JPS58132057U - siding board - Google Patents
siding boardInfo
- Publication number
- JPS58132057U JPS58132057U JP3017782U JP3017782U JPS58132057U JP S58132057 U JPS58132057 U JP S58132057U JP 3017782 U JP3017782 U JP 3017782U JP 3017782 U JP3017782 U JP 3017782U JP S58132057 U JPS58132057 U JP S58132057U
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- main body
- resin foam
- back surface
- siding board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finishing Walls (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bは金属フープ材を成形した際に生ずる
反りの一例を示す斜視図、第2図、および第3図は本考
案に係るサイディングボードの一実施例を示す斜視図で
ある。
1・・・・・・主体、2・・・・・・化粧面、5・・・
・・・雄型連結部、14・・・・・・合成樹脂発泡体、
16・・・・・・骨材。FIGS. 1a and 1b are perspective views showing an example of warping that occurs when metal hoop material is molded, and FIGS. 2 and 3 are perspective views showing an example of a siding board according to the present invention. 1... Main body, 2... Cosmetic surface, 5...
...Male connecting part, 14...Synthetic resin foam,
16... Aggregate.
Claims (1)
側端を外側方へ突出した差込縁を有する雄型連結部と、
他側端を内側方へ屈曲し、再び外側方へ突出して形成し
た差込溝と該差込溝の下縁を外側方へ延長突出して延長
部を形成した雌型連結部と、前記主体の背面、または背
面と延長部下面を含む部分に主体と一体に形成した合成
樹脂発泡体とからなるサイディングボードにおいて、前
記主体の凹状部内側の角部分に骨材を充填すると共に、
前記合成樹脂発泡体で結合一体化し、また前記合成樹脂
発泡体の背面を比較的強靭なシートで被覆したことを特
徴とするサイディングボード。A main body with a concave cross section and a rectangular decorative surface, and one of the main bodies.
a male connecting portion having an insertion edge with a side end protruding outward;
an insertion groove formed by bending the other end inward and protruding outward again; a female connecting portion having an extension portion formed by extending the lower edge of the insertion groove outward; In a siding board consisting of a synthetic resin foam integrally formed with a main body on the back surface or a portion including the back surface and the extended lower surface, the inner corner portion of the concave portion of the main body is filled with aggregate;
A siding board characterized in that the synthetic resin foam is bonded and integrated, and the back surface of the synthetic resin foam is covered with a relatively strong sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3017782U JPS58132057U (en) | 1982-03-02 | 1982-03-02 | siding board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3017782U JPS58132057U (en) | 1982-03-02 | 1982-03-02 | siding board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58132057U true JPS58132057U (en) | 1983-09-06 |
Family
ID=30041923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3017782U Pending JPS58132057U (en) | 1982-03-02 | 1982-03-02 | siding board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58132057U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6091754U (en) * | 1983-11-30 | 1985-06-22 | 株式会社 アイジ−技術研究所 | siding board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5644220A (en) * | 1979-09-20 | 1981-04-23 | Nec Corp | Waveform shaping circuit |
JPS5644221A (en) * | 1979-09-20 | 1981-04-23 | Oki Electric Ind Co Ltd | Phase modulating circuit |
-
1982
- 1982-03-02 JP JP3017782U patent/JPS58132057U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5644220A (en) * | 1979-09-20 | 1981-04-23 | Nec Corp | Waveform shaping circuit |
JPS5644221A (en) * | 1979-09-20 | 1981-04-23 | Oki Electric Ind Co Ltd | Phase modulating circuit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6091754U (en) * | 1983-11-30 | 1985-06-22 | 株式会社 アイジ−技術研究所 | siding board |
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