JPS58161943A - Glass composition for sealing - Google Patents
Glass composition for sealingInfo
- Publication number
- JPS58161943A JPS58161943A JP4031182A JP4031182A JPS58161943A JP S58161943 A JPS58161943 A JP S58161943A JP 4031182 A JP4031182 A JP 4031182A JP 4031182 A JP4031182 A JP 4031182A JP S58161943 A JPS58161943 A JP S58161943A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- sealing
- composition
- powder
- cordierite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Abstract
Description
【発明の詳細な説明】
本発明は、低温度の熱処理により主として非失透状態で
封着を達成する低触点ガラスの粉末と低膨張性耐火物フ
ィラーの粉末とがらなシ、特に工Ｃ用のアルミナ質パッ
ケージ（アルミナ先板）の封着に好適に用いられる封着
用ガラス組成物に関する。ＩＣのアルミナ質パッケージ
による封止はＩＣ素子保護のため、できるだけ低温で封
着する必要がある。この封着にはｐｂ。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a combination of a low-touch point glass powder and a low-expansion refractory filler powder, which achieve sealing mainly in a non-devitrified state through low-temperature heat treatment, especially for engineering C. The present invention relates to a sealing glass composition suitably used for sealing an alumina package (alumina front plate). When sealing an IC with an alumina package, it is necessary to seal it at as low a temperature as possible in order to protect the IC element. PB for this sealing.
−Ｂ２０ｓ−８ｉＯｚ系あるいは、Ｐｂ０−Ｂｚ ０ｓ
−ＺｎＯ−８１０！系の低融点ハンダガラス（フリット
）が用いられ、封着温度は４３０〜４８０ ’Ｃである
。-B20s-8iOz system or Pb0-Bz 0s
-ZnO-810! A type of low melting point solder glass (frit) is used, and the sealing temperature is 430-480'C.
本発明の主な目的は４３０ ”Ｃ以下（３９０〜４３０
℃）の温度で１ｏ分間以内の熱処理にょシ、充分流動し
、金属リードワイヤ、アルミナに対して気密な封着を完
成すること。さらに金属リードワイヤ、アルミナに整合
する熱膨張係数の封着部を与えること、耐熱性、耐水性
、耐酸性、絶、練性、誘電率等要求される緒特性条件を
充分満足できる封治用カラス組成物を提供することであ
る。The main purpose of the present invention is to
℃) for less than 1 minute to ensure sufficient fluidity and complete airtight sealing to metal lead wires and alumina. Furthermore, it provides a sealing part with a coefficient of thermal expansion matching that of metal lead wires and alumina, and is a sealing material that fully satisfies the required characteristics such as heat resistance, water resistance, acid resistance, resistance, kneadability, and dielectric constant. An object of the present invention is to provide a crow composition.
本発明者は、ＰｂＯ−Ｂ２０３−Ｚｎ○−８１０２系に
Ｖ２Ｏ５，ＯｕＯを添加することにより、３９０〜４３
０℃の封看温贋を達成した。さらに低膨張性耐火物フィ
ラーとして、重量％表示で、少くとも２チのコージェラ
イト粉末を混入することにより、前記目的を達成するこ
とを見出した。The present inventor has found that by adding V2O5, OuO to the PbO-B203-Zn○-8102 system, 390-43
Achieved temperature control at 0°C. Furthermore, it has been found that the above object can be achieved by incorporating at least 2 inches of cordierite powder in weight percent as a low-expansion refractory filler.
