JPS58168289A - Laser diode package - Google Patents

Laser diode package

Info

Publication number
JPS58168289A
JPS58168289A JP57051840A JP5184082A JPS58168289A JP S58168289 A JPS58168289 A JP S58168289A JP 57051840 A JP57051840 A JP 57051840A JP 5184082 A JP5184082 A JP 5184082A JP S58168289 A JPS58168289 A JP S58168289A
Authority
JP
Japan
Prior art keywords
laser diode
heat sink
header
center
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57051840A
Other languages
Japanese (ja)
Other versions
JPH0376036B2 (en
Inventor
Rumiko Suganuma
菅沼　ルミ子
Yoshio Miyake
三宅　良雄
Toshio Takei
竹居　敏夫
Hirobumi Namisaki
浪崎　博文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57051840A priority Critical patent/JPS58168289A/en
Publication of JPS58168289A publication Critical patent/JPS58168289A/en
Publication of JPH0376036B2 publication Critical patent/JPH0376036B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To readily mount a laser diode by employing a horseshoe type heat sink block. CONSTITUTION:A laser diode 2 is mounted on the notch of a horseshoe type heat sink 1 so that the central axis of a resonator coincides with the central axis of the heat sink 1, and the heat sink 1 is mounted concentrically on a header 4 which has a glass window 3 at the center of circular shape. Thus, no barrier is provided in the axial direction of the resonator of the diode 2, the backwardly emitting light can be readily produced, the light can be received by a photodetector through the glass window 3 at the center of the header 4, and the laser diode backwardly emitting light can conveniently be utilized as a monitor. The mounting work of the diode 2 on the heat sink 1 and the bonding work of lead wirings 5 can be facilitated.

Description

【発明の詳細な説明】 この発明はレーザダイオードチップを装荷するレーザダ
イオードパッケージに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser diode package loaded with a laser diode chip.

従来のレーザダイオードパッケージにおいてはパッケー
ジ外観は円形であるが、パッケージ内でのレーザダイオ
ードチップの装着は角形のヒートシンクブロックを用い
て行なわれているなどして一般に同心円構造とはいいが
たく、このため例えばとめヒートシンクブロック上にレ
ンズ等の光学部凸金装着する際レーザダイオードと中心
とする同心円構造をとることが困秦でめった。この結果
熱膨張によってレーザダイオードとレンズの軸ずれや、
あるいはヘッダとレーザダイオードとの軸ずれが生じる
場合があった。Conventional laser diode packages have a circular external appearance, but the laser diode chip is mounted inside the package using a square heat sink block, so it is generally difficult to say that it has a concentric structure. For example, when mounting an optical part such as a lens on a convex metal plate on a stopper heat sink block, it was difficult to form a concentric structure with the laser diode in the center. As a result, thermal expansion may cause misalignment between the laser diode and lens,
Alternatively, misalignment of the axes between the header and the laser diode may occur.

この発明は円柱形でその−・部が半径方向に円柱中心軸
よ）深くフの字形に切り込まれている。The present invention has a cylindrical shape, and its ``-'' part is deeply cut in the radial direction (from the center axis of the cylinder) in a ``F'' shape.

いわゆる馬蹄形のヒートシンクブロックの切り込み部に
レーザダイオードがその共振器の中心軸がほぼこの円柱
状のヒートシンクの中心軸に一致するよう装着されてい
て、このヒートシンクブロックを円形のヘッダー上にレ
ーザダイオードを中心とする同心円状に装荷したことを
特徴とし、その目的はレーザダイオードの装着作業が容
易で、かつ、レンズ等の光学部品をこのヒートシンクブ
ロック上にレーザダイオードを中心とする同心円構造に
容易に装着でき、熱的に安定な構造のレーザダイオード
モジ、−ル等の構成に都合のよいレーザダイオ−トノ（
ツケージを構成するところにある。A laser diode is mounted in the notch of a so-called horseshoe-shaped heat sink block so that the center axis of its resonator approximately coincides with the center axis of this cylindrical heat sink, and this heat sink block is mounted on a circular header with the laser diode centered. The purpose is to make it easy to attach the laser diode, and to easily attach optical components such as lenses to the concentric structure with the laser diode at the center on this heat sink block. , a laser diode module with a thermally stable structure, which is convenient for configuring a
It is in the parts that make up the package.

