JPS58119200A - X-ray generating device - Google Patents
X-ray generating deviceInfo
- Publication number
- JPS58119200A JPS58119200A JP57001544A JP154482A JPS58119200A JP S58119200 A JPS58119200 A JP S58119200A JP 57001544 A JP57001544 A JP 57001544A JP 154482 A JP154482 A JP 154482A JP S58119200 A JPS58119200 A JP S58119200A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- ray
- generating device
- insulator
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G1/00—X-ray apparatus involving X-ray tubes; Circuits therefor
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- X-Ray Techniques (AREA)
Abstract
Description
【発明の詳細な説明】
発′―O技留分野
本発明は、xll!lI元等に用いられるXls発生装
置O改良に調する。[Detailed Description of the Invention] The present invention is directed to xll! We are looking into improving the Xls generator O used for II elements.
発明の技術的背景とそ01s15111に点近時、半導
体ウェーハやマスク等に微細パターンを形成する技術と
して、光、紫外光、XII!或いは荷電ビームを用いる
各種の露光法が開発されている。仁れらの中でX**元
法は、X線が紫外光よりも波長が短く回折効果が小さい
ことから、1〔μm〕以下の微細加工に極めて有効であ
ると考えられている。Technical Background of the Invention Recently, light, ultraviolet light, XII! Alternatively, various exposure methods using charged beams have been developed. In Nire et al., the X** element method is considered to be extremely effective for microfabrication of 1 [μm] or less because X-rays have a shorter wavelength than ultraviolet light and have a smaller diffraction effect.
第1図はxag光法の原理を示す模式図である。X線発
生源1(X線発生装置)から放射されたXIIは、X線
マスク2上O金パターン3Ytシリコンウエーハ4上の
X線レジスト5に転写する。通常、X線発生@1として
は、加速電子ビームをターゲットに衝突させることによ
ってX@を励起する電子線励起型のものが用いられるが
、この場合X線の出力が小さく転写に長時間t−要する
と云う欠点がある。FIG. 1 is a schematic diagram showing the principle of the XAG optical method. XII emitted from the X-ray generation source 1 (X-ray generation device) is transferred onto the X-ray resist 5 on the X-ray mask 2, the gold pattern 3Yt, and the silicon wafer 4. Usually, an electron beam excitation type is used for X-ray generation@1, which excites X@ by colliding an accelerated electron beam with a target, but in this case, the X-ray output is small and the transfer takes a long time. There is a drawback to it.
そこで最近、X−発生源の低出力の間@を解決するもの
として、屯細管型の放電プラズマX線発生源が開発され
ている。このXI!発生発生源拡間2図す如く、例えは
直径1〔μm〕の屯細W(貫通孔)6を有するポリエチ
レン円筒70両生rInKそれぞれ電極8.9【被着し
、電極89間に″:lンデンtlOf接続して構成され
る。Therefore, recently, a tube-type discharge plasma X-ray source has been developed as a solution to the low output power of the X-source. This XI! Generation Source Expansion 2 As shown in Figure 2, for example, a polyethylene cylinder 70 having a narrow W (through hole) 6 with a diameter of 1 [μm], an amphoteric rInK electrode 8.9 [adhered, and between the electrodes 89] It is configured by connecting tlOf.
そして、高圧電llll111にて;ンデ’/1lO1
−充電し、トリガ電極12を用いてトリガtかけること
Kよって、ポリエチレン円筒7の貫通孔6の内壁に沿っ
て沿面放電tl!発させ、この放電によ)プラズマが発
生してXIIが放射されるものとなっている。こOX@
の発生効率は従来のもOよ)2桁以上も高く高出方X線
として利用価値が高%/m%のである。Then, at high voltage voltage lllll111; nde'/1lO1
- By charging and applying a trigger t using the trigger electrode 12, a creeping discharge tl! is generated along the inner wall of the through hole 6 of the polyethylene cylinder 7! This discharge generates plasma and radiates XII. KoOX@
The generation efficiency is more than two orders of magnitude higher than the conventional one (0), and the utility value as a high-output X-ray is high %/m%.
しかしながら、このような放電プラズマXH発生源では
、その放射角が狭く、大口径のシリコ゛ンウエーへ全1
11−1度に照射できないと云う欠点がある。例えば、
前記ポリエチレン円筒7とシリフンウェーハ4と0距離
が15(慣〕0場合、x*o照射照射線83〔1〕径と
な夛、3〔国〕径よ・夕大径0クエーハを1度Kll光
することはilmであった。However, in such a discharge plasma
The drawback is that it cannot be irradiated at 11-1 degrees. for example,
If the zero distance between the polyethylene cylinder 7 and the silicon wafer 4 is 15 (usually 0), the x*o irradiation ray 83 [1] diameter is 3 [country] diameter, and the large diameter 0 quadrature is 1 degree. Kll light was ilm.
