JPS58154247A - Apparatus for positioning wafer - Google Patents

Apparatus for positioning wafer

Info

Publication number
JPS58154247A
JPS58154247A JP3764282A JP3764282A JPS58154247A JP S58154247 A JPS58154247 A JP S58154247A JP 3764282 A JP3764282 A JP 3764282A JP 3764282 A JP3764282 A JP 3764282A JP S58154247 A JPS58154247 A JP S58154247A
Authority
JP
Japan
Prior art keywords
positioning
wafer
woofer
deltax
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3764282A
Other languages
Japanese (ja)
Inventor
Masao Kosugi
小杉 雅夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP3764282A priority Critical patent/JPS58154247A/en
Publication of JPS58154247A publication Critical patent/JPS58154247A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To realize simultaneous use of two positioning apparatuses having different prealignment reference by calculating and compensating deviation of a distance between the specified position and external circumference of wafer from the reference position after a wafer is preliminarily positioned for the external circumference. CONSTITUTION:When a wafer 11 of the desired size is inserted into the fixed prealignment references 12, 13, 14, while measuring probes 16, 17 are pressing the wafer 11 to the fixed standards 12, 13, 14 respectively, measuring instruments 18, 19 read displacements DELTAx, DELTAy from the reference values based on the reference wafer 10. Outputs of the measuring instruments 18, 19 are sent to an operation unit 20 and the center position of the wafer 11 is calculated therein. When the wafer center is considered as 15' and displacements of center are considered as deltax, deltay, following relation can be obtained: deltax=DELTAx/2, deltay=DELTAy-DELTAx/2. Compensation as much as these values is given.

Description

【発明の詳細な説明】 本発明はつ、八等の位置決め装置に関する。[Detailed description of the invention] The present invention relates to one or eight positioning devices.

一般にIC,LSI等の製造に関する装置であるマスク
アライナ−、ボンダー、プローバー等においては、各地
理工程における半導体ウーハのパターンに関する位置決
めを必要とする。この位置決めに関しては一般に本位置
決めの面に、一段精度をおとし九予備位置決め(クリア
ライメント)がなされる。
Mask aligners, bonders, probers, and the like, which are generally devices for manufacturing ICs, LSIs, etc., require positioning of semiconductor wafer patterns in each geographical process. Regarding this positioning, generally a preliminary positioning (clear alignment) is performed on the surface of the main positioning, reducing the accuracy by one level.

すなわちつ、ハ外形での予備位置決め後、光学的な手段
例えtf纏黴跳を用いて目標とする精度までパターンの
位置を修正(本位置決め)しイナ 先後、所定のダ事(例えはアライナ−であれは露光)K
入るのが通例である。
In other words, after preliminary positioning using the outer shape, the position of the pattern is corrected (main positioning) to the target accuracy using an optical means, such as a tf-type jumper. That's exposure)K
It is customary to enter.

しかし、この予備位置決めの手段は種々存在し、ウーハ
の各I&環行程で必ずしも同じ予備位置決めの手段が用
いられるとは限らず、ま九各ウーハの搬入順序が各処理
行程で一定ではなく、一般に第1図、第2図に示される
ように、異なる処理行程で各つ、ハパターンが前行程で
のつ観察視野は小さくなる傾向を持ち、例えばある種の
アライナ−においては−0,2Mであり、予備位置決め
によって所定のパターンがこのIIIFK人らなければ
所定のパターンを捜す丸めの模索動作を余儀なくされ、
このために浪費する時間は生産機械であるこの種の装置
にとって問題となる。
However, there are various means for this preliminary positioning, and the same means for preliminary positioning is not necessarily used in each I & ring process of the woofer, and the order in which each woofer is introduced is not constant in each process process, and generally As shown in Figs. 1 and 2, in different processing steps, the observation field of view of the pattern in the previous step tends to become smaller; for example, in some aligners, -0.2M If the predetermined pattern is not found by preliminary positioning, a rounding groping operation is forced to search for the predetermined pattern,
The time wasted in this way is a problem for this type of equipment, which is a production machine.