第１図はこの発明の一実施例であって、（１）は円柱形
のヒートシンクでこの円柱の一部がその母線にそつて円
柱中心軸よシ深くコの字形に切シ込まれている。いわゆ
る馬蹄形状のヒートシンク（以後馬蹄形ヒートシンクと
称す）の切り込み部にレーザダイオード（２）がその共
振器の中心軸がほぼこの円柱状ヒートシンク（１）の中
心軸に一致するように装着されていて、このヒートシン
ク（１１が円形で中央部にガラス窓（３１ヲそなえたＴ
０３９形ヘッダ（４）上にほぼ同心円状に装荷されてい
るレーザダイオードパッケージでおる。第２図は第１図
のム−Ａ′における断面図である。Fig. 1 shows an embodiment of the present invention, in which (1) is a cylindrical heat sink in which a part of the cylinder is cut into a U-shape along its generatrix and deep from the central axis of the cylinder. . A laser diode (2) is installed in a notch of a so-called horseshoe-shaped heat sink (hereinafter referred to as a horseshoe-shaped heat sink) so that the central axis of its resonator approximately coincides with the central axis of this cylindrical heat sink (1), This heat sink (11 is circular and has a glass window (31) in the center)
The laser diode package is mounted almost concentrically on the 039 type header (4). FIG. 2 is a sectional view taken along line A' in FIG. 1.

１− この馬蹄形ヒートシンク（１）にレーザダイオード（２
１ｔ−＊　着しているので、レーザダイオード（２）の
共振器軸方向に障壁がなく、レーザダイオード（２）の
後方出射光が容易にとシ出せ、ヘッダ（４）中央部のガ
ラス窓（３１ヲ通して受光素子で受光することも容易に
でき、レーザダイオード後方出射光をモニタとして利用
するのに都合が良い。また、馬蹄形ヒートシンク（１）
のコの字形の切り込みは円形構造を大きくは損なわず、
レーザダイオードの馬蹄形ヒートシンクへの装着作業お
よびリード線（５）のボンディング作業を容易にする利
点がある。1- Attach the laser diode (2) to this horseshoe-shaped heat sink (1).
1t-*, there is no barrier in the direction of the resonator axis of the laser diode (2), and the rear emitted light of the laser diode (2) can be easily emitted, and the glass window ( 31 can be easily received by the light receiving element, and it is convenient to use the rear emitted light of the laser diode as a monitor.In addition, the horseshoe-shaped heat sink (1)
The U-shaped cut does not significantly impair the circular structure;
This has the advantage of facilitating the work of attaching the laser diode to the horseshoe-shaped heat sink and the work of bonding the lead wire (5).

第３図は第１図、第２図に示したこの発明によるレーザ
ダイオードパッケージ上に光学系を組み立て、シングル
モードファイバ用レーザダイオードモジュールを構成す
る場合のモジュールの一例の構成を示す断面図である。FIG. 3 is a sectional view showing the configuration of an example of a module in which an optical system is assembled on the laser diode package according to the present invention shown in FIGS. 1 and 2 to configure a laser diode module for single mode fiber. .

