JPS58161980A - Composite ceramic material - Google Patents
Composite ceramic materialInfo
- Publication number
- JPS58161980A JPS58161980A JP4402282A JP4402282A JPS58161980A JP S58161980 A JPS58161980 A JP S58161980A JP 4402282 A JP4402282 A JP 4402282A JP 4402282 A JP4402282 A JP 4402282A JP S58161980 A JPS58161980 A JP S58161980A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic material
- material according
- composite ceramic
- ceramic
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Circuit Breakers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は基材セラミック表面を表面処理または改質して
表面付着性（濡れ性）を減少させた複合セラミック材料
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite ceramic material whose surface adhesion (wettability) is reduced by surface treatment or modification of the base ceramic surface.
従来のセラミック材料を用いた遮断器用ノズルの一例を
第１図により説明すると、単一のセラミックまたはテフ
ロン基材／中にＳＦ、ガス等コが充填しており、この部
分でアークが発生し電極金属の蒸発により金属粉、金属
弗化物、金属酸化物等を生成する。図中、基材ｌがセラ
ミックの場合、アークにより生成した上記生成物が基材
ｌの表面に付着し、沿面耐電圧等の表面特性を低下させ
る。An example of a circuit breaker nozzle using a conventional ceramic material is explained with reference to Fig. 1.A single ceramic or Teflon base material is filled with SF, gas, etc., and an arc is generated in this part and the electrode Metal powder, metal fluoride, metal oxide, etc. are produced by evaporation of metal. In the figure, when the base material 1 is made of ceramic, the above-mentioned products generated by the arc adhere to the surface of the base material 1, reducing surface characteristics such as creeping withstand voltage.
また、基材／がテフロンの場合、アークによる生成物の
付着は少ないものの耐熱性が低いため内部から発泡した
り、クラック発生現象を生じ消耗が大きく、また機械的
強度や硬さが不足しており、大電流アーク迩断器の場合
設計が難しいという欠点があつ九。In addition, when the base material is Teflon, although there is little adhesion of products due to arcing, the heat resistance is low, so foaming occurs from inside, cracking occurs, and wear and tear is large, and mechanical strength and hardness are insufficient. However, the drawback is that it is difficult to design a large current arc breaker.
上述したように、従来のセラミック材料、例えば遮断器
用セラミック材料は、テフロン等の有機遮断器用材料と
比較して、アーク遮断時における電極金属の蒸発により
生成する金属粉などの付着物の表面付着性（濡れ性）が
大きく、例えば８Ｐ。As mentioned above, conventional ceramic materials, such as ceramic materials for circuit breakers, have a higher tendency to adhere to the surface of deposits such as metal powder generated by evaporation of electrode metal during arc interruption than organic circuit breaker materials such as Teflon. (wettability) is large, for example 8P.
ガス遮断器用ノズルとして使用した場合、金属弗化物を
セラミック内面に付着して沿面耐電圧等の表面特性を低
下させ易いという欠点があった。このため従来、表面付
着性の小さいテフロン（Ｐテｔｒｚ）が使用されてきた
。しかし、テフロン材料は大電流のアークに曝露された
場合、テフロン内部より発泡したり、クラック発生現象
を生じ消耗が大きくなることや耐熱性が不十分なこと等
の欠点があり、一層の性能向上が望まれて−た。When used as a nozzle for a gas circuit breaker, there is a drawback that metal fluorides tend to adhere to the inner surface of the ceramic, resulting in a decrease in surface characteristics such as creeping withstand voltage. For this reason, Teflon (Ptetrz), which has low surface adhesion, has conventionally been used. However, Teflon materials have drawbacks such as foaming from inside the Teflon, cracking, and increased wear when exposed to a large current arc, as well as insufficient heat resistance. was desired.
本発明はセラミック材料の基材セラミック表面を表面処
理または改質して、上記従来セラミックの欠点である表
面付着性（濡れ性）を減少させ、かつセラミック材の利
点であるすぐれた機械強度、固さ、高温までの耐熱安定
性、耐消耗性郷を生かすことにより、大電流アーク遮断
に適した新たなセラミック材料を提供するものである。The present invention treats or modifies the base ceramic surface of a ceramic material to reduce the surface adhesion (wettability), which is a drawback of conventional ceramics, and also provides excellent mechanical strength and hardness, which are the advantages of ceramic materials. By taking advantage of its heat resistance, stability up to high temperatures, and wear resistance, it provides a new ceramic material suitable for interrupting large current arcs.