本発明は、重（ｆｒチ衣示で本質的に、ＰｂＯ７７，０
〜８６．０チ
ＢｚＯｓ ６．０〜１５．０％、ＺｎＯ０，
５〜６．５ ％
Ｓｉｎ！０．３〜３０チ
ＶｘＯｓ ０．１〜３０％
ＣｕＯ０，１〜４．０チ
Ａ１２ｏｓ Ｏ〜３０％
ＰｚＯｓ Ｏ〜３．５ ％
５ｎＯｚ Ｏ〜１．５％
ＲＯ０〜２０％
（ＲＯはＢａｄ、 ＳｒＯ，Ｏａｋ、 ＭｇＯのうち、
いずれか１者又は２者以上）
Ｒ意０ ０〜１．０％
（Ｒ２０はＬｉｚＯ，ＮａｚＯ，ＫｚＯ，ＲｂｚＯ，Ｃ
５ｘＯ（７）うち、いずれか１者又は２者以上）
の組成を有する低融点ガラスを提供する。更にこの低融
点ガラスの粉末と、重量％表示で下記含有割合の低膨張
性耐火物フィラーの粉末；コージェライト
２．０〜３５ チβ−ユークリプタイト ０〜３
５ チβ−スボジューメ７ ０〜３５ｑ６ジルコン
０〜６ｏ チチタン酸鉛
０〜６ｏ チとからなる封着用ガラス組成物が提
供される。The present invention essentially consists of PbO77,0
~86.0chiBzOs 6.0~15.0%, ZnO0,
5-6.5% Sin! 0.3~30chi VxOs 0.1~30% CuO0.1~4.0chi A12os O~30% PzOs O~3.5% 5nOz O~1.5% RO0~20% (RO is Bad, SrO ,Oak,MgO,
Any one person or two or more persons) R 0 0 to 1.0% (R20 is LizO, NazO, KzO, RbzO, C
Provided is a low melting point glass having a composition of one or more of 5xO(7). Furthermore, this low-melting point glass powder and a low-expansion refractory filler powder having the following content in weight percent: cordierite
2.0~35 β-eucryptite 0~3
5 Chi β-subodume 7 0-35q6 zircon 0-6o Lead titanate
A sealing glass composition comprising 0 to 6o is provided.
前記低融点ガラスの組成限定の理由を説明する。The reason for limiting the composition of the low melting point glass will be explained.
ＰｂＯ＜ ７７ ％ ｐガラスの軟化点が高くなシ低温
での封着に適さない。ＰｂＯ＞ ８６ ｆｂ ｔガラス
の熱膨張係数が大きくなる。PbO<77% P glass has a high softening point and is not suitable for sealing at low temperatures. PbO>86 fb The thermal expansion coefficient of the glass increases.
ＢｚＯｓ＜６チ；ガラス熔融解作業中に失速が生成する
。ＢｚＯｓ＞１５チ；ガラスの軟化点が高くなシ低温で
の到着に適さない。BzOs<6; Stall occurs during glass melting operation. BzOs>15: Glass has a high softening point and is not suitable for arrival at low temperatures.
ＺｎＯ＜０．５％；ガラスの軟化点が高くなシすぎる。ZnO<0.5%; The softening point of the glass is too high.
ＺｎＯ＞６．５％；ガラスの結晶化が速くなシすぎ、ま
た、ガラス熔解作業中に失透が生成し易くなる。ZnO>6.5%: Glass crystallizes too quickly, and devitrification tends to occur during glass melting.
Ｓ ｉ Ｏｚ ＜ Ｑ２％ ｙガラスの結晶化傾向が強
くなる。５ｉＯｚ＞３．０％；ガラスの軟化点が高くな
り低温での封着に適さない。S i Oz < Q2% y The crystallization tendency of the glass becomes stronger. 5iOz>3.0%; The softening point of the glass becomes high, making it unsuitable for sealing at low temperatures.
ＶｚＯｓ＜０．１チ；ガラスの流動性を向上させる効果
がない。ＶｘＯｓ＞３．０チ；電気絶縁性、耐水性が悪
くなる。VzOs<0.1: There is no effect of improving the fluidity of glass. VxOs>3.0ch; electrical insulation and water resistance deteriorate.
・ＯｕＯ＜０．１ ’１２ ｙガラスの流動性を向上さ
せる効果がない。ＯｕＯ＞４．０％；ガラスの結晶化傾
向が強くなる。- OuO<0.1 '12 y There is no effect of improving the fluidity of the glass. OuO>4.0%; the tendency of glass to crystallize becomes stronger.