光学系は球レンズ（６）と屈折率分布形レンズ（７）を
用い、レーザ光をシングルモードファイバ（８）に結合
させる。球レンズ（６１は円板形の球レンズホルダ（９
）のほぼ中心に装着されておシ、この球レンズホルダ（
９）が馬蹄形ヒートシンク上にレーザダイオード（２）
と球レンズ（６）ｔ−位置合わせした状態でほぼ同心円
状に装着されている。なお、このレーザダイオニドモジ
ュール例では球レンズ装着後に窓付の円形キャップαａ
＜よシバ−メチツクシールしてレーザダイオードの信頼
性を高めている。The optical system uses a ball lens (6) and a gradient index lens (7) to couple laser light to a single mode fiber (8). Ball lens (61 is a disk-shaped ball lens holder (9
), this spherical lens holder (
9) Laser diode (2) on horseshoe heat sink
and the ball lens (6) are mounted almost concentrically in a state where they are aligned. In addition, in this laser diionide module example, after attaching the ball lens, a circular cap with a window αa is attached.
<The reliability of the laser diode is increased by a good shielding seal.

また、屈折率分布形レンズは円柱形の屈折率分布形レン
ズホルダ（１１の中心軸にその光軸をほぼ一致させて装
着されており９円形キャップａＯ上に球レンズ（６１よ
りのレーザ出射光を効率良〈シングルモードファイバ＋
８１　Ｋ入射させるよう位置合わせされＴＯ３９形ヘッ
ダ（４）、馬蹄形ヒートシンク（１ｊ、キャップ叫とほ
ぼ同心円状に装着されている。このようにレーザダイオ
ード（２）の共振器の中心軸を中心として馬蹄形ヒート
シンク（１）上に同心円状に組み立てられた光学系とレ
ーザダイオードパッケージと七一体化したものを、さら
に０円柱状のレーザダイオードモジュールパッケージと
なるヒートシンクブロックａ２Ｉ／ｃレーへ才Ｆ軸　　
　　　　４字ナ ザダイオード（２）共振器の中心　　するような同心円
構造で装荷し９円柱状ファイバホルダＵの中心軸に光軸
を合わせて装着したシングルモードファイバ（８）ｔ−
光学系と位置合わせし、これらの同心円構造のレーザダ
イオードパッケージ中心軸にその光軸をほぼ合わせるよ
うに装荷する。The gradient index lens is mounted with its optical axis almost matching the central axis of the cylindrical gradient index lens holder (11), and the laser beam emitted from the spherical lens (61) is mounted on the circular cap aO (9). Efficient (single mode fiber +
The TO39 type header (4) is positioned so that 81 K is incident, and the horseshoe-shaped heat sink (1j) is installed almost concentrically with the cap. The optical system and laser diode package assembled concentrically on the heat sink (1) are then integrated into a heat sink block a2I/c, which becomes a cylindrical laser diode module package.
4-figure naza diode (2) Single mode fiber (8) t- loaded in a concentric structure so that the center of the resonator is aligned with the optical axis aligned with the center axis of the 9-cylindrical fiber holder U
It is aligned with the optical system and loaded so that its optical axis is approximately aligned with the center axis of the laser diode package having a concentric structure.

また、レーザダイオードモジュールのレーザ出力モニタ
のためフォトダイオード（１４＋がＴ０３９形ヘッダ（
４１の中心部のガラス窓（３１よシ取シ出したレーザダ
イオード後方出射光を屈折率分布形レンズ四ヲ介して受
光する。In addition, to monitor the laser output of the laser diode module, a photodiode (14+ is a T039 type header (
The rear emitted light from the laser diode is received through the central glass window 41 (31) through the gradient index lens 4.

このように、この発明によるレーザダイオ−・ドパッケ
ージはレーザダイオードモジュール構成品をレーザダイ
オード共振器の中心軸を中心軸とする同心円構造に組み
立てるのに都合が艮〈、シングルモードファイバ用レー
ザダイオードモジュールのような高精度ヲ要求される場
合にも適用でき、熱的に安定な構造のレーザダイオード
モジ、−ル１：１ｍ成できる。As described above, the laser diode package according to the present invention is convenient for assembling the laser diode module components into a concentric structure with the center axis of the laser diode resonator as the center axis. It can also be applied to cases where high precision is required, such as laser diode modules with a thermally stable structure.