本発明はセラミック材料の基材セラミック表面を表面処
理した複合セラミック材料に関するものである。表面処
理は該基材セラミック表面に弗素系樹脂、ポリエチレン
勢を含む有機物をコーティングして行う、または該基材
セラミック表面に界面活性剤をコーティングして行う、
または該基材セラミック表面をあらかじめ適当なアーク
曝露雰囲気下で改質処理して行う、または該基材セラミ
ック表面に別種のセラミック（弗化物、酸化物、窒化物
、炭化物、ホウ化物、リン化物）をコーティングまたは
混入して行う、または該基材セラミック表面を放射線若
しくは電磁波照射等の物理化学的方法により行う、また
セラミック材料がアルミナを９２％以上含んでもよく、
またセラミック材料の用途がガス遮断器のアーク発生部
のフローガイド用ノズルを含む複合セラミック材料に関
する。The present invention relates to a composite ceramic material in which the surface of a ceramic base material of a ceramic material is surface-treated. The surface treatment is carried out by coating the surface of the base ceramic with an organic substance containing a fluorine-based resin or polyethylene, or by coating the surface of the base ceramic with a surfactant.
Alternatively, the surface of the base ceramic is modified in advance in an appropriate arc exposure atmosphere, or the surface of the base ceramic is coated with another type of ceramic (fluoride, oxide, nitride, carbide, boride, phosphide). The ceramic material may contain 92% or more of alumina.
Further, the application of the ceramic material relates to a composite ceramic material including a flow guide nozzle of an arc generating part of a gas circuit breaker.
以下に、本発明による複合セラミック材料を用いた連断
器用ノズルを示す第一図に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Below, a description will be given based on FIG. 1 showing a nozzle for a disconnector using a composite ceramic material according to the present invention.
セラミック基材３表面のアークによる生成物が付着し易
い部分を表面処理して表面付着性（濡れ性）を減少させ
た表面層がダである。この表面処理は以下のような方法
により行われる。A surface layer is a surface layer in which the surface of the ceramic substrate 3 is treated to reduce surface adhesion (wettability) to a portion where products caused by arcing tend to adhere. This surface treatment is performed by the following method.
（１） 弗素系樹脂やポリエチレン等の表面付着性（
濡れ性）の少ない有機−を基材セラミック上表面にコー
ティングする。(1) Surface adhesion of fluorine resins, polyethylene, etc.
An organic material with low wettability is coated on the top surface of the base ceramic.
例えば、弗素系樹脂であるテフロンの場合、コーティン
グ用市販品（例：三井クロロケミカル（株））の水溶性
懸濁溶液をセラミック基材表面に数回刷毛塗りし、風乾
を繰り返し人後、約３０θ℃にて１時間乾燥することに
より一様なテフロンコーティング層を形成する。For example, in the case of Teflon, which is a fluorine-based resin, a water-soluble suspension solution of a commercially available coating product (e.g., Mitsui Chlorochemical Co., Ltd.) is applied with a brush to the surface of the ceramic substrate several times, and air-dried repeatedly. A uniform Teflon coating layer is formed by drying at 30θ°C for 1 hour.
（２） セラミック基材表面に界面活性剤をコーティン
グする。用いる界面活性剤は陰イオン界面活［ＩＪ（フ
ルキルベンゼンスルホン酸ナトリウム等）、天然界面活
性剤、（ゼラチン等）等である。セラミック基材表面へ
のコーティングは、上記の界面活性 ′剤を含む溶液を
スプレー、浸漬、刷毛塗ｂｉ乾燥させて行う。(2) Coating the surface of the ceramic substrate with a surfactant. The surfactant used is an anionic surfactant [IJ (sodium flukylbenzenesulfonate, etc.), natural surfactant, (gelatin, etc.), etc. Coating on the surface of the ceramic substrate is carried out by spraying, dipping, brushing, and drying a solution containing the above-mentioned surfactant.
（３） セラミック基材内面をあらかじめ適当なアー
ク＠篇雰囲気下で改質処理して基材の材質を表面付着性
の低い変態に改質する。(3) The inner surface of the ceramic base material is modified in advance in an appropriate arc atmosphere to modify the material of the base material to a transformed state with low surface adhesion.
