JPS5816574A - Zener diode - Google Patents

Zener diode

Info

Publication number
JPS5816574A
JPS5816574A JP11371581A JP11371581A JPS5816574A JP S5816574 A JPS5816574 A JP S5816574A JP 11371581 A JP11371581 A JP 11371581A JP 11371581 A JP11371581 A JP 11371581A JP S5816574 A JPS5816574 A JP S5816574A
Authority
JP
Japan
Prior art keywords
impurity
conductivity type
region
diffusion region
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11371581A
Other languages
Japanese (ja)
Inventor
Akira Matsuura
彰 松浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11371581A priority Critical patent/JPS5816574A/en
Publication of JPS5816574A publication Critical patent/JPS5816574A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/866Zener diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To obtain a Zener diode with high stability, by providing a peak density profile with the width corresponding to the fluctuation width of the density profile on an N<+> type diffused region which is crossed therewith. CONSTITUTION:When forming the P<+> type diffused region 3, a plurality of times of boron impurity ion implantations are performed. The peak density of elongation-diffused impurity after an implantation is evenly formed by varying an implantation energy of each time and controlling a dope amount. In this process, the impurity density profile of the P<+> type region is formed in a trapezoid, and the diffusion depth for the N<+> type diffused region 4 is set to the central depth of the trapezoidal part. Thereby, the fluctuation of a breakdown voltage due to the dispersion of the P type impurity density or diffusion depth can be reduced.

Description

【発明の詳細な説明】 本発明は高安定性定電圧ダイオードに関する。[Detailed description of the invention] The present invention relates to high stability voltage regulator diodes.

定電圧ダイオードとして通常知られているNPN構造は
、第trg<示すよ5に、例えばN[エピタキシャル層
からなる基板lの表面にPgベース拡散による2M領域
2な形成してその一部1に深い高濃度のP+層3とし、
2厘領域2の表面の一部にN++エミッタ拡散によるN
+型領領域4形成したものであり %+ m領域4とP
臘領域2(又は3)とのPN!合に対して逆方向電圧印
加による降伏定電圧現象な利用したものである。かかる
定電圧ダイオードの不純物濃度グロファイルは第2図の
ように示されるが、表面降伏型ダイオードでは低濃度側
のP属領域2の拡散濃度により、同図人の部分で降伏が
起り、又、バルク降伏型ダイオードでは高濃度側のP+
型領域3とN+型領領域4不純物グロファイルが交わる
点Bの部分で降伏が起る。そして前者の場合はPfi(
ペース)拡散濃度によって降伏電圧が変動しやすく、後
者の場合はP+型領域3の拡散濃度やN+型領領域4拡
散深さKよって降伏電圧が変動する(NpNのh□によ
り影響される)という欠点をさけられなかった。
The NPN structure, which is commonly known as a constant voltage diode, has a 2M region 2 formed by Pg base diffusion on the surface of a substrate 1 consisting of an N [epitaxial layer, for example, and a deep region 1 in a part 1 of the NPN structure, which is usually known as a constant voltage diode. High concentration P+ layer 3,
A part of the surface of the 2-layer region 2 is filled with N by N++ emitter diffusion.
+ type region 4 is formed %+ m region 4 and P
PN with 臘 area 2 (or 3)! This method takes advantage of the constant breakdown voltage phenomenon caused by applying a voltage in the reverse direction. The impurity concentration profile of such a constant voltage diode is shown in FIG. 2, but in the surface breakdown type diode, breakdown occurs in the part of the figure due to the diffusion concentration of the P group region 2 on the low concentration side. In a bulk breakdown diode, P+ on the high concentration side
Breakdown occurs at point B where the impurity profiles of type region 3 and N+ type region 4 intersect. And in the former case, Pfi (
Pace) The breakdown voltage tends to vary depending on the diffusion concentration, and in the latter case, the breakdown voltage varies depending on the diffusion concentration of the P+ type region 3 and the diffusion depth K of the N+ type region 4 (it is influenced by the h□ of NpN). I couldn't avoid my shortcomings.