以上の必須成分の外に、３チまでのＡｌｔｏｎ 。In addition to the above essential ingredients, up to 3 pieces of Alton.
３．５チまでのＰ２Ｏ３，１，５％までのＳｎｏｗ及び
／又はＢａｄ、 ＢｒＯ，Ｃａｂ、 ＭｇＯのうちから
選ばれる少くとも１種のアルカリ土類金＾鍍化物を２．
０％まで、８１ｏｚと組み合せて含有させ、ガラスの結
晶化傾向を調整す不ことができる。2. Up to 3.5% of P2O3, up to 1.5% of Snow and/or at least one alkaline earth gold plating selected from Bad, BrO, Cab, MgO.
It can be included up to 0% in combination with 81oz to adjust the crystallization tendency of the glass.
また、Ｌｉｔｕ、Ｎａｇσ、 Ｋ２Ｏ，ＲｂｚＯ又はｃ
８２０から選ばれるアルカリ金Ｒ酸化物は、１％以下含
有することによシ、ガラスの軟化点を低下させ、封着の
際の熱処理条件ケコントロールすることができる。Also, Litu, Nagσ, K2O, RbzO or c
By containing the alkali gold R oxide selected from 820 in an amount of 1% or less, it is possible to lower the softening point of the glass and control the heat treatment conditions during sealing.
必須成分に関し、よシ好ましい含有量の範囲は重量％表
示で次の通りである。Regarding the essential components, the most preferable content ranges expressed in weight percent are as follows.
ＰｂＯ８０，０〜８５．Ｏ５
Ｂｔｕｓ ７、Ｏ〜１３．０％ＺｎＯ２，
０〜６．０％
８１０宏０．５〜２．５ｆｂ
ＶｘＯｓ Ｏ，３〜 ２．０チｃｕｏ
ｏ、３〜４．ｏ％以上の組成を有するガ
ラスは、３９０〜４３０”Ｃの低温度、１０分以内の熱
処理で充分流動し、そのまま非結晶化状態て、あるいは
添加成分によっては、その後結晶化した後、気密なシー
ルを達成するけれども、熱膨張係数が比較的高く、アル
ｉすの如き６５〜７０Ｘ１０ ℃ （２５〜４００ｔ
）の材料あるいは、ソーダ、石灰、ガラスの如き約９０
Ｘ１０ Ｘ”Ｃ（５０〜３５０℃）の材料に整合的に
即ちマツチングして封着することができない。PbO80.0-85. O5 Btus 7, O ~ 13.0% ZnO2,
0~6.0% 810 Hiroshi 0.5~2.5fb VxOs O, 3~2.0chicuo
o, 3-4. Glass having a composition of 0% or more can be sufficiently fluidized by heat treatment at a low temperature of 390 to 430"C for less than 10 minutes, and can remain in an amorphous state as it is, or depending on the added components, can be crystallized and then become airtight. Although sealing is achieved, the coefficient of thermal expansion is relatively high, such as aluminum 65~70X10℃ (25~400t
) or about 90 materials such as soda, lime, and glass
It is not possible to match and seal to X10 X''C (50-350°C) materials.
本発明の封着用ガラス組成物においては、前記の低融点
ガラス粉末に対して、低膨張の無機耐火物の添加剤いわ
ゆる「フィラー」として、１伊チで２〜３５％のコージ
ェライトの粉末ケ混合する。２チよシ少ないと、添加の
効果がなく、３５％を越えると組成物の流動性が減少す
るので好ましくない。より好ましい添加割合は、重量％
で、３〜３０チである。In the sealing glass composition of the present invention, a low-expansion inorganic refractory additive, so-called "filler", is added to the above-mentioned low-melting point glass powder in an amount of 2 to 35% cordierite powder per batch. Mix. If the amount is less than 2%, the addition has no effect, and if it exceeds 35%, the fluidity of the composition decreases, which is not preferable. A more preferable addition ratio is weight%
So, it is 3 to 30 inches.
