JPS58138564A - soldering equipment - Google Patents
soldering equipmentInfo
- Publication number
- JPS58138564A JPS58138564A JP2113882A JP2113882A JPS58138564A JP S58138564 A JPS58138564 A JP S58138564A JP 2113882 A JP2113882 A JP 2113882A JP 2113882 A JP2113882 A JP 2113882A JP S58138564 A JPS58138564 A JP S58138564A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- drain pipe
- solder material
- tank
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は半田槽内の半田材料を確実かつ円滑に排出でき
る半田付は装置に関する・
従来、たとえば半導体製品の製造過＠において使用され
る半田付は装置では、古、くなりて汚染されたりあるい
は不要となりた半ＩＩＢ＊を科を半田槽から排出する場
合、半田材料の温度を通常の作業温度よりも蟲い温度と
し、その半田材料を半田槽の底部のドレーン管のコック
を開けることＫより行りている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soldering device that can reliably and smoothly discharge solder material in a solder tank. When discharging semi-IIB* that has become contaminated or is no longer needed from the solder tank, the temperature of the solder material should be kept at a temperature slightly lower than the normal working temperature, and the solder material should be drained into the drain pipe at the bottom of the solder tank. Opening the cock of K is going.
ところが、ドレーン管は半田槽の外側に５１出している
ので、槽内の半田の温度よりも一般に約数１０ｆ＠低い
温度になりてしま５゜そのため、半田の排出−始時には
、ドレーン管の温度が半田の融点以下に低下している場
合があり、半田がドレーン管内に詰まって排出が不可能
または困難になることがある。また、半田の排出適中で
コックを閉じて排出を中断した場合には、放熱により半
田がドレーン管内で固化し、やはり半田の排出を不可能
または困ＪＩＩＩｉＫしてしまう。However, since the drain pipe protrudes outside the solder tank, the temperature is generally several tens of degrees lower than the temperature of the solder inside the tank. may be below the melting point of the solder, and the solder may become stuck in the drain pipe, making it impossible or difficult to drain. Furthermore, if the cock is closed to interrupt the discharge while the solder is being discharged, the solder solidifies in the drain pipe due to heat radiation, making it impossible or difficult to discharge the solder.
本発明の目的は、前記従来技術の課題に鑑み、半田槽か
らの半田材料の排出を確実かつ円滑に行い、作業性を向
上させることのできる半田付は装置を提供する仁とＫあ
る。SUMMARY OF THE INVENTION In view of the problems of the prior art described above, an object of the present invention is to provide a soldering device that can reliably and smoothly discharge solder material from a solder tank and improve workability.
この目的を達成するため、本発明は、半田材料の排出用
のドレーンｓＫ加熱手段を設け、この加熱手段によりド
レーン部の温度を半田材料の融点以上に保つよう構成し
たものである。In order to achieve this object, the present invention provides a drain sK heating means for discharging solder material, and is configured to maintain the temperature of the drain section at a temperature higher than the melting point of the solder material by this heating means.
以下、本発明を図面に示す一実施例にしたかつて詳ＩＩ
ＩＮＩＫ説明する。Hereinafter, details of an embodiment of the present invention shown in the drawings will be explained.
INIK explains.
第１図は本発明による半田付は装置の一実施例を一部切
り欠い′た正面図、第２図は第１図のＡ１１Ｓのドレー
ン部の拡大部分斜視図である。FIG. 1 is a partially cutaway front view of an embodiment of the soldering device according to the present invention, and FIG. 2 is an enlarged partial perspective view of the drain portion of A11S shown in FIG.
本実施例において、＊ａｉ状態の半田材料を収容した半
田槽ｌの下部側面には、ドレーン管２が集設され、この
ドレーン管２の先端付近にはコック３が設けられている
。In this embodiment, a drain pipe 2 is arranged on the lower side surface of the solder tank l containing the solder material in the *ai state, and a cock 3 is provided near the tip of the drain pipe 2.