発明の目的
本発明の目的は、XIIの高出方化をはか夛得て、かつ
大面積を1度に照射することのできるXII発生装置を
提供することKある。OBJECTS OF THE INVENTION An object of the present invention is to provide an XII generator that can increase the output of XII and irradiate a large area at once.
発明の概要
本発明は、貫通孔が形成され定結縁体の両生面に電極【
被着すると共に、これらの電極間に;ンデン?!−11
続し、この=ンデンサを充電したのちトリガをかけ上記
貫通孔の内壁に沿って沿面放電を誘発させてプラズマを
発生させ、このプラズマによってX5t−放射せしめる
毛細管型の放電プラズマX線発生装置において、上記貫
通孔を複数個設けるようにしたものである。Summary of the Invention The present invention provides an electrode [
At the same time, there is a layer between these electrodes. ! -11
Next, in a capillary-type discharge plasma X-ray generation device that charges this capacitor and then triggers it to induce creeping discharge along the inner wall of the through hole to generate plasma, and causes X5t-radiation by this plasma, A plurality of the above-mentioned through holes are provided.
発明の効果
本発明によれば、XIl!0高出力化tはか9得ゐのは
勿論のこと被数個の貫通孔?W&けたことによ5、Xl
i!の照射箱8を大輪に増大することができる。このた
め、X線I光法に用いた場合、大面積のウェーハ@:1
度に、かつ短時間で露光し得る等の効果を奏する。Effects of the Invention According to the present invention, XIl! Of course, the number of through holes is high, and the number of through holes is high. W & Ketoyo 5, XL
i! The irradiation box 8 can be increased to a large size. Therefore, when used in the X-ray I optical method, a large area wafer @:1
This provides effects such as being able to perform exposure at once and in a short time.
発1i4の実施例
第3図は本!111の一実施例に係わるX線発生装置を
用いたX@露光法を示す模式図である。Example 1i4 Figure 3 is a book! 111 is a schematic diagram showing an X@exposure method using an X-ray generator according to an embodiment of No. 111. FIG.
なお、第1図および第2図と同一部分に蝶同−符号を付
して、そO評しい説Wi4は省略する。こO実施例が第
2図に示したxiin光法と異なる点tL xl1発生
源の絶縁体に設ける貫通孔1w数個にし九ことにあゐ。Note that the same parts as in FIGS. 1 and 2 are given the same reference numerals, and explanations Wi4 that are less favorable are omitted. This embodiment differs from the xiin optical method shown in FIG. 2 in that only a few through holes 1w are provided in the insulator of the generation source.
すなわち、長さ2〔帰〕のポジエチレン円柱z1(絶縁
体)には、第4図にそO平面図【示す如(3〔菌〕の間
隔で4債O貫通孔11m 、11b、Ilc 、22d
が設けられている8貫通孔221〜22dはその断面形
状が正方形で、−辺の長さをそれぞれ1〔−〕とした。That is, in a positive ethylene cylinder z1 (insulator) having a length of 2 [return], four through holes 11m, 11b, Ilc, 22d are formed at intervals of 3 [bacteria] as shown in the plan view of Fig. 4.
The eight through-holes 221 to 22d provided with the through holes 221 to 22d have a square cross-sectional shape, and the length of the - side is 1 [-].
また、貫通孔221〜jffdの上方はそれぞれトリガ
が電極XSS〜234が設けられてiる。なお、電極8
.9はグラファイトで形成し+、t+、=rンデンfl
IC)静電容量はZooCμ!〕、高圧電源11の電
圧は50〔Kマ〕とした。Additionally, trigger electrodes XSS to 234 are provided above the through holes 221 to jffd, respectively. Note that the electrode 8
.. 9 is made of graphite +,t+,=rndenfl
IC) The capacitance is ZooCμ! ], and the voltage of the high voltage power supply 11 was set to 50 [Kma].
このよう&XI1発生装置を用いることによって、貫通
孔が1個の゛従来のものに比してX@0照射面積t1従
来面積に貫通孔の数t−iけた面積近くまで拡大するこ
とが可能となる。例えばポリエチレン円柱21とシリフ
ンウェーハ5との距離t−15(ffi)とすると、6
m5m)角の面積を1度に照射することができる。By using such & Become. For example, if the distance between the polyethylene cylinder 21 and the silicon wafer 5 is t-15 (ffi), then 6
A square area of 5 m) can be irradiated at once.