すなわち、第1IIK示されるように各サイズのウー−
1に対し、ウー八メ中心2基皐で可動の位置決め部材3
乃至6により位置決めし、然る後、次の行程で第2図に
示されるように各サイズのつ、ハに対し、ウー八円周s
O1点と、オリエンテーションフラット(ウェハの直線
部)基準で固定の位置決め部材7,8.9により位置決
めすると、尚初つ、ハ上のパターン位置がつ墨ハの中心
基準で合っていたものが、つ、ハ中心がずれることによ
りパターン位置が本来の位置からずれて位置決めされる
こととなる。これは、第1図と第2図の予備位置決めの
順序を変えても同様である。
That is, as shown in 1st IIK, each size of woo-
In contrast to 1, there is a movable positioning member 3 with two bases in the center.
After that, in the next step, as shown in Fig. 2, for each size, the circumference s is determined.
When positioning is performed using the fixed positioning members 7 and 8.9 using the O1 point and the orientation flat (straight line part of the wafer) as a reference, the pattern position on C is aligned with the center reference of the wafer. (c) As the center shifts, the pattern position is shifted from its original position. This is the same even if the order of preliminary positioning in FIGS. 1 and 2 is changed.

ウーハl外径とパターンが関係づけられるのは、フォト
のtH1行程でありその時使用されるアライナ−のプリ
アライメント誤差の偏差を町とし、NO行程で使用され
る装置の誤差偏差値をσ屓とし1行程とN行程の装置の
プリアライメント基準が同一であれば、N行程の顕微鏡
下で見られる総合精度σ管は σ? −M +Jlη2
4 g、l  で表わされる。
The relationship between the woofer l outer diameter and the pattern is in the tH1 process of the photo, and the deviation of the pre-alignment error of the aligner used at that time is defined as the deviation, and the error deviation value of the device used in the NO process is defined as σ. If the pre-alignment standards of the 1-stroke and N-stroke devices are the same, the overall accuracy σ tube seen under the N-stroke microscope is σ? −M +Jlη2
4 g, l.

MはlとNの分布中心値の差である。グリアライメント
のCを小さくする努力は過去幾多の特許で提案されてお
り、1九Mを小さくする勢力は半導体の製造工程を管理
する人の手で行ゎれる。
M is the difference between the distribution center values of l and N. Efforts to reduce C in glial alignment have been proposed in many patents in the past, and the forces that reduce 19M are carried out by those who manage the semiconductor manufacturing process.

しかし1行程の装置とN行程の装置のプリアライメント
基準が異る場合には事情は異シプリアフイメント精度は
、ウーハ1寸法により大きく左右される。
However, the situation is different when the prealignment standards of the 1-stroke device and the N-stroke device are different.The prealignment accuracy is largely influenced by the 1-woofer size.

ある規格によれば−41のつ、ハ〆について外径D=1
00±11オリツブ0F=315±2.5である。この
様なつ、ハヂを、例えばフォトの1行程を811図に示
すダリア2イメ/ト基準、N行程をaI2図に示すプリ
アライメント基準で処理したとすれば、仮に6=σM=
M””Oとしても約φ1asを越える誤差会生ずること
になる。本発明の目的は異なるプリアライメント基準を
もつ2台の装置の混用の場合にも十分1′11度を保証
できるつ、八等の位置決め装置を提供することにある。
According to a certain standard, the outer diameter D = 1 for -41 and C.
00±11 olive 0F=315±2.5. For example, if one process of photo is processed using the Dahlia 2 image standard shown in Figure 811 and the N process is processed using the pre-alignment standard shown in Figure aI2, then 6=σM=
Even if M""O is used, an error exceeding about φ1as will occur. SUMMARY OF THE INVENTION An object of the present invention is to provide a positioning device of the order of 8, which can guarantee a sufficient angle of 1'11 degrees even when two devices having different prealignment standards are used together.

この目的はつ、へ都をその外周部に対して予備位置決め
する手段と、所定位置からつ。
The purpose of this is to provide means for pre-positioning the hemlock relative to its outer periphery and from being in position.

八等の外周部までの間隔を基準値と比較測定する手段と
、該手段の測定値よりつ、八等の基準位置からのずれを
算出する手段を有する構成により達成される。本位置決
めの丸め顕微鏡下にウーハを送り込む際には上記ずれJ
t(オノセット量)を見込んでこれを補償するように送
り込めば良い。以下、本発明の実施例を第3図をもとに
説明する〇 この場合、aI1図のプリアライメント基準で第1行程
のパターン位置グされたウーハをIIIN行程で第2図
のプリアライメント基準をもつ装置でI&塩することを
想定しである。
This is achieved by a configuration having means for comparing and measuring the distance to the outer circumference of the eighth grade with a reference value, and means for calculating the deviation from the reference position of the eighth grade from the measured value of the means. When feeding the woofer under the rounding microscope for this positioning, the above deviation J
It is sufficient to anticipate t (ono set amount) and send it to compensate for this. Hereinafter, an embodiment of the present invention will be explained based on FIG. It is assumed that I&Salt will be used with a device that has.