例えばセラミック材料が９コチ以上のアルミナ（α−ア
ルミナ）を含むときそのａ−アルミナをヱーアルミナに
改質する。アーク曝露雰囲気は通常Ｎ、ガス、ヘリウム
ガス、ＳＦ６ガス等の非酸化性のガス雰囲気中で行う。For example, when the ceramic material contains 9 or more alumina (α-alumina), the a-alumina is modified to e-alumina. The arc exposure atmosphere is usually a non-oxidizing gas atmosphere such as N, gas, helium gas, SF6 gas, etc.
（４） セラミック基材表面に表面付着性の小さい別
穐のセラミックをコーティングする。(4) Coat the surface of the ceramic substrate with a different type of ceramic that has low surface adhesion.
コーティングするセラミックの種類は、弗化物（０ａｒ
２． ＣａＦ２． ＭｇＦ、 、 ＡｊＦ、等）、酸化
物（ＭｇＯ、ＺｒＯ，、８ｎＯ，、Ｎｏ、等）、窒化物
（ＢＮ。The type of ceramic to be coated is fluoride (0ar
2. CaF2. MgF, , AjF, etc.), oxides (MgO, ZrO, , 8nO,, No, etc.), nitrides (BN, etc.).
Ｓｉ、Ｎ４． Ａ４Ｎ 、 ＺｒＮ 、 ＴａＮ 、
Ｔｉｎ等）、炭化物（ＳｉＣ！、 Ｂ４Ｃ，ＺｒＯ，Ｗ
ｅ、 Ｎｂ（！、 Ｔｉｅ、 Ｔａｇ。Si, N4. A4N, ZrN, TaN,
Tin, etc.), carbides (SiC!, B4C, ZrO, W
e, Nb(!, Tie, Tag.
Ｍｏ、Ｃ、Ｔｉｅ −ＴｉＮ固溶体等）、ホウ化物（Ｚ
ｒＢ２゜ＴｉＢ２． ＡＪ［，２，５ｉＢ４． Ｅｌｉ
Ｂ４等）、リン化物（ＢＩＳＰ２等）からなる各化合物
群中から選択され例えばＢｙ （窒化ホウ素）をアルミ
ナ基材表面にコーティングするには、ＢＮを無機結合剤
と共に酸性水溶液中に混合した溶液を、スプレー、浸漬
、または刷毛塗りのいずれかの適当な方法によって基材
表面に塗布し、室温乾燥後コＯＯ〜１００℃で７３分間
焼きつけし、さらに非酸化雰囲気中で／１００”ＣＫ加
熱してＢＮコーティング層を形成する。Mo, C, Tie-TiN solid solution, etc.), borides (Z
rB2°TiB2. AJ[,2,5iB4. Eli
B4, etc.), phosphides (BISP2, etc.), for example, to coat the surface of an alumina substrate with By (boron nitride), a solution of BN mixed with an inorganic binder in an acidic aqueous solution is used. It is applied to the surface of the substrate by any suitable method such as spraying, dipping, or brushing, and after drying at room temperature, it is baked for 73 minutes at ~100°C, and then heated to /100°C in a non-oxidizing atmosphere. Form a BN coating layer.
他の例で、アルミプセラミック（通常の９コチアルミナ
、融点１５θＯ〜／４００℃）に弗化カルシウムＣ！ａ
Ｆ、 （融点／ＪＡＯ℃、沸点コｚｏｏ℃）をコーティ
ングするＫｄ、重量比で５〜１０−のＰＶＡ（ポリビニ
ルアルコール）水溶液に混合したＣａＦ、をセラミック
基材表面に厚さ／ ｍｍ程度で刷毛塗りし、風乾後ＳＯ
θ〜１００℃にて約４時間乾燥した後、昇温速度ｔｏｏ
”ｃ／時間程度で徐々に加熱し所定温度／１００℃で１
時間保持する。次いでｉｏｏ℃／時間で室温まで徐冷し
てコーティング層を形成する。以上の操作はＭ素ガス雰
囲気中で行い、生成コーティング層は０． Ｊ ｎ＞ｍ
程度の厚さで表面に少々のクラックが入っても使用上問
題はない。Another example is calcium fluoride C! a
F, coating Kd (melting point/JAO℃, boiling point: zoo℃), CaF mixed in a PVA (polyvinyl alcohol) aqueous solution with a weight ratio of 5 to 10, is brushed onto the surface of the ceramic substrate to a thickness of about mm. After painting and air drying, SO