コージェライト（菫青石、２Ｍｇ０１２ＡｌｚＯｓ。Cordierite (cordierite, 2Mg012AlzOs.
５８１０ｇ）は、天然鉱物としても存在し入手できるが
、通常は化学量論的にＭｇＯ，Ａｌｚｏｓ、 ＥｉｉＯ
！を調合し、１３００℃以上の温度で固相反応により合
成するか、又は１５００℃以上で熔融彼結晶化させたも
のを用いる。コージェライトは１０〜２０Ｘ１０ ℃
（５０〜３５０℃の熱膨張係数）を有すると共に、Ｉ
Ｃ用アルミナパッケージのシールに用いるときに要求さ
れる電気的特性に関し、他の公知のフィラーの中では最
も適しているので、この目的のためには、コージェライ
ト単独の添加が望ましい。しかし、コージェライトと共
に他のフィラー即ち３５チまでのβ−ユークリプタイト
、３５％までのβ−スポジウメン、６０９ｂまでのジル
コン又は６０チまでのチタン酸鉛を組成物に混合しても
よい。5810g) are also present and available as natural minerals, but are usually stoichiometrically composed of MgO, Alzos, EiiO
! The compound is synthesized by solid phase reaction at a temperature of 1,300°C or higher, or it is melted and crystallized at a temperature of 1,500°C or higher. Cordierite is 10~20X10℃
(coefficient of thermal expansion from 50 to 350°C) and I
For this purpose, the addition of cordierite alone is preferred since it is the most suitable among other known fillers with respect to the electrical properties required when used to seal C alumina packages. However, other fillers may be mixed into the composition along with the cordierite, namely up to 35% β-eucryptite, up to 35% β-spodiumene, up to 609b zircon or up to 60% lead titanate.
！−ニークロブタイト（Ｌ１２０． ＡｌｚＯｍ、 ２
ＳｉＯ２）、β−スボジウメン（ＬｉｚＯ，Ａｌｔｏｎ
、 ４Ｂ１０ｘ ）は、化学１！：ａｆｉｔ組成の原料
配合物を１５００℃程度で熔融ガラス化し、冷却、粉砕
した後９００℃で再加熱して製造する。! - Nieklobutite (L120. AlzOm, 2
SiO2), β-subodiumene (LizO, Alton
, 4B10x ) is Chemistry 1! :Produced by melting and vitrifying a raw material mixture having an afit composition at about 1500°C, cooling and pulverizing it, and then reheating it at 900°C.
ジルコン（Ｚｒ０ｚ、 ５ｉＯｚ）は通常天然品が使用
されるが、Ｚｒ０ｚ粉末と８１０２粉末とを固相反応に
よって合成したものを用いることができる。Zircon (Zr0z, 5iOz) is usually a natural product, but one synthesized by solid phase reaction of Zr0z powder and 8102 powder can be used.
チタン酸鉛（ＰｂＯ，Ｔｉｅ雪）は、ＥｌｂＯ粉末とＴ
ｉｅｓ粉末の等モル混合物をｌ０００〜１３００℃の高
温で焼成し固相反応により合成し、得られた焼結体を粉
砕して製造される。Lead titanate (PbO, Tie snow) is a combination of ElbO powder and T
It is manufactured by firing an equimolar mixture of ies powder at a high temperature of 1000 to 1300°C, synthesizing it by solid phase reaction, and pulverizing the obtained sintered body.
これらのフィラーの熱膨張係数は次の通シである。The coefficient of thermal expansion of these fillers is as follows.
β−ユークリプタイト −６０〜−８０刈０ ℃ （
５０〜３５０℃）コージェライト ８〜１５
Ｉ （Ｉ ）ジルコン ４２〜４８
Ｉ （Ｐ ）チタン酸鉛 −４０〜−５
３ｚ （ｚ ）次に本発明の封着用ガラス組成
物の製造方法の一例を説明する。β-eucryptite -60~-80 0℃ (
50-350℃) Cordierite 8-15
I (I) Zircon 42-48
I (P) Lead titanate -40 to -5
3z (z) Next, an example of a method for manufacturing the sealing glass composition of the present invention will be explained.
