし、相互の位置を出した状態
で載置される封止用ユニット治具を熱量等にて温度制御
しながら加熱するヒートブロックと、前記ヒートプロ、
りをその内部に複数個有するとともに内部が外気と遮断
されその内部に雰囲気ガスを送シ込める炉体とを有し、
前記封止用ユニット治具を前記ヒートプロ、りで加熱さ
せながら一定時間の間欠送りをさせて、封止全行うこと
を特徴とした封止用加熱機である。That is, the present invention is a heating device for sealing a cerdip IC, etc., in which the IC cap is placed on the lower side and the semi-finished product including the IC lead is placed on the upper side, with their positions exposed from each other. a heat block that heats the sealing unit jig while controlling the temperature using heat amount, etc.;
It has a furnace body which has a plurality of gases inside and whose interior is isolated from the outside air and into which atmospheric gas can be pumped,
The heating machine for sealing is characterized in that the sealing unit jig is heated by the heat processor and fed intermittently for a certain period of time to complete the sealing.
一方、封入時の製品加熱温度と時間の関係は第４図に示
した様になる。常温Ｔ０から加熱最高温度’ｌ’ｍａｘ
迄に要した時間１．、最高温度維持時間１２−’Ｉｓ最
高温度から徐冷所要温ｆＴａ迄の徐冷時間ｔｓ ’２
があり、使用する封止ガラスの種類及び使用材料の種類
によｊ）ＴｍａＸｅ ”２Ｆ’ｓ Ｔａが決定される。On the other hand, the relationship between product heating temperature and time during encapsulation is as shown in FIG. Maximum heating temperature 'l'max from normal temperature T0
Time required 1. , maximum temperature maintenance time 12-'Is slow cooling time from maximum temperature to required slow cooling temperature fTa ts '2
j) TmaXe "2F's Ta is determined depending on the type of sealing glass used and the type of material used.
しかしｔ１加熱時間については、Ｔｓｎａｘになること
が必要第１条件であって従来のベルト方式加熱のように
時間をかける必要はない。又、Ｔｍａｘ温度及び最高温
度維持時間１．−１． もＩＣ内部に与える影響を考
えても低温度であることが望ましい。However, regarding the t1 heating time, the first condition is that Tsnax be reached, and there is no need to take the time as in conventional belt heating. In addition, Tmax temperature and maximum temperature maintenance time 1. -1. It is desirable that the temperature be low, considering the influence it has on the inside of the IC.
更に、徐冷期間については、ＩＣ内部で使われている各
材料Ｃベース、キャップ、封止用カラス、ＩＣチップ、
リードフレーム）の変態温度が異なることがら徐冷スピ
ードを下げておかないと収縮時に発生する応力の為に封
止ガラス内のクラック発生、ＩＣチップの割れ、ベース
、キャップの割れ等の問題が引き起こされる。そこで、
ＴｍａｘからＴａ迄一定以上の温度降下スピードになら
ないように設定でれる訳である。しかし、徐冷スビー！
ドを下げる心安のある温度範囲が各使用材ｆ−１、、Ｉ
：よってＴｂ近憎あるい＋−；ｆＴｃ近傍であるので、
第４図破線で示したよりな徐冷状態にしてやることによ
っ°τ封止Ｐ９ｒ要時間を低減させることが出来るので
りる。前記したようにベルト炉式では温度数＞ｉ二がそ
の場所、、場所によって細かく遂−にプロゲラ人出米な
いがこの発明によれば可＝ｐである。Furthermore, regarding the slow cooling period, each material used inside the IC (C base, cap, sealing glass, IC chip,
Since the transformation temperature of the lead frame (lead frame) is different, if the annealing speed is not slowed down, the stress generated during shrinkage may cause problems such as cracks in the sealing glass, cracks in the IC chip, and cracks in the base and cap. It will be done. Therefore,
This means that the temperature can be set so that the speed of temperature drop from Tmax to Ta does not exceed a certain level. However, slowly cooled Subi! The temperature range for each material used is F-1, I
: Therefore, it is near Tb or +-; fTc is near, so
By creating a more gradual cooling state as indicated by the broken line in FIG. 4, the time required for sealing P9r can be reduced. As mentioned above, in the case of the belt furnace type, the number of temperatures > i may vary depending on the location, but according to the present invention, it is possible = p.
