JPS58130718U - Encapsulation molding equipment - Google Patents
Encapsulation molding equipmentInfo
- Publication number
- JPS58130718U JPS58130718U JP2802782U JP2802782U JPS58130718U JP S58130718 U JPS58130718 U JP S58130718U JP 2802782 U JP2802782 U JP 2802782U JP 2802782 U JP2802782 U JP 2802782U JP S58130718 U JPS58130718 U JP S58130718U
- Authority
- JP
- Japan
- Prior art keywords
- cutting tool
- pot
- plunger
- synthetic resin
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案による封入装置の実施例を示す図で、第
１図は封入成形装置全体の外観を示す正面図、第２図は
この考案の要部構成を備えた部分を断面して示す平面図
、第３図はこの考案による切削除去機構の構成を示す縦
断面図、第４図は変形実施例を示す図である。
１・・・上型、２・・・下型、４・・・ポット、５・・
・プランジャ、６・・・シリンダ、７・・・可動枠、７
′・・・カバー、８・・・保持枠、９・・・切削具、１
０・・・中空回転体、１０Ｇ：・・歯車、１１．１３・
・・圧縮バネ、１２・・・ピン、１５・・・ラック、１
８・・・連結具、２０・・・エアシリンダ。
窮４図The drawings show an embodiment of the encapsulating device according to this invention, and FIG. 1 is a front view showing the appearance of the entire encapsulation molding device, and FIG. 3 are longitudinal cross-sectional views showing the structure of the cutting and removing mechanism according to this invention, and FIG. 4 is a view showing a modified embodiment. 1... Upper mold, 2... Lower mold, 4... Pot, 5...
・Plunger, 6... Cylinder, 7... Movable frame, 7
'... Cover, 8... Holding frame, 9... Cutting tool, 1
0...Hollow rotating body, 10G:...Gear, 11.13.
...Compression spring, 12...Pin, 15...Rack, 1
8... Connector, 20... Air cylinder. 4th picture
Claims (2)
設形成された金型を用いて合成樹脂材で封入成形するに
際し、複数個のキャビティに近接して配設したポット内
に前記合成樹脂材を供給しこれをポットに挿入されるプ
ラーンジャにて各キャビティに加圧注入して成形するよ
うにした装置において、プランジャと同軸上に配設され
ポットの合成樹脂供給口部に付着した合成樹脂材を回転
により切削除去する切削具と、この切削具を前記ポット
の合成樹脂供給口部に対し進退させる進退駆動機構払前
記切削具が前記ポットの合成樹脂供給口部に当接した状
態で切削具を回転させる回転駆動機構とを備えることを
特徴とする封入成形装置。(1) When encapsulating and molding a plurality of small electric elements with a synthetic resin material using a mold in which a plurality of cavities are formed, the synthetic resin is placed in a pot disposed close to the plurality of cavities. In a device that supplies a resin material and injects it into each cavity under pressure using a plunger inserted into a pot, the resin material is placed coaxially with the plunger and adheres to the synthetic resin supply opening of the pot. A cutting tool for cutting and removing a resin material by rotation, and an advancing/retracting drive mechanism for moving the cutting tool forward and backward with respect to the synthetic resin supply opening of the pot.The cutting tool is in contact with the synthetic resin supply opening of the pot. An encapsulation molding device comprising: a rotation drive mechanism that rotates a cutting tool.
切削具を結合するとともに切削具の進退駆動機構をプラ
ンジャの往復作動機構にて構成した実用新案登録請求の
範囲第１項記載の封入成形装置。(2) The encapsulation molding device according to claim 1, wherein the plunger and the cutting tool are coupled so that the plunger penetrates through the cutting tool, and the mechanism for driving the cutting tool forward and backward is configured by the reciprocating mechanism of the plunger. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2802782U JPS58130718U (en) | 1982-02-27 | 1982-02-27 | Encapsulation molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2802782U JPS58130718U (en) | 1982-02-27 | 1982-02-27 | Encapsulation molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130718U true JPS58130718U (en) | 1983-09-03 |
| JPH025931Y2 JPH025931Y2 (en) | 1990-02-14 |
Family
ID=30039898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2802782U Granted JPS58130718U (en) | 1982-02-27 | 1982-02-27 | Encapsulation molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130718U (en) |
-
1982
- 1982-02-27 JP JP2802782U patent/JPS58130718U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025931Y2 (en) | 1990-02-14 |
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