各成１分原料、例えば鉛丹、無水硼酸、酸化亜鉛、珪砂
、五酸化バナジウム、酸化第２銅を目標組成に従って配
合し混合してパッチを調整し、バッチを白金るつぼに入
れ電気炉中で１０００〜１２５０℃で１〜２時間加熱熔
解する。熔融ガラスを水砕し、又は板状に成形した後、
ボールミルで粒径１〜８μ程度まで粉砕する。Raw materials for each component, such as red lead, boric anhydride, zinc oxide, silica sand, vanadium pentoxide, and cupric oxide, are blended and mixed according to the target composition to prepare a patch, and the batch is placed in a platinum crucible in an electric furnace. Heat and melt at 1000-1250°C for 1-2 hours. After pulverizing the molten glass or forming it into a plate shape,
Grind with a ball mill to a particle size of approximately 1 to 8 μm.
フィラーの混合は、ガラスの粉砕時ボールミル中に所定
量のフィラーを混入し、粉砕混合を同時に行なってもよ
く、前もって１〜８μ程度に粉砕したフィラーをガラス
粉末に加えてミキサーで混合してもよい。The filler may be mixed by mixing a predetermined amount of filler into a ball mill during glass pulverization and pulverizing and mixing at the same time, or by adding filler previously pulverized to about 1 to 8 μm to glass powder and mixing with a mixer. good.
本発明の封着用ガラス組成は、主として非結晶化状態て
、アル建ナパッケージの封着に用いられるが、ガラス中
の添加成分の調整によシ結晶化状態て使用することもで
き、ソーダ石灰ガラス、例えばフｏ−）カラス板あるい
は金属材料の封着にも使用できる。The sealing glass composition of the present invention is mainly used in an amorphous state for sealing aluminum packages, but it can also be used in a crystallized state by adjusting the additive components in the glass. It can also be used for sealing glass, such as glass plates, or metal materials.
実施例 表の上段に示す試料Ａ１−嘗の組成のカラス。Example A crow with the composition of sample A1-1 shown in the upper row of the table.
を前述の方法で製造し、その粉砕時に表に示す種類のフ
ィン−を表に示す量たり加えて−１１に粉砕混合し、封
着用の粉末試料を調整し、下記特性値を測定しえ、冑、
各試料において、ガラスの含有量は、フイ２−の残量に
なる。was produced by the above-mentioned method, and when it was crushed, fins of the types shown in the table were added in the amounts shown in the table, and mixed to -11, a powder sample for sealing was prepared, and the following characteristic values were measured, helmet,
In each sample, the glass content is the remaining amount of filament 2-.
各粉末試料６．１Ｆを水差熱分析＊０ホルダーに入れ、
室温よシ１Ｇ℃／ｙｍ Ｑ昇温速度で温度を上昇させ熱
分析曲線を描き、その−＃に現われる最初の吸熱開始温
度を、転移点（’Ｃ）として表に示しえ。Place each powder sample 6.1F into a differential thermal analysis*0 holder,
Raise the temperature at a rate of 1 G°C/ym Q from room temperature, draw a thermal analysis curve, and show the first endothermic onset temperature that appears at -# in the table as the transition point ('C).
各粉末試料を棒状に圧縮成形し九費、表に示す各熱処理
条件（３９０〜４３０℃、１０分間）で、加熱して得た
棒状試料の各々について５０℃〜カラス転移点間の熱膨
張係数を測定した。Thermal expansion coefficient between 50°C and glass transition point for each of the rod-shaped samples obtained by compression molding each powder sample into a rod shape and heating under each heat treatment condition shown in the table (390 to 430°C, 10 minutes) was measured.
工Ｃ封止用アルミナの場合、その熱膨張係数は６５〜７
０Ｘ１０ ℃ （２５〜４００℃）の範囲内にある。In the case of alumina for engineering C sealing, its coefficient of thermal expansion is 65 to 7.
Within the range of 0x10°C (25-400°C).
