JPS58120606U - High voltage resistance pack - Google Patents
High voltage resistance packInfo
- Publication number
- JPS58120606U JPS58120606U JP1689882U JP1689882U JPS58120606U JP S58120606 U JPS58120606 U JP S58120606U JP 1689882 U JP1689882 U JP 1689882U JP 1689882 U JP1689882 U JP 1689882U JP S58120606 U JPS58120606 U JP S58120606U
- Authority
- JP
- Japan
- Prior art keywords
- high voltage
- voltage resistance
- resistance pack
- output lead
- lead hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Television Scanning (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は高圧発生部と高圧抵抗パックとを一体化した高
圧発生装置の代表的回路接続図、第2図は従来の高圧抵
抗パックの構造の一例を示す概略断面図、第3図は本考
案による高圧抵抗パックの一実施例の構造を示す概略断
面図である。
11:高圧抵抗パック、20:高圧抵抗パックケース、
21:セラミック基板、22:プリコート−樹脂、25
:出力リード穴、26:ポケット空間、28:突起。Figure 1 is a typical circuit connection diagram of a high-voltage generator that integrates a high-voltage generator and a high-voltage resistance pack, Figure 2 is a schematic cross-sectional view showing an example of the structure of a conventional high-voltage resistance pack, and Figure 3 is a diagram of the present invention. FIG. 1 is a schematic cross-sectional view showing the structure of an embodiment of the high voltage resistance pack according to the invention. 11: High voltage resistance pack, 20: High voltage resistance pack case,
21: Ceramic substrate, 22: Precoat-resin, 25
: Output lead hole, 26: Pocket space, 28: Protrusion.
Claims (1)
高圧抵抗パックにおいて、前記出力リード穴をセラミッ
ク基板の側方へずらして形成するとともに該セラミック
基板と前記出力リード穴との間に出力リードを通すため
のポケット空間を設けてなる高圧抵抗パック。In a high voltage resistance pack with an output lead hole that is used integrally with a high voltage generator, the output lead hole is formed by being shifted to the side of the ceramic substrate, and the output lead is formed between the ceramic substrate and the output lead hole. A high-voltage resistance pack with a pocket space for passing it through.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1689882U JPS58120606U (en) | 1982-02-09 | 1982-02-09 | High voltage resistance pack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1689882U JPS58120606U (en) | 1982-02-09 | 1982-02-09 | High voltage resistance pack |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58120606U true JPS58120606U (en) | 1983-08-17 |
Family
ID=30029246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1689882U Pending JPS58120606U (en) | 1982-02-09 | 1982-02-09 | High voltage resistance pack |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58120606U (en) |
-
1982
- 1982-02-09 JP JP1689882U patent/JPS58120606U/en active Pending
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