な９９以上は馬蹄形ヒートシンクブロックをＴ０３９形
ヘッダー上へ装着する場合について説明し九が、この発
明はこれに限らず円形構造のヘッダーであればかまわな
い。また馬蹄形ヒートシンクブロックへの切り込みの形
状は正確なコの字形でなくても同心円構造を乱さないも
のであればかまわない。99 and above describe the case where a horseshoe-shaped heat sink block is mounted on a T039 type header, but the present invention is not limited to this, and any header having a circular structure may be used. Further, the shape of the cut into the horseshoe-shaped heat sink block does not have to be exactly U-shaped as long as it does not disturb the concentric structure.

以上のように、この発明によればヒートシンクブロック
に外形が円柱形となり、その一部に切シ込みをもうけた
ヒートシンクブロック金柑い、その中心部にレーザダイ
オードチップｔ−ｎ荷して円形のヘッダ上にレーザダイ
オードチップを中心とした同心状に装着した同心円構造
のレーザダイオードパッケージであるから、熱的に安定
な構造であり、かつ、ヒートシンク７°ロツクに切シ込
みがおるのでレーザダイオードチップのヒートシンクブ
ロックへの１％荷および電極リード線のポンディング作
業などが容易にできる利点がある。さらに、ヒートシン
クブロック上へ光学系ｔ−ｆｉｆｆｌ心円構造で装着す
ることができ、熱的に安定な構成を実現できるので、シ
ングルモードファイバ用レーザダイオードモジュールな
どの高精度會必要とする場合にも適用できる利点がある
。As described above, according to the present invention, the heat sink block has a cylindrical outer shape, a part of the heat sink block has a notch, and a laser diode chip is loaded in the center of the heat sink block, and a circular header is mounted. The laser diode package has a concentric structure with the laser diode chip mounted concentrically on the top, so it has a thermally stable structure, and there is a notch in the 7° lock of the heat sink, so the laser diode chip can be mounted concentrically. It has the advantage of making it easier to apply a 1% load to the heat sink block and to pound electrode lead wires. Furthermore, the optical system can be mounted on the heat sink block in a T-fiffl center-circular structure, achieving a thermally stable configuration, making it ideal for applications that require high precision, such as laser diode modules for single-mode fibers. There are applicable benefits.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明のレーザダイオードパッケージの一実
施例の上面図、第２図は第１図のＡ−Ａ′における断面
図、第３図は第１図に示したレーザダイオードパッケー
ジ上に光学系を組み立て、シングルモードファイバ用レ
ーザダイオードモジュールを構成する場合のモジュール
の一例の構成図である。 図中（１１は円柱形ヒートシンク、（２）はレーザダイ
オード、（３１はガラス窓、（４）はＴ０３９形ヘッダ
。 （５１はリード＠、　（６１は球レンズ、（７）は屈折
率分布形レンズ、　（８１はシングルモードファイ’＜
、　（９１ハ琢レンズホルダ、αＯはキャップ、０１１
は屈折率分布形レンズホルダ、■はヒートシンクブロッ
ク。 ０はファイバホルダ、αａはフォトダイオード。 四は屈折軍分布形レンズである。 な訃、■中、同一あるいは相当部分には同一符号を付し
て示しである。 代理人　葛　野　信　− 第３図FIG. 1 is a top view of an embodiment of the laser diode package of the present invention, FIG. 2 is a sectional view taken along line A-A' in FIG. FIG. 2 is a configuration diagram of an example of a module when a system is assembled to configure a single-mode fiber laser diode module. In the figure (11 is a cylindrical heat sink, (2) is a laser diode, (31 is a glass window, (4) is a T039 type header. (51 is a lead @, (61 is a ball lens, (7) is a gradient index type. Lens, (81 is single mode phi'<
, (91 C Taku lens holder, αO is cap, 011
indicates a gradient index lens holder, and ■ indicates a heat sink block. 0 is a fiber holder and αa is a photodiode. The fourth lens is a refractive force distribution type lens. (2) Identical or equivalent parts are indicated by the same reference numerals. Agent Shin Kuzuno - Figure 3

