JPS58168783U - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS58168783U
JPS58168783U JP6641382U JP6641382U JPS58168783U JP S58168783 U JPS58168783 U JP S58168783U JP 6641382 U JP6641382 U JP 6641382U JP 6641382 U JP6641382 U JP 6641382U JP S58168783 U JPS58168783 U JP S58168783U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
outer frame
diode display
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6641382U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312374Y2 (OSRAM
Inventor
隆 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP6641382U priority Critical patent/JPS58168783U/ja
Publication of JPS58168783U publication Critical patent/JPS58168783U/ja
Application granted granted Critical
Publication of JPS6312374Y2 publication Critical patent/JPS6312374Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP6641382U 1982-05-06 1982-05-06 発光ダイオ−ド表示器 Granted JPS58168783U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6641382U JPS58168783U (ja) 1982-05-06 1982-05-06 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6641382U JPS58168783U (ja) 1982-05-06 1982-05-06 発光ダイオ−ド表示器

Publications (2)

Publication Number Publication Date
JPS58168783U true JPS58168783U (ja) 1983-11-10
JPS6312374Y2 JPS6312374Y2 (OSRAM) 1988-04-08

Family

ID=30076287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6641382U Granted JPS58168783U (ja) 1982-05-06 1982-05-06 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS58168783U (OSRAM)

Also Published As

Publication number Publication date
JPS6312374Y2 (OSRAM) 1988-04-08

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