この発明による一実施例を第５図、第６図を用いて説明
する。キｒツブ６、及び半製品は第６図の様にギヤ、プ
ロを下側にＩＣリードフレーム１ ′を上方にし
て封入用ユニット治具１８（以Ｆユニクト）の中に相互
の位置ヲ出した状態で入れ込まれる。製品の加熱ヶよそ
のほとんどがユニｙ ） １８の底面からキャップ６へ
の熱伝導（こて、又そのとく一部がユニット１８内壁か
らの熱輻射により行なわれる。又、ユニット１８の刀Ω
熱はヒートブロック２１の上表面からの熱伝導により行
なわれる。One embodiment of the present invention will be described with reference to FIGS. 5 and 6. As shown in Fig. 6, the kick R knob 6 and the semi-finished product are placed in mutual positions in the encapsulating unit jig 18 (hereinafter referred to as F unit) with the gear and prongs on the bottom and the IC lead frame 1' on the top. It is inserted in a state where it is. Most of the heating of the product is done by heat conduction from the bottom of the unit 18 to the cap 6 (a part of it is done by heat radiation from the inner wall of the unit 18.
Heat is generated by conduction from the upper surface of the heat block 21.
一方、ヒートプロ、り２１は熱電対２８により研出され
た温度と図示しない蟲−器の設定温度とが比較され、設
定温度になるようにカートリッジヒータ２７により加熱
されている。従って全ヒートプロ、り２１の温度は通常
使用時の外部の状況変化に対してプラスマイナス数度の
精度で個別にコントロールされる。ここに、製品の温度
コントロールは製品に極めて近傍にある熱電対２８によ
り温度検出されることと、伝熱が熱効率のよい熱伝導に
てそのほとんどが行なわれることによシ極めて良好な状
態となる。On the other hand, the heat processor 21 is heated by a cartridge heater 27 to reach the set temperature by comparing the temperature obtained by the thermocouple 28 with the set temperature of a not-shown thermometer. Therefore, the temperature of all HeatPro 21s is individually controlled with an accuracy of plus or minus a few degrees in response to changes in external conditions during normal use. Here, the temperature control of the product is in an extremely good condition because the temperature is detected by the thermocouple 28 located very close to the product, and most of the heat transfer is performed by heat conduction with high thermal efficiency. .
地方ヒートブロック２１は第５図に示すように一列にそ
の上面を同一高さに保って支持板２０の上に載置され各
々がネジ１９により固定されている。ヒートブロック２
１は数十個差べられ、その上面をユニｙ ） １８がそ
の下面を接して置かれている。ユニット１８は送シ爪２
６と、送シ爪２６が固定されている送りシャフト２５の
動作によシ一定時間を経ると第５図にて左方向に１ピッ
チ分送られ又、そこで一定時間加熱される。送りシャフ
ト２５の動作は図示しない機構により図中、矢印人、方
向の直線運動と、矢印Ｂの回転運動である。この動作に
より送り爪２６先端がユニット１８の送り用切り欠き穴
に入り込み、ユニットを一ピッチずつ送っていくことに
なる訳である。支持板２０は、炉内壁板２０に固定され
る。支持板２０の形状はヒートブロック２１からの伝熱
量を極力小さくするように櫛形とし、炉内壁板２２の温
度上昇が極めて小くなるよう配慮しである。炉内壁板２
２は炉内空間１７を囲んでおり、図示しない乾燥空気吹
き出しによる炉内低湿厩を外部環境の遮断により保って
いる。炉内壁板２２の温度上昇が小さい為断熱層２３も
薄いもので足りてお９炉外壁板２４表面の温度上昇も極
めて小さい値となっている。As shown in FIG. 5, the local heat blocks 21 are placed in a row on the support plate 20 with their upper surfaces kept at the same height, and each is fixed with a screw 19. heat block 2
Dozens of 1's are placed, with their upper surfaces touching, and 18's with their lower surfaces touching. The unit 18 is the feeding claw 2
6 and the feed shaft 25 to which the feed pawl 26 is fixed, after a certain period of time, it is fed by one pitch to the left in FIG. 5, and is heated there for a certain period of time. The movement of the feed shaft 25 is a linear movement in the direction indicated by the arrow B in the figure and a rotational movement in the direction indicated by the arrow B in the figure. By this operation, the tip of the feed claw 26 enters the feeding notch hole of the unit 18, and the unit is fed one pitch at a time. The support plate 20 is fixed to the furnace inner wall plate 20. The support plate 20 is shaped like a comb to minimize the amount of heat transferred from the heat block 21, and is designed to minimize the temperature rise of the furnace wall plate 22. Furnace wall plate 2