なお、本発明は上述した実施例に限定されるものではな
い。例えば、前記ポリエチレン0代CKは、絶縁体であ
れば用iてもよい。また、絶縁体に設ける貫通孔の数は
411Kllるものではなく、必要とするX線照射面積
に応じて適宜変更すればよい。さらに、貫通孔の形状は
正方形に限るものではなく、矩形、円形成いは吻円形郷
、目的に応じて各程の形状【用いればよい。Note that the present invention is not limited to the embodiments described above. For example, the polyethylene CK may be used as long as it is an insulator. Further, the number of through holes provided in the insulator is not limited to 411 Kll, and may be changed as appropriate depending on the required X-ray irradiation area. Further, the shape of the through hole is not limited to a square, but may be rectangular, circular, or rostral, or any other shape depending on the purpose.
その他、本発明の要旨を逸脱しない範囲で、種々変形し
て実施することができる。In addition, various modifications can be made without departing from the gist of the present invention.
第1図は従来のX線露光法の原理を示す模式図、第2図
は従来の毛細管型の放電プラズマX線発生装置を用いt
X線島元法1)午模式図、第3図は本発明O−笑施例に
係わ、6XIl1発生装置を用いたxs!露光法を示す
潰式図、第4図は上記実施例装置を上方から見た平面図
てあゐ。
8.9・・・電極、10・−;ンデンサ、11・・・高
圧電−1j1・・・ポリエチレン円柱(絶縁体)、xx
a−xxa−・・貫通孔、23a #jJd・・・)リ
ガ電極。
出願人代理人 弁理土鈴 圧式 彦
1[3真
第1図
第2図Figure 1 is a schematic diagram showing the principle of the conventional X-ray exposure method, and Figure 2 is a schematic diagram showing the principle of conventional X-ray exposure.
X-ray Shimamoto method 1) Schematic diagram of the xs! FIG. 4 is an exploded view showing the exposure method, and is a plan view of the apparatus of the above embodiment seen from above. 8.9... Electrode, 10.-; Densator, 11... High voltage electric -1j1... Polyethylene cylinder (insulator), xx
a-xxa-...through hole, 23a #jJd...) Riga electrode. Applicant's agent: Patent attorney Dosu Hiko 1 [3 marks, Figure 1, Figure 2]
Claims (1)
た絶縁体と、この絶縁体の両主面にそれぞれ被着され友
電極と、これらの電極間にW!続された;ンデンナと、
このコンデンtK接続された高圧電源と、前虻絶縁体の
一方の主面側に前記各貫通孔に対応して設けられたトリ
ガ電極とを具備してなることを特徴とするX、!1発生
装置。 @ 前記各貫通孔は、その断面形状が正方形であること
t4I微とする特許請求の範囲第1項記載のX線発生装
置。(1) Amphibious I! An insulator having a plurality of through-holes formed therethrough, friend electrodes each attached to both main surfaces of the insulator, and W! between these electrodes. continued; with ndenna;
X,! characterized by comprising a high-voltage power supply connected to the capacitor and a trigger electrode provided on one main surface side of the front insulator corresponding to each of the through holes. 1 generator. The X-ray generator according to claim 1, wherein each of the through holes has a square cross-sectional shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57001544A JPS58119200A (en) | 1982-01-08 | 1982-01-08 | X-ray generating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57001544A JPS58119200A (en) | 1982-01-08 | 1982-01-08 | X-ray generating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58119200A true JPS58119200A (en) | 1983-07-15 |
Family
ID=11504457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57001544A Pending JPS58119200A (en) | 1982-01-08 | 1982-01-08 | X-ray generating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58119200A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62122036A (en) * | 1985-11-21 | 1987-06-03 | Nichicon Capacitor Ltd | X-ray generator |
JPS62254349A (en) * | 1985-11-21 | 1987-11-06 | Nichicon Corp | X-ray generator |
JP2003051398A (en) * | 2001-08-07 | 2003-02-21 | Nikon Corp | X-ray generator, device and method for exposure, and device manufacturing method |
-
1982
- 1982-01-08 JP JP57001544A patent/JPS58119200A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62122036A (en) * | 1985-11-21 | 1987-06-03 | Nichicon Capacitor Ltd | X-ray generator |
JPS62254349A (en) * | 1985-11-21 | 1987-11-06 | Nichicon Corp | X-ray generator |
JP2003051398A (en) * | 2001-08-07 | 2003-02-21 | Nikon Corp | X-ray generator, device and method for exposure, and device manufacturing method |
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