封着用カラス組成物の熱処理後の熱膨張係数は、アルミ
ナのそれに対して＋２ Ｘ １０−’乃至一１ＯＸＩＯ
の範囲内にあると、アルミナとの整合性の要請を満足す
る。従って、試料Ａ８を除いて、各試料はアルミナとの
整合性を＊＊す。一方、試料層８は、ソーダライムガラ
ス（α中９０Ｘ１０ ℃ ）に対して適用されうる。The thermal expansion coefficient of the sealing glass composition after heat treatment is +2 x 10-' to 11 OXIO compared to that of alumina.
If it is within the range of , it satisfies the requirement of compatibility with alumina. Therefore, with the exception of sample A8, each sample exhibits consistency with alumina. On the other hand, sample layer 8 can be applied to soda lime glass (90×10° C. in α).
流動性（）田−ボタン径）
封着用ガラス組成物としては、熱処理時、充分に軟化流
動し被封着面に充分濡れ、封着部の気密性を確保するこ
とを要す、この流動性の測定のため、各粉末試料を、そ
の比重に相当するｔ数を採散し、１２．５−一の円柱状
に加圧成形し友後、表に示した熱処理条件で加熱し、そ
のフローボタン。径を測定し喪。Fluidity (button diameter) The glass composition for sealing must have this fluidity to sufficiently soften and flow during heat treatment, sufficiently wet the surface to be sealed, and ensure airtightness of the sealed part. For the measurement, each powder sample was collected in a number corresponding to its specific gravity, pressure-molded into a 12.5-1 cylinder shape, and then heated under the heat treatment conditions shown in the table. button. Measure the diameter and mourn.
伺、アルきプとの封着に当っては、組成物のフローボタ
ン毬は１８ｍ＋以上であるのが好ましい。When sealing the composition with an aluminum plate, it is preferable that the flow button ball of the composition is 18 m+ or more.
体積抵抗率 １） （ｏｈｍ−α）
各試料の熱処理品Ｑ）１５０℃における体積抵抗率：ρ
（ｏｈｍ −ｔｘ ）を１１ｊ足し、表にその常用対数
値（１０ｇρ）を示した。Volume resistivity 1) (ohm-α) Heat treated product of each sample Q) Volume resistivity at 150°C: ρ
(ohm - tx) was added by 11j, and its common logarithm value (10gρ) was shown in the table.
アルミナパッケージへの封着のためには、この（［Ｆｉ
ｌＯｏｈｍ−ｍ以上であるのが望ましい。For sealing to an alumina package, this ([Fi
It is desirable that it is 10ohm-m or more.
誘電率
各試料の熱処理品の２０℃、１囲２におけるＴｈｗ、龜
（ｇ）を測定した。この値は、２０以下であることが望
ましい。The dielectric constant Thw and weight (g) of each heat-treated sample at 20° C. and 1 girth were measured. This value is desirably 20 or less.
熱処理品の状態
各試料を熱処理したとき、熱処理品がガラス状態を保っ
ているものを「非晶質」とし、結晶化したものを「結晶
化」として、表に示した。Conditions of heat-treated products When each sample was heat-treated, those in which the heat-treated product remained in a glass state were classified as "amorphous," and those that became crystallized were classified as "crystallized," as shown in the table.