Claims (1)

【特許請求の範囲】 レーザダイオードチップを装荷するレーザダイオードパ
ッケージにおいて０円形のヘッダー上に１円柱のヒート
シンクがほぼ同心円状に装着されておシ、この円柱の一
部□がその母線にそって１円柱中心軸よシ深く切シ込ま
れておシ。 どのヒートシンク用ブロックの切シ込み部にレーザダイ
オードがその共畿器の中心軸がほぼこの円柱状のヒート
シンクの中心軸に一致するよう装着されていることを特
徴とするレーザダイオードパッケージ。[Claims] In a laser diode package loaded with a laser diode chip, a cylindrical heat sink is mounted almost concentrically on a 0-circular header, and a part of this cylinder □ is 1 along its generatrix. A deep cut is made along the center axis of the cylinder. A laser diode package characterized in that a laser diode is mounted in a cutout part of a heat sink block so that the center axis of the laser diode substantially coincides with the center axis of the cylindrical heat sink.
JP57051840A 1982-03-30 1982-03-30 Laser diode package Granted JPS58168289A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57051840A JPS58168289A (en) 1982-03-30 1982-03-30 Laser diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57051840A JPS58168289A (en) 1982-03-30 1982-03-30 Laser diode package

Publications (2)

Publication Number Publication Date
JPS58168289A true JPS58168289A (en) 1983-10-04
JPH0376036B2 JPH0376036B2 (en) 1991-12-04

Family

ID=12898049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57051840A Granted JPS58168289A (en) 1982-03-30 1982-03-30 Laser diode package

Country Status (1)

Country Link
JP (1) JPS58168289A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175587A (en) * 1984-09-20 1986-04-17 Mitsubishi Electric Corp Semiconductor laser device
JPS61104575U (en) * 1984-12-13 1986-07-03
FR2702313A1 (en) * 1993-03-04 1994-09-09 Mitsubishi Electric Corp Semiconductor light emission device
KR100789675B1 (en) 2006-12-11 2008-01-02 주식회사 코스텍시스 A crystal laser diode package
WO2016114224A1 (en) * 2015-01-13 2016-07-21 三菱電機株式会社 Laser module and method for producing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147887A (en) * 1974-05-17 1975-11-27
JPS5546599A (en) * 1978-09-28 1980-04-01 Exxon Research Engineering Co Package for semiconductor optoelectronic device
JPS5717165U (en) * 1980-07-04 1982-01-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147887A (en) * 1974-05-17 1975-11-27
JPS5546599A (en) * 1978-09-28 1980-04-01 Exxon Research Engineering Co Package for semiconductor optoelectronic device
JPS5717165U (en) * 1980-07-04 1982-01-28

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6175587A (en) * 1984-09-20 1986-04-17 Mitsubishi Electric Corp Semiconductor laser device
JPH0231869B2 (en) * 1984-09-20 1990-07-17 Mitsubishi Electric Corp
JPS61104575U (en) * 1984-12-13 1986-07-03
FR2702313A1 (en) * 1993-03-04 1994-09-09 Mitsubishi Electric Corp Semiconductor light emission device
US5519720A (en) * 1993-03-04 1996-05-21 Mitsubishi Denki Kabushiki Kaisha Semiconductor light emitting device
KR100789675B1 (en) 2006-12-11 2008-01-02 주식회사 코스텍시스 A crystal laser diode package
WO2016114224A1 (en) * 2015-01-13 2016-07-21 三菱電機株式会社 Laser module and method for producing same

Also Published As

Publication number Publication date
JPH0376036B2 (en) 1991-12-04

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