2 surrounds the furnace interior space 17, and maintains a low humidity inside the furnace by blowing dry air (not shown) by blocking the outside environment. Since the temperature rise of the furnace inner wall plate 22 is small, a thin heat insulating layer 23 is sufficient, and the temperature rise of the surface of the furnace outer wall plate 24 is also extremely small.
ユニ、ト１８は第６図紙面に垂直方向に複数個の製品が
一定ビ、チで並べられておシ、ユニ、ト１８が一定時間
で、正確に位置を出しながら送られていくので、ユニッ
ト１８単位での自動供給収納が容易となる。UNI, G 18 are a plurality of products lined up in a direction perpendicular to the paper surface of FIG. Automatic supply and storage of 18 units becomes easy.
この発明によれば、製品の加熱が熱伝導による熱効率の
よいものとなる為、第４図１点鎖線で示したように昇温
時間が短縮出来るばかシでなく、各ヒートプロ、り２１
母が独自に容易に温度制御されるので特定の場所でその
温度降下スピードを下げるということも出来る。史に全
体の加熱時間が短縮される為、製品に与える熱的影響も
小さくてすむはかりでなく無駄な熱エネルギーを使わな
いことから省エネルギーの匍でも大きな効果をもたらし
ているとともに封入用加熱機を小型化出来るという利点
も生んでいる。According to this invention, since the product is heated with good thermal efficiency through heat conduction, the heating time can be shortened as shown by the dashed line in FIG.
Since the mother's temperature can be easily controlled independently, it is also possible to reduce the rate of temperature drop in a specific location. Since the overall heating time is shortened, the thermal effect on the product is also small, and it does not use wasted heat energy, so it has a great effect on energy saving, and it also has a heating machine for sealing. It also has the advantage of being miniaturized.
【図面の簡単な説明】
第１図１キヤツプと生製品の到入前の状態を示す斜視図
である。第２図は封止完了後のサーディ、プＩＣの断面
−である。第３図は従来の封入用ベルト炉の断面図であ
る。第４図は製品温度と加熱時間を示すグラフを示す図
である。第５図は本発明の一実施例を示す加熱機の断面
図である。第６図は第５図の加熱部の詳細な断面図であ
る。
尚、図において、
ｌ・・・・・・Ｉ ＣＩＪ−ドフレーム、２・・・・・
・ペース、３・・・・・・ＩＣチップ、４・・・・・・
内部接Ｉｆｒ、細線、５・・・・・・封止用ガラス、６
・・・・・・キャップ、７・・・・・・接着代、８・・
・・・・熱電対、９・・・・・・断熱材、１０・・・・
・・加熱ヒーター、１１・・・・・・製品、１２・・・
・・・封入用治具、１３・・・・・・メツシュベルト、
１４・・・・・・炉内空間、１５・・・・・・炉外壁、
１６・・・・・・内壁、１７・・・・・・炉内空間、１
８・・・・・・封入用ユニット治具、１９・・・・・・
ネジ、２０・・・・・・支持板、２１・・・・・・ヒー
トブロック、２２・・・・−・炉内壁板、２３・・・・
・・断熱層、２４・・・・・・炉外壁板、２５・・・・
・・送シシャフト、２６・・・・・・送シ爪、２７・・
・・・・カートリッジヒータ、２８・・・・・・熱伝導
である。
代理人 弁理士 内 原 晋・″゛１．２
第１図
３
始２図
第３図
時間を
第４図
納６図[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view showing the cap and its state before raw products arrive. FIG. 2 is a cross-section of the Sardi-pu IC after sealing is completed. FIG. 3 is a sectional view of a conventional encapsulating belt furnace. FIG. 4 is a graph showing product temperature and heating time. FIG. 5 is a sectional view of a heating machine showing an embodiment of the present invention. FIG. 6 is a detailed sectional view of the heating section of FIG. 5. In addition, in the figure, l...I CIJ-de frame, 2...