表 （試料の組成、熱処理条件、物性）＝２２１Table (sample composition, heat treatment conditions, physical properties) = 221
Claims (1)
点ガラス。 ｐｂ○ ７７．０〜８６０％ Ｂ ２０ ｓ ６．０〜１５０％ＺｎＯ０，
５〜６，５ チ ５ｉＯ２０，２〜３０％ Ｖ２Ｏ５０，１〜３．０ ％ Ｃ！ｕｏ ０．１〜４．０ ％Ａ １ ｚ
０３ ０〜３０％ＰｚＯｓ ０〜
３５％ ＢｎＯｚ Ｏ〜１．５％ ＲＯＯ〜２．０チ （ＲＯはＢａｄ、 ＳｒＯ，Ｃａｂ、 ＭｇＯのうち、
いずれか１者又は２者以上） Ｒ２００〜１．０ ％ （Ｒ２０はＬｉｚＯ，ＮａｚＯ，ＫｚＯ，Ｒｂ２Ｏ，Ｃ
ｅｘＯのうち、いずれか１者又ｉ−ｊ ２者以上）（２
） 重量％表示で、本質的に、 ＰｂＯ７７，０〜８６０％ ＢｍＯｓ ６．０〜１５．０％ＺｎＯ０，５
〜６．５％ ５ｉｆｔ ０．２〜３．０％ＶｚＯｓ
０．１〜３．０ ％（ｕ、ｏ Ｏ，
１〜４．０ ％Ａｌｔｏｓ Ｏ〜３．〇− Ｐｒｏｓ Ｏ〜３．５ Ｔ。 Ｓｎｏｗ Ｏ〜１．５ Ｔ。 ＲＯＯ〜２．０チ （ＲＯはＢａｄ、 ＳｒＯ，Ｃａｂ、 ＭｇＯのうち、
いずれか１者又は２者以上） ＲｚＯＯ〜１．０％ （ＲｚＯはＬｉ２Ｏ，ＮａｚＯ，ＫｚＯ，Ｒｂ＊Ｏ，０
ｓｚＯのうち、いずれか−１者又は２者以上） の組成を有する低融点ガラス粉末と重量％表示で下記含
有割合の低膨張性耐火物フィラーの粉末； コージェライト ２０〜３５ ％β−ユ
ークリプタイト ０〜３５ ％β−スポジュー
メン ０〜３５ ％ジルコン
０〜６０ ％チタン酸鉛 ０〜６
０ ％とからなる封着用ガラス組成物。 （３） 前記低融点カラスにオイテ、ＰｂＯ，ＢｚＯ
ｘ。 ＺｎＯ，５ＩＣ１＋、 Ｖ２Ｏ５及びｃｕｏは、ｐｂｏ
ｓ ｏ、ｏ 〜ｓ ｓ、ｏ
％Ｂ２Ｏ３７，０〜１３．０ ％ ＺｎＯ２，０〜 ６．０ ％ ５ｉ０２ ０．５〜２．５ ％Ｖ
ｘ Ｏｓ Ｏ，３〜 ２．０
％ＣｎＯＯ，３〜４．０ ％ の範囲内にあり、前者低膨張性耐火物フィラーとしては
コージェライトが単独に用いられ、かつ１量チ表示で、 低融点カラス粉末 ７０〜９７ ％コージェ
ライト粉末 ３〜３０ ％の組成を有する特
許請求の範囲第２項記載の封着用ガラス組成物。[Claims] (1) A low melting point glass having essentially the following composition expressed in weight percent: pb○ 77.0~860% B20s 6.0~150%ZnO0,
5~6,5 CH5iO20,2~30% V2O50,1~3.0% C! uo 0.1~4.0%A1z
03 0~30%PzOs 0~
35% BnOz O~1.5% ROO~2.0chi (RO is Bad, SrO, Cab, MgO,
R200~1.0% (R20 is LizO, NazO, KzO, Rb2O, C
Any one of exO or ii or more) (2
) In weight%, essentially: PbO77.0-860% BmOs 6.0-15.0% ZnO0.5
~6.5% 5ift 0.2~3.0%VzOs
0.1-3.0% (u, o O,
1-4.0% Altos O-3. 〇-Pros O~3.5T. Snow O~1.5T. ROO ~ 2.0chi (RO is Bad, SrO, Cab, MgO,
(any one person or two or more people) RzOO~1.0% (RzO is Li2O, NazO, KzO, Rb*O, 0
A low melting point glass powder having a composition of (one or more of szO) and a powder of a low expansion refractory filler having the following content in weight percentage; Cordierite 20-35% β-Eucryp Tight 0~35% β-spodumene 0~35% zircon
0~60% Lead titanate 0~6
A sealing glass composition consisting of 0%. (3) Oite, PbO, BzO in the low melting point glass
x. ZnO, 5IC1+, V2O5 and cuo are pbo
s o, o ~s s, o
%B2O37.0~13.0% ZnO2.0~6.0% 5i02 0.5~2.5%V
xOsO, 3~2.0
%CnOO, in the range of 3 to 4.0%, cordierite is used alone as the former low expansion refractory filler, and in terms of quantity, low melting point glass powder 70 to 97% cordierite powder The sealing glass composition according to claim 2, having a composition of 3 to 30%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031182A JPS58161943A (en) | 1982-03-16 | 1982-03-16 | Glass composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4031182A JPS58161943A (en) | 1982-03-16 | 1982-03-16 | Glass composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58161943A true JPS58161943A (en) | 1983-09-26 |
| JPH0144656B2 JPH0144656B2 (en) | 1989-09-28 |
Family
