JPS58169923A - Sample fixing jig for ic tester using electron beam - Google Patents

Abstract

PURPOSE:To permit a sample to be surely fixed onto a sample mount with such a shape as causing no interference on a probe card by a structure wherein a jig for holding the sample is limited in its thickness. CONSTITUTION:A plurality of rollers 31 are attached onto a cassette 30. These rollers 31 are held in position by springs 32 or the like. A wire 34 is stretched among the plural rollers 31 and a wafer is fixed by the wire 34. A stopper 33 and a pin 35 for positioning an orientation flat are also attached onto the cassette 30, but it is enough for them to have a height not greater than 3mm., typically ca. 1mm.. When used, the wire 34 is first stretched. This causes each roller 31 to be retreated via the spring 32, so that the wire 34 comes out of the wafer to permit exchange of wafer. The wafer may be fixed in a reverse manner as compared with the above.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a work-0 tester using an electron beam, and the present invention relates to a work-0 tester using an electron beam. 1% of the material used for the wafer fixing jig.

[Prior art and intervening points]

Up until now, thin probes have been used for IC failure diagnosis and failure analysis.
A method is used to connect an oscilloscope and measure the waveform wrinkles. However, when the Fi integration degree becomes iIb and the operating speed becomes faster in the middle method of Jin, the technical gap increases. This can be achieved because the resolution is between -29 below the diameter of the probe, and one 7 in 1 is one noodle. This is because the 62-hour response is limited by the amount of static electricity and inductance of the probe button.

As a solution to such problems, an IF C tester (hereinafter abbreviated as IF W B ask) using an *a electron beam is attracting attention. This KB tester has temporal resolution added to the spatial resolution of the electron beam, and can handle submicron spatial resolution and picosecond temporal resolution during IWJ. Cut 1! How to understand IPk (2. Fault diagnosis and defect analysis can be performed by observing the operating status. Furthermore, Guina Kentsuk Rum Irisono and 1i Kokuji confirm the failure location under DC conditions. %轡LOW is useful because it cannot be done.

1181- is a document (Electronic Materials No. 1981-2 St. 4 &
81M method = xO failure diagnosis and unresolved technology) I: Schematic diagram showing M]im of the described IB tester.
1 is an electron optical column consisting of an electron gun 2, a lens 3.4 and a scanning coil 5, 6 is a sample mold, 7 is an exhaust pump, and 8#i sample (xo)s' is a scintillation cylinder counter. be. In addition, 10 is a differential electric power, 11 is a lens power supply, 121j is a scanning power supply, 13 is No. 1 amplification-114,
15tli each m&ray tube (OR?)%16 is the camera.

This IB tester #'i, electron beam 0.01-0.
1 [μm) In aperture, the secondary electron response when thermal radiation scanning of the workpiece 08 with this beam is displayed on 0RT14e15, and 10% failure supply/disconnection and failure analysis are performed.

The specific sound is xo80 as shown in Figure 2 and Figure 3.
Input/output terminal 1: Connect the contact bin 22 of the constant card 21 and send the secondary electrons from the unit 08 to the counter 9.
In the figure, 23#'i is the sample stage, 24 is the focusing lens, and 25#'i is the collector. ! B tester 1; C2, which fixes the sample wafer for #i measurement, had the following problem. In other words, simply placing the wafer on the sample stage is not sufficient for inspection.
As the sample stage moves during measurement, the wafer also moves and the positioning of the wafer measurement chip becomes incorrect each time. FIG. 4 1 - As shown, for example, electron and m#Ikm
Although it is possible to use the wafer fixing method used in the equipment, in the case of an ICB tester the probe card i=
As shown in Figure I5 (U), there are probes that are erected depending on the shape of the chip and the content of the measurement, so if the fixing part is thick, they will collide and make normal contact impossible. Other methods, such as vacuum chucks, electrostatic chucks etc., but vacuum chucks cannot be used in a vacuum,
When using an electrostatic chuck with #j constant, the ground level may be changed and used, so it is best to apply an electric field as much as possible. Moreover, the element cannot be used because it is not good because it causes the element to undergo electric shield O movement.

[Purpose of the invention]

In the present invention, the sample OwI for 1B tester cannot be fixed by conventional fixing method.
Proop card 1 because it is not suitable as a standard method;
The purpose of the present invention is to provide constant odor control of the sample of the fI-xO tester using electron beams that securely fix the sample on the sample stage in a shape that does not interfere with the sample. The shape is lumpy and cannot be stretched beyond the length.
(2) The thickness of the jig for holding the sample was limited, noting that the current one is used in many places, and (C) the mechanism for this was decided with operability in mind.

〔Effect of the invention〕

According to the second aspect of the present invention, there is no need to change the probe of the probe card (the conventional one can be used as is, the total area of the wafer can be inspected, and there is no need to change the probe card). Therefore, there are many advantages such as the fact that the probe or group card and the fixing jig do not come into contact with each other, and accidents do not occur.

In addition, since the wafer can be attached and detached with one touch,
; The sample can be replaced without having to take out the cassette in which the wafer is fixed each time, so it is easy to operate.

[Embodiments of the invention]

A wire is used to provide a thin fixed oil that does not interfere with the presser foot or glove card.

A plurality of rollers 31 are mounted on the cassette.