・Pace, 3...IC chip, 4...
Internal connection Ifr, thin wire, 5... Sealing glass, 6
... Cap, 7 ... Adhesive allowance, 8 ...
...Thermocouple, 9...Insulation material, 10...
...Heating heater, 11...Product, 12...
...Inclusion jig, 13...Metshu belt,
14...Furnace interior space, 15...Furnace outer wall,
16... Inner wall, 17... Furnace space, 1
8...Inclusion unit jig, 19...
Screw, 20... Support plate, 21... Heat block, 22... Furnace wall plate, 23...
...Heat insulation layer, 24...Furnace outer wall board, 25...
...Feeding shaft, 26...Feeding claw, 27...
... Cartridge heater, 28 ... Heat conduction. Agent: Susumu Uchihara, Patent Attorney ``゛1.2 Figure 1 Figure 3 Start 2 Figure 3 Time Figure 4 Figure End 6
Claims (1)
ップとＩＣリードを含む半製品とを相互の位置を出した
状態で載置される封止用ユニット治具を熱伝等にて温度
制御しながら加恭するヒートブロックと、前記ヒートブ
ロックをその内部に検数個有するとともに内部が外気と
連断されその内部に雰囲気ガスを送り込める炉体とを有
し、前□記封止用ユニ、ト治具を前記ヒートブロックで
加熱させながら一定時間の間欠送りをさせて封止を行う
ことを特徴とした封止用加熱機。In a heating machine for sealing products such as cerdip ICs, the sealing unit jig is placed with half-finished products including IC caps and IC leads exposed to each other, while controlling the temperature by heat transfer, etc. The sealing unit has a heat block that is heated, and a furnace body that has a plurality of heat blocks therein and whose interior is connected to the outside air and into which atmospheric gas can be sent. A sealing heating machine characterized in that sealing is performed by intermittently feeding a jig for a certain period of time while heating the jig with the heat block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11662881A JPS5817641A (en) | 1981-07-24 | 1981-07-24 | Heating machine for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11662881A JPS5817641A (en) | 1981-07-24 | 1981-07-24 | Heating machine for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5817641A true JPS5817641A (en) | 1983-02-01 |
| JPS6151423B2 JPS6151423B2 (en) | 1986-11-08 |
Family
ID=14691897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11662881A Granted JPS5817641A (en) | 1981-07-24 | 1981-07-24 | Heating machine for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5817641A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810086A (en) * | 1986-05-09 | 1989-03-07 | Fuji Photo Film Co., Ltd. | Portable microfilm reader |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6840248B2 (en) * | 2017-08-23 | 2021-03-10 | 富士フイルム株式会社 | Manufacturing method of retardation film |
| WO2019039559A1 (en) * | 2017-08-23 | 2019-02-28 | 富士フイルム株式会社 | Method for producing phase difference film |
-
1981
- 1981-07-24 JP JP11662881A patent/JPS5817641A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810086A (en) * | 1986-05-09 | 1989-03-07 | Fuji Photo Film Co., Ltd. | Portable microfilm reader |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6151423B2 (en) | 1986-11-08 |
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