ID=12577066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4031182A Granted JPS58161943A (en) | 1982-03-16 | 1982-03-16 | Glass composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58161943A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395137A (en) * | 1986-10-06 | 1988-04-26 | Nippon Electric Glass Co Ltd | Sealing glass having low-melting point |
| JP2010143682A (en) * | 2008-12-17 | 2010-07-01 | Mitsubishi Heavy Ind Ltd | Cable reel controller, method for controlling cable reel, and tire type crane |
| WO2011013776A1 (en) * | 2009-07-31 | 2011-02-03 | 旭硝子株式会社 | Sealing glass, sealing material and sealing material paste for semiconductor devices, and semiconductor device and process for production thereof |
-
1982
- 1982-03-16 JP JP4031182A patent/JPS58161943A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395137A (en) * | 1986-10-06 | 1988-04-26 | Nippon Electric Glass Co Ltd | Sealing glass having low-melting point |
| JP2010143682A (en) * | 2008-12-17 | 2010-07-01 | Mitsubishi Heavy Ind Ltd | Cable reel controller, method for controlling cable reel, and tire type crane |
| WO2011013776A1 (en) * | 2009-07-31 | 2011-02-03 | 旭硝子株式会社 | Sealing glass, sealing material and sealing material paste for semiconductor devices, and semiconductor device and process for production thereof |
| US8704361B2 (en) | 2009-07-31 | 2014-04-22 | Asahi Glass Company, Limited | Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144656B2 (en) | 1989-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4405722A (en) | Sealing glass compositions | |
| JPH04231349A (en) | Sealing material, glass used therefor and mill additve | |
| JPH11292564A (en) | Tin borophosphate glass and sealing material | |
| JPH0585490B2 (en) | ||
| JP3339647B2 (en) | Lead-free low melting glass and sealing glass composition | |
| JPS62191442A (en) | Low-melting sealing composition | |
| CN101007706B (en) | Lead-free phosphate sealed glass for electrothermal tube and its preparation method | |
| JPH04288389A (en) | Sealing material and mil additive for use therefor | |
| US5116786A (en) | Low temperature sealing glass composition | |
| JPH02116643A (en) | Alkali zinc aluminophosphate glass ceramic | |
| JP3096136B2 (en) | Glass composition for low-temperature fired substrate and substrate obtained therefrom | |
| JPS58161943A (en) | Glass composition for sealing | |
| JPS6143298B2 (en) | ||
| JPS6143299B2 (en) | ||
| JP3172592B2 (en) | Adhesive or sealing glass | |
| JP3519121B2 (en) | Sealing composition | |
| JPS59164649A (en) | Glass composition for sealing | |
| JPS6132272B2 (en) | ||
| JP3402314B2 (en) | Method for producing low melting point sealing composition and method for using the same | |
| JPH0419176B2 (en) | ||
| JPS62235228A (en) | Premelt oxide conposition for reducing platinum corrosion for lead-containing solder glass | |
| JPH04275944A (en) | Sealing material | |
| JP3151794B2 (en) | Low melting point sealing composition | |
| JPS59131542A (en) | Sealing composition | |
| US3449203A (en) | High expansion sealing glass and composite article |