This roller 31 is held by a suitable spring 32, etc., and a 9-year wire is attached to a plurality of wafers (there are 4 in the figure), and an attempt is made to identify the wafer using this wire. It is something to do. A large orientation flat positioning stopper and a pin 35 are installed on the cassette to position the wafer to a certain degree.
It has been experimentally determined that the positioning is sufficient by increasing the height FiIW.Thickness #'i of the 0 wire varies depending on the material used, but it may be thin enough.

The usage is as follows. A mechanism for slackening the wire inside the cassette (not shown), for example, by winding the wire around a drum, pulling it, and hanging it in an appropriate place, or by twisting and stretching the wire. Then, the roller 31 is compressed by the spring 32, and the wire comes out to the outside of the wafer.

Enable wafer 0 exchange 6: Execute. When identifying a wafer, the above procedure may be reversed.

[Other embodiments of the invention]

#! FIG. 7 shows an embodiment other than this one.

An actual fixing jig is used to hold the wafer and prevent the $C fixing jig from getting in the way during wafer exchange. The swing jig that fixes the wafer to the cassette (material) is double W! The flat jig 36 shown in FIG. 3(b) showing an enlarged view of the cross section of I=A is a pin 37 and a flat spring fixed to it and connected by a flat spring, for example, a constant pin 39. and is held by an eccentric cam,
When the cam is eccentric upward, the 12 leaf spring moves as shown by the solid line, and when it is eccentric downward, the 12 leaf spring moves as shown by the broken line. This is g
2. When the violet jig is indicated by a solid line, the stopper is 4.
2, and as it moves downward, it rotates in the hour hand direction ζ knee and fixes the wafer. On the other hand, when it is indicated by a broken line, it moves upward and contacts the stopper 41, making it possible to convert the wafer in the counterclockwise direction. In such a structure, since the protrusion of the probe is usually 2 m Ii &, it is possible to sufficiently press the wafer even if the thickness of the presser portion is approximately 0.5 to 1 cm. By making the leaf spring circular, multiple swinging jigs can be operated.
It is a good one, with some improvement to the poor swinging jig so that it can move 82 times in the vertical direction.

The fI-fixing jig (2), which is suspended by a leaf spring (1), is lifted up and returned to its original position by a step (C2) attached with one or two circles. Even with this structure C2, there is no difference from the method described above.

In order to avoid having to change the dimensions of the protrusion of the existing 10-plate protrusion, a good fixing jig for fixing the Todoroki wafer was set to less than 31 m, and the entire circumference was set to (2).
In addition, a stopper and a bottle (some of the fixed oil may be shared) that can be in contact with the cage 72 are provided to allow approximate positioning. The shape and structure of the Kotona JR1 beak can be changed in various ways without changing the purpose of the original JR1 beak.

[Brief explanation of the drawing]

Figures 1 to 183 are for explaining the conventional devices, respectively. Figure 1 is a schematic diagram showing the principle of the IB tester, and [
Figure 2 is a partially cutaway perspective view of the wall configuration of the tester, Figure 3 is a schematic diagram showing the operation of the tester, #I4 Figure 1
A diagram showing a wafer fixing cassette used since SA.
1. Electron optical lens barrel 1. Electron optical lens barrel 8...Sample 9 such as wafer
...Scintillation intruder 9.14.15...Logic ray tube 21--P4 card 22--Probe Cassette 31...Reference disk Atsushi-Spring O-Stopper A...Wire A ...Bin A--Wafer presser treatment ^37-
・1 turn bin a-・plate spring 39-・fixed bin
Shun... Eccentric cam 41.42... Stopper Lo - Leaf spring ■... Wafer holding jig Tsuge - Disk (7317) Representative Kensuke Chika (Haga 1)
Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 6 Fig. 81 Fig. 7 (廄) 42.

Claims (1)

[Claims] (1) A platform equipped with movable tables on which samples can be loaded, electrolytic corrosion necessary for inspecting the samples, lead wires for sending and receiving the Ig, and probes that come into contact with the samples. In the sample 16i leg jig of the ICI tester, which is equipped with a sample card, an electron optical tube for irradiating an electron beam toward the specimen, and an electron detection unit for detecting secondary electrons from the sample by the electron beam irradiation, etc. It consists of a substrate on which the sample is placed, and a holding jig that holds the ridges f on the outer periphery of the sample so as to press down the substrate i and the sample, and the thickness of the holding jig is t - J from the lying surface. 'vry y-iy, 5l, characterized by having less than 3 seats
lI voice 111f% Sample of engineering C tester using electron beam tI! 11 feet together. (As a jig holding jig, use wire with a diameter of 2M or less and ah
A 6L + tester comprising a wire support mechanism, in which the bulk of the sample is removed by loosening a part of the wire. ．． ! , one pair city co. (A) As a presser jig, the #I structure, which is approximately L-shaped and has a rotation mechanism that can rotate in part, and an eccentric cam,
vJ - 4111 that it is equipped with a slow curtain that transmits the movement of the mental force as an approximately vertical motion to the finely arranged structure, and a stopper that causes a swinging motion in conjunction with the vertical movement of the structure.
Sample b of the engineering C tester using the electron beam according to Claim 1 No. 1Jj4, which is referred to as 1! 11 foot rules. (4+ As a presser jig, it has an approximately 5-hand shape and can slide in the upper and lower blade directions), and a flat cam shape that comes into contact with the structure to move the front Ik8 structure up and down. Punishment special to Kozusui no H which is similar to consisting of a disk with a
A sample identification jig for an engineering C tester using an electron beam as described in Fu 1.