本発明は上記した従来技術の欠点を織り除くべくなされ
たものであり、その目的は高安定性の定電圧ダイオード
の提供にあり、又、バルク降伏型であっても低ドリフト
で高精度の定電圧ダイオードを得ることにある。
The present invention has been made to eliminate the drawbacks of the prior art described above, and its purpose is to provide a highly stable constant voltage diode, and also to provide a high-precision constant voltage diode with low drift even if it is a bulk breakdown type. The purpose is to obtain a voltage diode.

本発明による定電圧ダイオードは、第1図で示したNP
N構造において、第3図に示すようにノ(ルク降伏型ダ
イオードをつくるP+型拡散領域なそのピーク績度プロ
ファイルがこれと又差するN++拡散領域の濃度グロフ
ァイルの変動幅に少なくとも対応する程度の幅なもたせ
るものである。このためKは、 p+m+散領域の形成
にあたっては第4図に示すように複数回のポロン不純物
イオン打込みを行なって各回の打込みエネルギーな変え
、ることKよりBP、R,□、fL□I fLPl、”
”と変え、かつドーズ量をコントロールすることにより
打込み後の引伸し拡散された不純物のピーク貴度な等し
く形成する。このR,はN+拡散(又は継イオン打込み
)Kより形成されるN++散層深さXjに近い値な選択
し、X3の変動11Xdを考慮してボロンイオン打込み
回数な決める必要がある。
The voltage regulator diode according to the present invention is a NP shown in FIG.
In the N structure, as shown in FIG. For this reason, when forming the p+m+ dispersion region, K can be changed by implanting boron impurity ions multiple times and changing the implantation energy each time, as shown in Figure 4. R, □, fL□I fLPl,”
” and by controlling the dose amount, the peak quality of the stretched and diffused impurity after implantation is formed to be equal. This R, is the depth of the N++ diffusion layer formed by N+ diffusion (or secondary ion implantation) K. It is necessary to select a value close to Xj, and to decide the number of boron ion implantations in consideration of the fluctuation 11Xd of X3.

以上のようなプロセスを採用することKよってP+型領
域の不純物ピーク濃度プロファイルを台状に形成し、N
++拡散領域の拡散深さXj を上記台状部の中心深さ
に設定すること罠より、P型不純物濃度やXjのばらつ
きによる降伏電圧V。
By employing the above process, the impurity peak concentration profile of the P+ type region is formed into a trapezoidal shape, and the N
++ By setting the diffusion depth Xj of the diffusion region to the center depth of the above-mentioned trapezoid, the breakdown voltage V due to variations in the P-type impurity concentration and Xj.

変動を極力小さくすることができる。例えば、従来屋の
場合、降伏電圧V、のばらつきは6,5±0.5V(約
10fiのばらつき)があったのに対し本発明によれば
降伏電圧vlのばらつきは殆んど無袂しうるほどであり
、NpNのhFI K関係なく安定度の高い定電圧ダイ
オードな供給することができる。
Fluctuations can be minimized. For example, in the case of the conventional device, the variation in breakdown voltage V was 6.5 ± 0.5 V (variation of about 10 fi), but with the present invention, the variation in breakdown voltage V is almost negligible. It is possible to supply a highly stable constant voltage diode regardless of the NpN hFI K.

本発明は例に掲げたNPN構造以外にPNP構造の場合
にも同様に適用できる。
The present invention can be applied to a PNP structure in addition to the NPN structure mentioned in the example.

本発明はバルク降伏型においても低ドリフトで高精度、
定電圧ダイオード?実現できるものである。
The present invention has low drift and high precision even in the bulk breakdown type.
Constant voltage diode? This is something that can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1・図はNpN構造なもつ定電圧ダイオードの断面図
、第2図は従来の定電圧ダイオニドにおける不純物濃度
プロファイルの例を示す曲線図、第3図は本発明による
定電圧ダイオードにおける不純物濃度プロファイルの例
な示す曲線図、第4図は第3図のP盤不純物濃度グロフ
ァイルな得るためのプロセスの一部を示す曲線部である
。 l・・・N型エピタキシャル(基板)、2・・・P型領
域、3・・・P+屋領領域4・・・N+型領領域代理人
 弁理士  薄 1)利 幸 第  1  図 / 第  2  図 に面            パル7
Figure 1 is a cross-sectional view of a constant voltage diode with an NpN structure, Figure 2 is a curve diagram showing an example of an impurity concentration profile in a conventional constant voltage diode, and Figure 3 is an impurity concentration profile in a constant voltage diode according to the present invention. FIG. 4 is a curved section showing a part of the process for obtaining the P disk impurity concentration profile of FIG. 3. l...N type epitaxial (substrate), 2...P type region, 3...P+ type region 4...N+ type region Agent Patent attorney Susuki 1) Toshiyuki Daiichi Figure 1/2 Figure on Pal 7