10は外径り、オリエンテーションフラット(オリフラ
)と円弧間距離Fの基準ウェハでこのウーハに於いて第
1行程、#IN行機でのパターンは合致する。15はX
Y座座中中心あり基準つ異ハ1Gの中心と合致している
。12.13゜14は固定のプリアライメント基準であ
る。任意のサイズのウーハ11が挿入された時、測定プ
ローブ16.17はウェハ11を同定基準12.13,
14の方にそれぞれ押しつけなから樹定器18,19が
基準つ□ハlOを基にした基準位からの偏位量ΔX、Δ
yを各々軌み散る。
Reference numeral 10 denotes a reference wafer with an outer diameter, an orientation flat (orientation flat), and a distance between circular arcs F. In this woofer, the pattern in the first process and #IN line machine matches. 15 is X
The center of the Y locus and the reference point coincide with the center of 1G. 12.13°14 is a fixed pre-alignment reference. When a woofer 11 of any size is inserted, the measurement probe 16.17 identifies the wafer 11 with the identification criteria 12.13,
14, the delimiters 18 and 19 determine the deviation amount ΔX, Δ from the reference position based on the reference position □HAIO.
y respectively.

測定618 、19はその優位量を電気信号その他に変
換できるものであればその種類は問わない0 電気信号としてのΔ!、Δyは演算器20に送−られウ
ーハ−1の中心の位置の演算を行なう。
Measurements 618 and 19 can be of any type as long as the dominant quantity can be converted into an electrical signal or other 0 Δ as an electrical signal! , .DELTA.y are sent to a computing unit 20 to calculate the center position of the woofer 1.

ウーハ−1の中心を15’とし中心の偏位量をJx。The center of woofer 1 is set at 15' and the deviation amount of the center is Jx.

δy、また径をD÷ΔDとし、円周上の3点A。δy, and the diameter is D÷ΔD, and three points A on the circumference.

B、Cを考慮すると次式が成立する。Taking B and C into consideration, the following equation holds true.

(1野’D )! =<川+Jx)”+ (Jy)”2 − (埜+Δy−−1)3÷(Jx)”=(8+Δz−
1x)”+(J7)” Jx、J7はつ、ハ11のオフセット量で参9−J、 
、−a7の補正を与え為ことにより、第1打機で処理さ
れ走時のり、ハ外形に、、対するパターン位置に補正す
ることができる。
(1no'D)! =<River+Jx)”+ (Jy)”2 − (No+Δy−−1)3÷(Jx)”=(8+Δz−
1x)"+(J7)" Jx, J7, H11 offset amount, 9-J,
, -a7, it is possible to correct the running time processed by the first batting machine, the outer shape of C, and the pattern position relative to .

一般的に一違0@の装置に於いては、光学系(顯黴鏡)
に対するり畠ハ位置を動かし得るステージを備えており
、これに#J定ススケール付加すれば上記のオフセット
補正は容易に実行し得るO わるいはプリアライメント位置で以後の処理を行なうと
すればダリアライメント機構にこれらの機能を付加すれ
ば嵐い。
Generally, in a device with a difference of 0@, the optical system (pink mirror)
It is equipped with a stage that can move the position of Hatake, and if #J constant scale is added to this stage, the above offset correction can be easily performed. Adding these functions to the alignment mechanism would be amazing.

なお本発明は該実施例に限らず、ダリアライメント基準
の位置及び測定方向においてはその測定値K X D 
’ x * ’ yの値が算出しうる条件さえ満えせば
任意である。
Note that the present invention is not limited to this embodiment, and the measured value K
'x*' It is arbitrary as long as the condition that the value of y can be calculated is satisfied.

なお上述の式より明らかなようにΔX、Δyの測定より
ウーハの径の大急さD+ΔDの算出が可能でToシ、こ
の値を棟々のテークとして付加的に利用することもでき
る。
As is clear from the above equation, it is possible to calculate the steepness D+ΔD of the woofer diameter from the measurement of ΔX and Δy, and this value can also be used additionally as a take-up for each ridge.