After drying at θ~100°C for about 4 hours, the temperature increase rate is too
1. Heat gradually at about 100℃/hour to a specified temperature/100℃.
Hold time. Then, the mixture is gradually cooled to room temperature at a rate of 100° C./hour to form a coating layer. The above operations were performed in an M gas atmosphere, and the resulting coating layer was 0. J n>m
Even if there are some cracks on the surface due to the thickness, there is no problem in use.
（５） 前記したコーテイ・ングに用いるセラミック
を基材セラミック表面へ混入し新たな表面層を形成する
。(5) The ceramic used for coating as described above is mixed into the surface of the base ceramic to form a new surface layer.
例えばアルミナセラミック基材に（！ａＦ２を混入する
には、成形前の粉末アルミナにＣａＦ、粉末をよく混合
しＮ、雰囲気中で昇温速度ｌθＯ℃／時間程度で徐々に
加熱し、所定温度Ｉ１０θ℃で１時間加熱保持し焼成す
る。次いでｉｏｏ℃／時間で室温まで徐冷してＣａＦ２
が混入した基材を得る。この混入はセラミック基材表面
だけでなく基材表面全体に行ってもよい。For example, to mix (!aF2) into an alumina ceramic base material, the powdered alumina before molding is thoroughly mixed with CaF and powder, heated gradually in a N atmosphere at a heating rate of about lθO℃/hour, and then heated to a predetermined temperature I10θ ℃ for 1 hour and calcined. Then, slowly cooled to room temperature at ioo℃/hour to release CaF2.
A base material mixed with is obtained. This mixing may be carried out not only on the surface of the ceramic substrate but also on the entire surface of the substrate.
（６） セラミック基材表面を放射！ｆｉ；Ｊまたは
電磁波照射等の物理化学的方法により表面処理する。(6) Radiate the surface of the ceramic base material! The surface is treated by a physicochemical method such as fi;J or electromagnetic wave irradiation.
例えばアルミナ製部品を真空中に保持し、これに／θθ
万ｅｖ（エレクトロンボルト）の電子線を１分間以上照
射する。For example, if an alumina part is held in a vacuum and the /θθ
Irradiate with an electron beam of 10,000 ev (electron volts) for more than 1 minute.
以上のような表面処理によりセラミック材料の表面付着
性（濡れ性）を減少させ安定した表面特性を得ることを
可能とする。The surface treatment described above reduces the surface adhesion (wettability) of the ceramic material and makes it possible to obtain stable surface characteristics.
本発明による複合セラミック材料はガス迩断器のアーク
発生部におけるフロー・ガイド用ノズルとして優れ、さ
らに絶縁碍子、真空スイッチの外装、ナトリウムランプ
の発光管、マグネトロンの窓、ＩＣパッケージ、半導体
の外装などにも使用できる。The composite ceramic material of the present invention is excellent as a flow guide nozzle in the arc generating part of a gas circuit breaker, and is also used as an insulator, the exterior of a vacuum switch, the arc tube of a sodium lamp, the window of a magnetron, an IC package, and the exterior of a semiconductor. It can also be used for
次に実施例により本発明をさらに具体的に説明する。Next, the present invention will be explained in more detail with reference to Examples.
実施例
アルミナ製試料について、表面の改質を行っていない試
料ム（９コチアルミナ）及びＢＩＪ （窒化ホウ素）を
前記Ｃ！ａＦ、と同様な混入方法によりアルミナ試料に
混入させた試料Ｂそれぞれの試料表面に約コＫＡ （
キロアンペア）のアークを曝露し、アーク消滅直後の両
試料の一点間（距離Ｊ ｍｍ ）の耐電圧値を測定した
。第３図及び第参図はそれぞれ試料ム及び試料Ｂの印加
電圧の経時変化を示している。第３図中、試料ムのグラ
フではアーク曝露後（グラフ中ａ点）、耐電圧値を測定
するための両電極間に電極金属等が多く付着しているた
め、はとんど導通状態とな夛電極間の耐電圧値は零とな
っている。Example Regarding the alumina samples, the sample (9-sided alumina) whose surface was not modified and BIJ (boron nitride) were subjected to the above C! Approximately KA (
An arc of kiloamperes) was exposed, and the withstand voltage value between one point (distance J mm) of both samples was measured immediately after the arc extinguished. 3 and 3 show changes over time in the applied voltages of sample M and sample B, respectively. In Figure 3, the graph for the sample shows that after arc exposure (point a in the graph), there is a lot of electrode metal etc. attached between the two electrodes used to measure the withstand voltage value, so it is mostly in a conductive state. The withstand voltage value between the multiple electrodes is zero.
