JPS5816676U - IC package - Google Patents

IC package

Info

Publication number
JPS5816676U
JPS5816676U JP10952281U JP10952281U JPS5816676U JP S5816676 U JPS5816676 U JP S5816676U JP 10952281 U JP10952281 U JP 10952281U JP 10952281 U JP10952281 U JP 10952281U JP S5816676 U JPS5816676 U JP S5816676U
Authority
JP
Japan
Prior art keywords
package
recorded
stamp
electronic filing
displaying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10952281U
Other languages
Japanese (ja)
Inventor
古橋　時男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10952281U priority Critical patent/JPS5816676U/en
Publication of JPS5816676U publication Critical patent/JPS5816676U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す斜視図である。 １はプラスティックモールドパッケージ、２は捺印領域
、３はパッケージの方向区分目印、４は刻印跡である。FIG. 1 is a perspective view showing an embodiment of the present invention. 1 is a plastic mold package, 2 is a stamping area, 3 is a mark for directional division of the package, and 4 is a stamp mark.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 製造業社茗又は製造地を、製品の表面のパッケージ上に
刻印の形で表示したことを特徴とするＩＣパッケージ。An IC package characterized by displaying the manufacturer name or place of manufacture in the form of a stamp on the surface of the package.
JP10952281U 1981-07-23 1981-07-23 IC package Pending JPS5816676U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10952281U JPS5816676U (en) 1981-07-23 1981-07-23 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10952281U JPS5816676U (en) 1981-07-23 1981-07-23 IC package

Publications (1)

Publication Number Publication Date
JPS5816676U true JPS5816676U (en) 1983-02-01

Family

ID=29903901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10952281U Pending JPS5816676U (en) 1981-07-23 1981-07-23 IC package

Country Status (1)

Country Link
JP (1) JPS5816676U (en)

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