以上本発明によれは異なるプリアライメント基準をもつ
2台の装置の搗用の場合にも十分プ′− リアライメント精度を、:・保証できるウーハ等の位置
決め装置を提供できる。
As described above, according to the present invention, it is possible to provide a positioning device for a woofer, etc., which can ensure sufficient pre-alignment accuracy even when two devices having different pre-alignment standards are used.

【図面の簡単な説明】[Brief explanation of the drawing]

嬉1図、第2−は従来の異なるプリアライメントの説明
図、 第3図は本発明の実施例の図、 図中 lOは基準つ、ハ 11はり、ハ 12.13.14は固彫蟇塘 15、Is’扛つ、ハ中心 16.17は測定プ葺−プ 18.19は絢定器 20は演算器  である。 出願人 キャノン株式会社
Figure 1 and Figure 2- are explanatory diagrams of different conventional pre-alignments. Figure 3 is a diagram of an embodiment of the present invention. In the figures, lO is a reference point, C11 is a beam, and C12, 13, and 14 are hard-carved toads. 15, 16 and 17 are measuring blocks 18 and 19 are calculators 20 and 20, respectively. Applicant Canon Co., Ltd.

Claims (1)

【特許請求の範囲】 1、 ウムハ勢をその外周部に対して予備位置決めする
手段と、 所定位置からウーハ勢の外周Sまでの間隔を基準値と比
較調定する手段と、 鋏手設の測定値よりウーハ等の基準位置からのずれを算
出する手段を有することを特徴とするつ、八等の位置決
め装置。 2、前記ウーハ等の基皐位蓋が、前記予備位置、   
訣め手段とは異なる予備位置決め手段によプ予備位置決
めされるウーハ等の位置に対応する籍許麹求の範S第1
項記載のつ、八勢の位置決め装置。 3、@記予備位置決め手段が、つ、6勢の外周部少なく
とも2箇所基準で位置決めするものであり、前記予備位
置決め手段と鉱異なる予備位置決め手Rがり畠ハ勢の中
心III卑で位置決めするものである特許請求の範囲第
2]J記載のウーハ等の位置決め装置。 t 前記測定手段が前記予備位置決め手段の外周部基準
に対応して少なくとも2簡所設けられる特許請求の範囲
第3項記載のウーハ勢の位置決め装置。
[Claims] 1. Means for preliminarily positioning the Umha group with respect to its outer periphery; Means for comparing and adjusting the distance from a predetermined position to the outer periphery S of the Umha group with a reference value; and Measurement of the scissor hand setting. 8. A positioning device, characterized in that it has means for calculating a deviation from a reference position of a woofer or the like from a value. 2. The base position cover of the woofer etc. is in the preliminary position,
The first range of the registration license corresponding to the position of the woofer, etc., which is pre-positioned by a pre-positioning means different from the fixing means.
One and eight positioning devices as described in Section 1. 3. The preliminary positioning means mentioned above is for positioning based on at least two points on the outer periphery of the six groups, and the preliminary positioning means different from the preliminary positioning means is for positioning at the center of the group III. A positioning device for a woofer or the like according to Claim 2]J. t. The woofer positioning device according to claim 3, wherein the measuring means is provided at at least two positions corresponding to the outer peripheral reference of the preliminary positioning means.
JP3764282A 1982-03-10 1982-03-10 Apparatus for positioning wafer Pending JPS58154247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3764282A JPS58154247A (en) 1982-03-10 1982-03-10 Apparatus for positioning wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3764282A JPS58154247A (en) 1982-03-10 1982-03-10 Apparatus for positioning wafer

Publications (1)

Publication Number Publication Date
JPS58154247A true JPS58154247A (en) 1983-09-13

Family

ID=12503301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3764282A Pending JPS58154247A (en) 1982-03-10 1982-03-10 Apparatus for positioning wafer

Country Status (1)

Country Link
JP (1) JPS58154247A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0586195A1 (en) * 1992-08-28 1994-03-09 Hughes Aircraft Company Apparatus for providing consistent, non-jamming registration of semiconductor wafers
CN112158797A (en) * 2020-08-27 2021-01-01 北京航天控制仪器研究所 Alignment detection method in wafer bonding process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0586195A1 (en) * 1992-08-28 1994-03-09 Hughes Aircraft Company Apparatus for providing consistent, non-jamming registration of semiconductor wafers
CN112158797A (en) * 2020-08-27 2021-01-01 北京航天控制仪器研究所 Alignment detection method in wafer bonding process
CN112158797B (en) * 2020-08-27 2023-08-01 北京航天控制仪器研究所 Alignment detection method in wafer bonding process

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