また、ドレーン管２のコック２よりも基端側の周囲には
、加熱用の電気ヒータ４が一体的に配設されている。Further, an electric heater 4 for heating is integrally disposed around the drain pipe 2 on the proximal end side of the cock 2.
したがって、本夷麹例においては、半田槽１内の半田材
料を排出する場合、電気ヒータ４に通電してドレーン管
２を半田材料の融点以上に加熱しておくことにより、半
田材料がドレーン管２の中で冷却固化して鋏ドレーン管
２を詰まらせるようなことを排除でき、巣にコック３を
開くだけで半田槽１内の半田材料をただちＫｉＩ夷かつ
円゛滑に排出できる。Therefore, in this case, when discharging the solder material in the solder tank 1, the electric heater 4 is energized to heat the drain pipe 2 above the melting point of the solder material, so that the solder material is removed from the drain pipe. It is possible to eliminate clogging of the scissors drain pipe 2 due to cooling and solidification in the solder tank 2, and the solder material in the solder bath 1 can be immediately and smoothly discharged by simply opening the cock 3.
また、排出途中でコック３を何らかの事情で閉めて排出
を中断する場合でも、コック３ｖＩＩＩけば、半田材料
の排出をただちに再開できる。Further, even if the cock 3 is closed for some reason during the discharge to interrupt the discharge, the discharge of the solder material can be resumed immediately by using the cock 3vIII.
さらに、半ｉ槽１内の半田材料が減少し、半田材料の温
度が低下しても、その半田材料がドレーン管２内で固化
することは防止できる。Furthermore, even if the solder material in the semi-i bath 1 decreases and the temperature of the solder material decreases, it is possible to prevent the solder material from solidifying in the drain pipe 2.
なお１本実施例では、ドレーン管２の加熱手段として電
気ヒータ４を用いているが、ガスバーナー等の加熱手段
を使用してもよく、その設置位置も何ら限定されるもの
ではない。In this embodiment, the electric heater 4 is used as a heating means for the drain pipe 2, but a heating means such as a gas burner may also be used, and the installation position thereof is not limited at all.
また、ドレーン部の構造も前記実施例に限定されない。Further, the structure of the drain portion is not limited to the above embodiment.
以上説明したようＫ、本発明によれば、半田槽からの半
田材料の排出な常に確実かつ円滑に行うことができ１作
業性を向上させることができる。As described above, according to the present invention, the solder material can be always discharged from the solder tank reliably and smoothly, and work efficiency can be improved.
第１図は本発明による半田付は狭量の一実施例を一部切
り欠いた正面図、＠２図は第１図のＡ部のドレーン部の
拡大部分斜視図である。
１・・・半田槽、２・・・ドレーン管、３・・・コック
、４・・・電気ヒータ。
代理人 弁理士 薄 １）利 幸FIG. 1 is a partially cutaway front view of an embodiment of the soldering method according to the present invention, and FIG. 2 is an enlarged partial perspective view of the drain portion of section A in FIG. 1... Solder tank, 2... Drain pipe, 3... Cock, 4... Electric heater. Agent Patent Attorney Susuki 1) Toshiyuki
Claims (1)
おいて、ドレーンｌｌＫ加熱手段を設けたことを善黴と
する半田付は装置。The soldering device has a drain part near the bottom of the solder tank, and the soldering device has a drain heating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113882A JPS58138564A (en) | 1982-02-15 | 1982-02-15 | soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113882A JPS58138564A (en) | 1982-02-15 | 1982-02-15 | soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138564A true JPS58138564A (en) | 1983-08-17 |
Family
ID=12046531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2113882A Pending JPS58138564A (en) | 1982-02-15 | 1982-02-15 | soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138564A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4122191Y1 (en) * | 1964-12-22 | 1966-11-04 |
-
1982
- 1982-02-15 JP JP2113882A patent/JPS58138564A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4122191Y1 (en) * | 1964-12-22 | 1966-11-04 |
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