これに対し第ダ図の試料Ｂのグラフではアーク曝露直後
のｂ点が示すようにアルミナ試料表面を改質して表面付
着性を減少させたため、両電極間に付着物が少く約１０
０ボルトの大きさの電極間耐電圧値が得られたことを示
している。On the other hand, as shown in the graph of sample B in Figure D, the surface of the alumina sample was modified to reduce surface adhesion, as shown by point b immediately after arc exposure.
This shows that an interelectrode withstand voltage value of 0 volts was obtained.
このように本発明は基材セラミック表面を表面処理して
表面付着性（濡れ性）を減少させることによって、アー
クによる生成物等の付着を防ぐと共に所定の表面特性を
維持し、耐消耗性、機械強度、固さ等を生かした設計が
可能となる新しいセラミック材料を提供するものである
。In this way, the present invention treats the base ceramic surface to reduce surface adhesion (wettability), thereby preventing the adhesion of products etc. due to arcing, maintaining predetermined surface characteristics, and improving wear resistance and The aim is to provide a new ceramic material that can be designed to take advantage of mechanical strength, hardness, etc.
第１図ａ及びｂはそれぞれ従来のセラミック材料を用い
た連断器用ノズルを示す部分縦断面図及び側面図、第一
図ａ及びｂはそれぞれ本発明による複合セラミック材料
を用いた遮断器用ノズルを示す部分縦断面図及び側面図
、第３図はアルミナセラミック試料の電圧の経時変化を
示す図、第ダ図はＢＮを混入したアルミナセラミック試
料の電圧の経時変化を示す図である１図中、
ｌ・・単一のセラミックまたはテフロン基材、−・・８
Ｐ ガス等を充填した空間、３・・セラミツク基材、
゛り・・表面処理した表面層。
代 理 人 葛 野 信 −
１ｌ１Ｆ ｌ：ｌ：！（４ｊｆ） 幹田（Ｉ
Ｓ−＞ｆ）手続補正書（自発）
１．￥許庁長宮殿
１．１１件の表示 特願昭 Ｉツー〇ｌ１ｌＯ１
１号２、発明の名称 複合セツ々ツク材料：３
補正をする者
事件との関係 特許出願人
住 所 東京都千代田区丸の内二丁目２番３号
名 称（６０１） 三菱電機株式会社代表者片山仁
八部
４、代理人
住 所 東京都千代田区丸の内二丁目２番３号
三菱電機株式会社内
氏 名（６６９９） 弁理士 葛 野 信
−（連し％先０３（２１３）３（２１４５Ｊ′ｒ部）（
１）
本補正の対象
＋１１明細書の発明の詳細な説明の欄
４補正の内容Figures 1a and b are partial vertical cross-sectional views and side views respectively showing a conventional nozzle for a connecting circuit breaker using a ceramic material, and Figures 1a and b are respectively a nozzle for a circuit breaker using a composite ceramic material according to the present invention. Figure 3 is a diagram showing the change in voltage over time of an alumina ceramic sample, and Figure D is a diagram showing a change in voltage over time of an alumina ceramic sample mixed with BN.In Figure 1, l...Single ceramic or Teflon base material, -...8
P: Space filled with gas, etc., 3: Ceramic base material,
゛ri... Surface treated surface layer. Agent Shin Kuzuno - 1l1F l:l:! (4jf) Mikida (I
S->f) Procedural amendment (voluntary) 1. ￥Hsu Commissioner's Palace 1. Showing 11 results Tokugansho I2〇l1lO1
No. 1 2. Name of the invention Composite set material: 3