Claims (1)

【特許請求の範囲】 1、第1導電型半導体基板の表面に第2導電型不純物拡
散領域を形成し、第2導電屋拡散領域の表面の一部に第
1導電瀝不純暢高濃度拡散領域を形成し、第1導電型拡
散領域と第2導電型拡散領域との半導体接合の降伏電圧
現象な利用した定電圧ダイオードにおいて、第2導電型
拡散領域の不純物繊度グロファイルのピーク部分を台状
となるように形成し、この台状の部分で#11導電灘高
濃膜製域の不純物濃度プロファイルを交差させたことな
特徴とする定電圧ダイオード。 2、上記第2導電盟拡散領域はエネルギな変えた複数回
のボロンイオン打込みKより形成した特許請求の範囲第
1項に記載の定電圧ダイオード。
[Claims] 1. A second conductivity type impurity diffusion region is formed on the surface of the first conductivity type semiconductor substrate, and a first conductivity impurity high concentration diffusion region is formed on a part of the surface of the second conductivity type semiconductor substrate. In a constant voltage diode that utilizes the breakdown voltage phenomenon of a semiconductor junction between a first conductivity type diffusion region and a second conductivity type diffusion region, the peak portion of the impurity fineness profile of the second conductivity type diffusion region is shaped like a trapezoid. A constant voltage diode characterized in that the impurity concentration profile of the #11 conductive Nada high concentration film region intersects at this trapezoidal portion. 2. The constant voltage diode according to claim 1, wherein the second conductive diffusion region is formed by boron ion implantation K a plurality of times at different energies.
JP11371581A 1981-07-22 1981-07-22 Zener diode Pending JPS5816574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11371581A JPS5816574A (en) 1981-07-22 1981-07-22 Zener diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11371581A JPS5816574A (en) 1981-07-22 1981-07-22 Zener diode

Publications (1)

Publication Number Publication Date
JPS5816574A true JPS5816574A (en) 1983-01-31

Family

ID=14619308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11371581A Pending JPS5816574A (en) 1981-07-22 1981-07-22 Zener diode

Country Status (1)

Country Link
JP (1) JPS5816574A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082331A2 (en) * 1981-12-22 1983-06-29 International Business Machines Corporation Subsurface avalanche breakdown Zener diode
EP0160919A2 (en) * 1984-05-09 1985-11-13 Analog Devices, Inc. Process for forming ic wafer with buried zener diode
US4771011A (en) * 1984-05-09 1988-09-13 Analog Devices, Incorporated Ion-implanted process for forming IC wafer with buried-Zener diode and IC structure made with such process
US4886762A (en) * 1985-08-06 1989-12-12 Motorola Inc. Monolithic temperature compensated voltage-reference diode and method for its manufacture
NL2019537A (en) * 2016-09-13 2018-03-15 Shindengen Electric Mfg Semiconductor device and method of manufacturing the same
CN112967927A (en) * 2021-02-26 2021-06-15 西安微电子技术研究所 Preparation method of voltage stabilizing diode with stable breakdown voltage

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0082331A2 (en) * 1981-12-22 1983-06-29 International Business Machines Corporation Subsurface avalanche breakdown Zener diode
EP0160919A2 (en) * 1984-05-09 1985-11-13 Analog Devices, Inc. Process for forming ic wafer with buried zener diode
US4771011A (en) * 1984-05-09 1988-09-13 Analog Devices, Incorporated Ion-implanted process for forming IC wafer with buried-Zener diode and IC structure made with such process
US4886762A (en) * 1985-08-06 1989-12-12 Motorola Inc. Monolithic temperature compensated voltage-reference diode and method for its manufacture
NL2019537A (en) * 2016-09-13 2018-03-15 Shindengen Electric Mfg Semiconductor device and method of manufacturing the same
CN112967927A (en) * 2021-02-26 2021-06-15 西安微电子技术研究所 Preparation method of voltage stabilizing diode with stable breakdown voltage

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