JPS58134259U - solder ball hopper - Google Patents
solder ball hopperInfo
- Publication number
- JPS58134259U JPS58134259U JP2851882U JP2851882U JPS58134259U JP S58134259 U JPS58134259 U JP S58134259U JP 2851882 U JP2851882 U JP 2851882U JP 2851882 U JP2851882 U JP 2851882U JP S58134259 U JPS58134259 U JP S58134259U
- Authority
- JP
- Japan
- Prior art keywords
- hopper
- solder
- drop opening
- drop
- solder balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chutes (AREA)
- Filling Or Emptying Of Bunkers, Hoppers, And Tanks (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は本考案の一実施例のホッパの縦断面
図及び平面図である。
１・・・・・・ホッパ、２・・・・・・当て板、３・・
・・・・落下口、４・・・・・・半田球、５・・・・・
・送出装置、６・・曲足車、７・・・・・・機枠、８・
・・・・・シュート、１３・・・・・・警報装置、１４
・・・・・・半田槽。1 and 2 are a vertical sectional view and a plan view of a hopper according to an embodiment of the present invention. 1... hopper, 2... patch plate, 3...
...Drop opening, 4...Solder ball, 5...
・Delivery device, 6... Curved castor, 7... Machine frame, 8...
...Chute, 13...Alarm device, 14
...Solder tank.
Claims (3)
交互に反対向きに傾斜する当て板を上下方向に並べ、各
当て板の下縁に半田球を下へ落とす落下口を形成し、最
下段の当て板の落下口を送出装置に直結し、前記送出装
置に作用する最大荷重を最下段とその上の当て板の落下
口の落差に基づく荷重に制限したことを特徴としてなる
半田球ホッパ。(1) An upper hopper of the solder tank is constructed, and inside the hopper, backing plates that are tilted in opposite directions are arranged vertically, and a drop opening is formed at the lower edge of each backing plate to drop the solder balls downward. , a soldering device characterized in that the drop opening of the lowermost patch plate is directly connected to a delivery device, and the maximum load acting on the delivery device is limited to a load based on the head difference between the drop port of the lowermost patch and the patch plate above it. Ball hopper.
ように靜成し、前記最下段の落下口の直下に前記横一列
の半田球を受ける足車とその足車から半田球を受けるシ
ュートを送出装置に設けたことを特徴としてなる実用新
案登録請求の範囲第１項記載の半田球ホッパ。(2) Set up the lowest drop opening so that the solder balls are lined up in a row horizontally, and place a caster immediately below the lowest drop opening to receive the horizontal row of solder balls, and the solder from the caster. A solder ball hopper according to claim 1, characterized in that the delivery device is provided with a chute for receiving balls.
する警報装置をホッパに付設したことを特徴としでなる
実用新案登録請求の範囲第１項記載の半田球ホッパ。(3) The solder ball hopper according to claim 1, which is a registered utility model, characterized in that the hopper is equipped with an alarm device that issues a signal when the number of solder balls in the hopper falls below a certain limit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2851882U JPS58134259U (en) | 1982-03-02 | 1982-03-02 | solder ball hopper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2851882U JPS58134259U (en) | 1982-03-02 | 1982-03-02 | solder ball hopper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58134259U true JPS58134259U (en) | 1983-09-09 |
Family
ID=30040362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2851882U Pending JPS58134259U (en) | 1982-03-02 | 1982-03-02 | solder ball hopper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58134259U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009006329A (en) * | 2007-05-29 | 2009-01-15 | Hideo Kai | Brazing set |
| JP2015223093A (en) * | 2014-05-26 | 2015-12-14 | レオン自動機株式会社 | Powder dusting method and powder dusting device |
-
1982
- 1982-03-02 JP JP2851882U patent/JPS58134259U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009006329A (en) * | 2007-05-29 | 2009-01-15 | Hideo Kai | Brazing set |
| JP2015223093A (en) * | 2014-05-26 | 2015-12-14 | レオン自動機株式会社 | Powder dusting method and powder dusting device |
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