Relationship with the person making the amendment Patent applicant address 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Mitsubishi Electric Corporation Representative Hitoshi Katayama 4, Agent address Marunouchi, Chiyoda-ku, Tokyo 2-2-3 Mitsubishi Electric Corporation Name (6699) Patent attorney Shin Kuzuno
-(Continuous % destination 03 (213) 3 (2145J'r section) (
1) Subject of this amendment + 11 Contents of amendment in column 4 of detailed description of the invention in the specification
Claims (1)
処理してなる複合セラミック材料。 偉） 表面処理が有機物をコーティングして行う特許請
求の範囲第１項記載の複合セラミック材料。 （３） 表面処理が基材セラミック表面に界面活性剤
をコーティングして行う特許請求の範囲第１項記載の複
合セラミック材料。 （４１表面処理が基材セラミック表面をあらかじめ適当
なアーク曝露雰囲気下で改質処理して行う特許請求の範
囲第１項記載の複合セラミック材料。 俤） 表面処理が基材セラミック表面に別種のセラミッ
クをコーティングまたは混入して行う特許請求の範囲第
１項記載の複合セラミック材料。 （６） 表面処理が所定の物理化学的方法によりなさ
れる特許請求の範囲第１項記載の複合セラミック材料。 （７） セラミック材料がアルミナをｔ−一以上含ん
でなる特許請求の範囲第１項記載の複合セラミック材料
。 （８） セラミック材料がガス遮断器のアーク発′生
部においてフロー・ガイド用ノズルとして使用される特
許請求の範囲第１項記載の複合セラミック材料。 （９） 有機物が弗素系樹脂、ポリエチレン等か（なる
特許請求の範囲第２項記載の複合セラミック材料。 ａｌ 別種のセラミックがＣａｒ、 、 ＯｕＦ、
、 ＭｇＦ、。 Ａ４Ｆ、 等の弗化物またＦｉＭｇＯ＋ Ｚｒ０ｚ
ｅ ＳｎＯＳｎ０２ｅ等の酸化物またはＢＮ 、 Ｓｉ
、Ｎ４． ＡＩＮ 、 ＺｒＮ。 ＴａＮ 、 ＴｉＮ等の窒化物またはＳｉＯ、Ｂ、Ｃ、
ＺｒＯ。 ＶＣ，ＮｂＣ、ＴｉＣ、ＴａＣ、Ｍｏ２Ｇ 、 ＴｉＣ
−Ｔｉｎ固溶体等の炭化物またはＺｒＢｔ ＋ ＴｉＢ
ｚ ｔムｊＢ、、 、 ＥｌｉＢ、 。 １３１Ｂ４等のホウ化物または”ｌ５Ｐ２”のリン化物
からなる特許請求の範囲第３項記載の複合セラミック劇
料。 ａ珍 物理化学的方法が放射１１１ｉ！または電磁波照
射である特許請求の範囲第６項記載の複合セラミック材
料。[Claims] (1) A composite ceramic material obtained by surface-treating the base ceramic surface of a ceramic material. The composite ceramic material according to claim 1, wherein the surface treatment is performed by coating with an organic substance. (3) The composite ceramic material according to claim 1, wherein the surface treatment is performed by coating the surface of the base ceramic with a surfactant. (41) The composite ceramic material according to claim 1, wherein the surface treatment is performed by modifying the base ceramic surface in advance in an appropriate arc exposure atmosphere. The composite ceramic material according to claim 1, which is coated with or mixed with. (6) The composite ceramic material according to claim 1, wherein the surface treatment is performed by a predetermined physicochemical method. (7) The composite ceramic material according to claim 1, wherein the ceramic material contains t-1 or more alumina. (8) The composite ceramic material according to claim 1, wherein the ceramic material is used as a flow guide nozzle in an arc generating part of a gas circuit breaker. (9) Composite ceramic material according to claim 2, in which the organic substance is a fluorine-based resin, polyethylene, etc.
