JPS58148412A - Chip type high frequency coil - Google Patents

Abstract

PURPOSE:To obtain a high frequency coil simple in construction with a wide range of capacitance available, excellent temperature characteristics, etc. by using a chip capacitor itself. CONSTITUTION:The dielectric 2 of a chip capacitor was covered with synthetic resin and made into a bobbin 4. A coil 5 was formed by winding copper wire on the bobbin. The ends of the coil 5 were connected to the external electrode 1 of the chip capacitor. Numeral 6 indicates grooves 6 for coil lead wiring provided at both the ends of the bobbin made of the resin to prevent the disconnection of the coil. This construction makes it possible to obtain a chip type high frequency coil compact in size and readily prepared, with a wide range of capacitance available because of the chip capacitor, excellent temperature characteristics, high performance, and easily handled. Moreover, since the bobbin is provided on the dielectric only of the chip capacitor, the external electrode of the chip capacitor is left in tier and can be used as the electrode of the coil.

Description

[Detailed Description of the Invention] The present invention relates to a chip-type high-frequency coil, and its purpose is to use chip capacitors as they are,
The objective is to obtain a high-frequency coil that has a simple structure, has a wide capacity acquisition range, and has excellent temperature characteristics.

A conventional high frequency coil has a structure as shown in FIG. That is, a terminal board (I71) with a terminal αe attached thereto was provided with a bobbin 0 seconds, and a cylindrical or disk-shaped capacitor a9 was attached to the terminal temporary housing η.
211 is a cap core, and CJ21 is a shield case. This configuration is very large and has a complicated structure.

The present invention eliminates the drawbacks of the conventional capacitor and utilizes a chip capacitor that is miniaturized, has a wide range of capacitance in the same shape, and has excellent temperature characteristics. That is, the surface of a chip capacitor is covered with synthetic resin or a magnetic material to form a bobbin, a coil is formed by winding copper wire on this bobbin, and both ends of this coil are connected to the external electrodes of the chip capacitor to create a high frequency coil. It forms the

The structure of a chip capacitor is as shown in Figure 12. (A) is an ordinary chip capacitor, (1 external electrode, (2
) is the dielectric part. (b) is a chip capacitor provided with a lead wire (3).

The structure of the present invention will be explained with reference to FIGS. 1 to 11, which show examples. In FIG. 1, a dielectric part (21) of a chip capacitor is covered with a synthetic resin to form a bobbin (4), and a coil (5) is formed by winding a copper wire on the bobbin.

Both ends of the coil (5) are connected to the external electrodes (1) of the chip capacitor.
). (6) are coil lead wiring grooves formed at both ends of the synthetic resin bobbin to prevent disconnection of the coil.

Since the present invention has the above-described configuration, it is possible to provide a chip-type high-frequency coil that is small and easy to manufacture, has a wide capacity acquisition range using a chip capacitor, has excellent temperature characteristics, and has good performance and is convenient to handle. Ta. Incidentally, since the bobbin was provided only on the dielectric portion of the chip capacitor, the external electrodes of the chip capacitor remain with a step at both ends. This electrode can be used as it is as an electrode for a high-frequency coil, there is no need to provide a new electrode, and the structure is simple.

Since the chip-type high-frequency coil shown in FIG. 2 uses a magnetic material such as ferrite for the bobbin, it is possible to obtain a higher inductance than in the case of the above-mentioned synthetic resin.

The examples shown in FIGS. 3 and 4 are chip-type high-frequency coils in which the bobbin is made of synthetic polar fat or magnetic material and has a flanged bobbin (8) or (9). Because the bobbin is brim-shaped, it has excellent stability in high frequency bands, and since the printed circuit board connection electrode and the chip capacitor electrode are shared, connection can be made over the shortest distance, so there is no influence of distributed capacitance caused by capacitor lead wires, etc. Characteristics are stable when the amount of sauce is small and the frequency is high.

Figures 5 to 11 show examples in which a chip capacitor with a lead wire (3) is used. This is a chip-type high-frequency coil with a lead wire, in which a coil 01) is formed by winding a wire or the like, and both ends of this coil are connected to a lead wire (3) by soldering or the like. In this structure, it is also easy to provide coil lead wiring grooves (121) at both ends of the synthetic resin to prevent disconnection.

Figure 6 shows the lead wires (3) of a chip capacitor with lead wires.
) was the length of both ends of a bobbin made of synthetic resin 00, and external electrodes σ2 were provided at both ends of the bobbin by printing, plating, metal caps, etc., and connected to these. This is a chip-type high-frequency coil in which a copper wire or the like is wound on this bobbin to form a coil 0υ, and both ends of the coil are connected to external electrodes (121) by soldering, etc. Generally, the shape of a chip capacitor is small, so it is similar to a chip capacitor. In a bobbin configuration with a long shape, the inductance acquisition width is narrow and limited. Therefore, as shown in Figure 6, by connecting the chip capacitor and the external bobbin electrode with a connecting lead wire, the inductance acquisition width can be adjusted arbitrarily. I was able to make it wider.

Figure 7 shows the lead wires (3) of a chip capacitor with lead wires.
) is bent and covered with synthetic resin to form a bobbin αO, a copper wire or the like is wound on this bobbin to form a coil 011, and both ends are connected to the lead wire (3) by soldering etc. A high-frequency coil is formed using the following methods. In this chip-type high-frequency coil with a lead wire, since the bobbin length can be easily set to any length, it is also possible to obtain an arbitrarily large inductance.

8 to 10 are improved versions of FIGS. 5 to 7 in order to obtain larger inductance. That is, in contrast to FIGS. 5 to 7 in which synthetic resin was used as the bobbin αO, a bobbin Q31 made of a magnetic material such as ferrite is used. It has become possible to obtain large inductance in a small size by using magnetic materials such as ferrite.

Figure 11 shows a bobbin (141
By winding copper wire etc. on this bobbin, a coil (
15), and the lead wire (3) of a chip capacitor with a lead wire is bent and used as the external electrode of the bobbin (141).This lead wire has a round or plate-shaped (ribbon terminal) Note that in order to stabilize the external electrode, it is also possible to provide a groove in the lead wire portion.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the chip type high frequency coil of the present invention, Fig. 2 is a sectional view showing another embodiment, Figs. 3 and 4 are sectional views showing an embodiment in which the shape of the bobbin is changed, and Fig. 5. - Fig. 11 is a cross-sectional view showing an embodiment using a chip capacitor with lead wires, Fig. 12 (a) and (b) are perspective views showing the chip capacitor, and Fig. 13 is a cross-sectional view showing a conventional high-frequency coil. (1)...electrode of chip capacitor, (21...dielectric part, (3)...external terminal, (41(71(8)(
91 ■ (131H... bobbin, (51C111 (15
1...Coil. Agent Patent Attorney Mr. Oshima

Claims (1)

[Claims] (1) The surface of a chip capacitor is covered with a synthetic resin or a magnetic material such as ferrite to form a bobbin, a coil is formed by winding a copper wire, etc. on the bobbin, and both ends of this coil are connected to the chip capacitor. A chip-type high-frequency coil that is connected to each electrode. (The chip-type high-frequency coil according to claim 1, wherein a bobbin for winding a copper wire or the like is provided on the dielectric part of a chip capacitor, and a step is provided between the bobbin and the electrode of the chip capacitor. 3) The chip-type high-frequency coil according to claim 1, which uses a chip capacitor with a lead wire as the chip capacitor. (4) The chip capacitor with a lead wire is used as the chip capacitor, and the chip capacitor with a lead wire is used as the chip capacitor. The chip-type high-frequency coil according to claim 1, wherein the bobbin is made entirely of synthetic resin or paramagnetic material, and external electrodes are provided at both ends of the bobbin. (5) The bobbin is made of synthetic resin or magnetic material, etc. The chip-type high-frequency coil according to claim 1, wherein a collar is formed on the external bobbin.