, MgF,. Fluorides such as A4F, and FiMgO+ Zr0z
e Oxide such as SnOSn02e or BN, Si
, N4. AIN, ZrN. Nitride such as TaN, TiN or SiO, B, C,
ZrO. VC, NbC, TiC, TaC, Mo2G, TiC
- Carbide such as Tin solid solution or ZrBt + TiB
ztmujB, , EliB, . The composite ceramic material according to claim 3, comprising a boride such as 131B4 or a phosphide of "15P2". A rare physical and chemical method is radiation 111i! or the composite ceramic material according to claim 6, which is irradiated with electromagnetic waves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4402282A JPS58161980A (en) | 1982-03-18 | 1982-03-18 | Composite ceramic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4402282A JPS58161980A (en) | 1982-03-18 | 1982-03-18 | Composite ceramic material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58161980A true JPS58161980A (en) | 1983-09-26 |
| JPS6236995B2 JPS6236995B2 (en) | 1987-08-10 |
Family
ID=12680033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4402282A Granted JPS58161980A (en) | 1982-03-18 | 1982-03-18 | Composite ceramic material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58161980A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511271U (en) * | 1991-07-23 | 1993-02-12 | 日新電機株式会社 | Insulation nozzle for gas circuit breaker |
| JP2006001787A (en) * | 2004-06-17 | 2006-01-05 | Hitachi Chem Co Ltd | Crucible for growing calcium fluoride crystal, method for producing calcium fluoride crystal, and calcium fluoride crystal |
| JP2007103269A (en) * | 2005-10-07 | 2007-04-19 | Fuji Electric Holdings Co Ltd | Circuit breaker |
| CN100439286C (en) * | 2006-08-29 | 2008-12-03 | 中材高新材料股份有限公司 | Method for preparing super high temperature complex phase ceramic ZrB2-ZrC-SiC near to zero ablation |
| JP2010232031A (en) * | 2009-03-27 | 2010-10-14 | Japan Ae Power Systems Corp | Buffer type gas circuit breaker |
| JP2015081202A (en) * | 2013-10-21 | 2015-04-27 | 富士電機株式会社 | Method for forming resin film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49310A (en) * | 1972-04-14 | 1974-01-05 | ||
| JPS525329A (en) * | 1975-06-25 | 1977-01-17 | Schlafhorst Co Maschf | Magazine for bobbin tube |
| JPS5243729A (en) * | 1975-10-03 | 1977-04-06 | Hitachi Ltd | Cooling method and apparatus for casts in continuous casting apparatus |
| JPS56145178A (en) * | 1980-04-04 | 1981-11-11 | Hiyoumen Kakou Kenkyusho Kk | Tile treatment for reducing water absorbability |
| JPS56145179A (en) * | 1980-04-04 | 1981-11-11 | Hiyoumen Kakou Kenkyusho Kk | Tile back side sealing treatment |
-
1982
- 1982-03-18 JP JP4402282A patent/JPS58161980A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49310A (en) * | 1972-04-14 | 1974-01-05 | ||
| JPS525329A (en) * | 1975-06-25 | 1977-01-17 | Schlafhorst Co Maschf | Magazine for bobbin tube |
| JPS5243729A (en) * | 1975-10-03 | 1977-04-06 | Hitachi Ltd | Cooling method and apparatus for casts in continuous casting apparatus |
| JPS56145178A (en) * | 1980-04-04 | 1981-11-11 | Hiyoumen Kakou Kenkyusho Kk | Tile treatment for reducing water absorbability |
| JPS56145179A (en) * | 1980-04-04 | 1981-11-11 | Hiyoumen Kakou Kenkyusho Kk | Tile back side sealing treatment |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511271U (en) * | 1991-07-23 | 1993-02-12 | 日新電機株式会社 | Insulation nozzle for gas circuit breaker |
| JP2006001787A (en) * | 2004-06-17 | 2006-01-05 | Hitachi Chem Co Ltd | Crucible for growing calcium fluoride crystal, method for producing calcium fluoride crystal, and calcium fluoride crystal |
| JP2007103269A (en) * | 2005-10-07 | 2007-04-19 | Fuji Electric Holdings Co Ltd | Circuit breaker |
| CN100439286C (en) * | 2006-08-29 | 2008-12-03 | 中材高新材料股份有限公司 | Method for preparing super high temperature complex phase ceramic ZrB2-ZrC-SiC near to zero ablation |
| JP2010232031A (en) * | 2009-03-27 | 2010-10-14 | Japan Ae Power Systems Corp | Buffer type gas circuit breaker |
| JP2015081202A (en) * | 2013-10-21 | 2015-04-27 | 富士電機株式会社 | Method for forming resin film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236995B2 (en) | 1987-08-10 |
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