JPS5811706A - Production of composite sintered parts - Google Patents

Abstract

PURPOSE:To improve working efficiency and to reduce space for molding of composite sintered parts when the uppermost layer and the lowermost layer are of the same powder by moving hoppers contg. said powder back and forth over molding dies thereby intermittently packing the powder into the dies. CONSTITUTION:If the number of layers of composite sintered contact points is assumed to be, for example, 3 layers, a number less by one, for example, two pieces of hoppers 8, 9 are connected and provided in such a way as to move back and forth on a table 6 with respect to dies 5. First the hoppers 8, 9 are moved together in the direction of the dies 5 until the hopper 8 is located over the dies 5, then part of the powder A packed therein is charged into the dies 5. Then, the hopper 9 is located over the dies 5 and the powder B packed therein is charged fully into the dies 5. The hoppers 8, 9 are moved in a backward direction, and the remaining powder A in the hopper 8 is charged into the dies 5. Three layers of the powders A, B deposited on the lower punch in the dies 5 are pressurized with an upper punch to form a powder molding which is sintered, whereby the composite sintered parts are produced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention Ij1a relates to a method for producing a composite sintered crystal having three or more layers.

As a method for manufacturing a sintered gold product with three or more layers, the material powder that forms each layer of sintered crystal is stacked in layers and charged into a metal molding chamber for powder molding, and the whole is pressurized. In particular, there is a method of forming a layered powder compact and sintering the ζO powder compact to obtain a composite sintered crystal.

However, when molding such a layered composite sintered crystal powder compact, in order to charge the powder into the mold in layers, it is necessary to prepare a layer portion for filling the powder forming each layer portion. Attach the same number of hoppers to a rotary table or rotary arm, rotate the rotary cheagle or rotary arm, and pass each hole A sequentially over the metal part in the process of rotating in one direction. From υ, each part, Δ. The powder is poured into a thick mold in layers.

However, this method requires a large circular space corresponding to the rotation circle drawn by the hopper in order to rotate the hopper, and each hopper moves in one direction on the metal lid instead of drawing a rotation circle to input powder. Because of this, there is a drawback that the moving speed is large and the work efficiency is poor.

The present invention was made in view of the above circumstances, and it is possible to efficiently perform work in a small space by moving the conch in short steps when introducing powder from the hopper into the gold layer. The present invention involves reciprocating a plurality of H and A for supplying a plurality of types of powder with different characteristics.
I! is made by sintering a powder compact filled intermittently with powder of the same type. Method for producing composite sintered crystals using IP mold (
``Many.

Specifically, the method for producing a composite sintered crystal of the present invention involves forming a powder compact of three or more layers of composite sintered crystal in which the uppermost layer and the lowermost layer are formed of the same powder. When inserting powder into Ho and A, the top layer and the bottom layer are placed in the frontmost hole Δ in Ho, etc., which is one less than the number of composite fired crystals that move back and forth with respect to gold 11. Powder from the bottom layer and the middle layer are charged into the gold layer when the honota moves forward, and powder from the top layer when the honota moves backward. is put into the gold lid.

The present invention will be explained below with reference to the drawings.

The manufacturing method of the present invention will be described as an example in which a composite sintered contact shown in FIG. 9 is manufactured.

This composite sintered contact contacts other contacts.Contact contact part 1,
Each part of the thin alloy fixing part S, which is fixed to the intermediate high pressure part 2 and the base metal 4 by brazing, is stacked in three layers and integrally molded and sintered. Each of these parts 1 to 1 is expanded to include tungsten carbide wcl or tungsten carbide y.
It is made of a mixed powder with W, and the contact contact part 1 has a higher proportion of silver than the high voltage part 2 in order to improve conductivity and contact resistance. In order to increase the brazing properties, the proportion of silver is smaller than that of the contact part IK, and the proportion of the chain in the alloy fixed SS is the same as that of the contact part 1 in order to improve brazing properties. That is, the contact contact part 1 and the alloy fixing part S are made of powder having the same composition.For example, the contact contact part 1 and the alloy fixing part 1 are made of powder having the same composition.
- and the remainder carbide y gesten ifC is formed of a mixed powder of tungsten, and the high pressure part 2 925 to 30 ml and the balance is formed of tungsten carbide or a mixed powder of tungsten.

In step 11 of manufacturing this composite sintered contact, the case in which a powder compact is molded according to the present invention will be described with reference to FIGS. 1 to 8. In order to pressure-mold a powder compact, a molding die 5 is attached to a horizontal cheagle 6 in a press machine and prepared. Place the lower mother plate 1 at the bottom of the gold plate 5. Also, gold! In order to introduce the ijK material powder, the number of layers (3 layers) of the composite sintered contact is 11 m less.
That is, two hoppers 8.9 and gold W5 on top of Cheagle 6.
They are arranged and connected, for example, on the front and back sides of the movement direction so that they can move back and forth.

These hoppers 41 and s are linearly reciprocated back and forth between one side and the other side of the mold IM5 by a reciprocating drive device such as an air cylinder (not shown), passing over the mold 5.
# and # are arranged in front of each other and move together to place the powder filled inside into the mold 5 when they are positioned on the gold Wil.

Therefore, since powder of the same composition is used in the contact contact part 1 and the alloy fixing part 3, which are the lower and upper layers of the composite sintered contact shown in the figure, each part 2 of the hopper 8 located on the front side in the hopper movement direction is Mixing of silver powder and tungsten carbide powder or tungsten powder to form ゜3 (
Hereinafter, it will be referred to as mu powder. ) is filled in the specified amount. The conch/49 located on the rear side in the direction of hopper movement contains silver powder and tungsten carbide or tungsten powder (hereinafter referred to as l powder) containing a small proportion of ingredients of the pot that forms the high pressure-resistant part 2 which is the intermediate layer of the composite sintered contact. ) is filled in a predetermined amount.

Then, as shown in Figure 1, the company's moisture is handled by hoppers
The whole thing is gold on table C! Next, as shown in FIG.
When moving forward in a straight line, first hopper 1 on the front side
1 is located on the gold mtt, and it is filled from E and 4a, and a predetermined amount of powder is put into the gold mtt. Money! ! I
The nine powder introduced into the lower punch 1 forms the contact part 1 (the contact part 1). In addition, leave the powder for the base metal fixing part J in the ho v/91. If you move the hoy no 4 J, 5+ further after adding the m powder, the hora/parable 1 will be removed as shown in Fig. 3. is table C away from gold 91
Gold on top! Moving to the other side of 115, E and A 9 on the rear side of the pK are located on the metal 5, and the hoppers 9 are filled with 9l powder into the gold mi. gold ill
The 9B powder charged into the tank is layered on top of the already charged Mu powder to form a reservoir and a high pressure resistant part 2. At this point, the hoppers 8#t do not move forward any more but instead move backward, and the drive device moves the hoppers 8°9 to 100. 1lj
When moving backwards in a straight line with respect to K, as shown in Figure 4, K
The hoppers of I1 move away from gold fil and move to the gold m5o side on table C, and the front hopper 1 moves from the other side of gold aS to gold 1 again! ! Located above 5,
E. From Parable 1, the 9A powder left inside it is made of gold 5
A small amount is placed inside. The powder is poured into the powder and accumulates in a layer on top of the powder that has already been introduced.
This forms the base metal fixing part 1.

One more hot A8. When # is moved backward, the hoppers 1 move away from gold mi and move to one side as shown in FIG. # The entire body returns to the waiting position on one side of the gold 111 on the table 6, and Mu powder, 1 powder, and Mu powder are poured into the gold 111s from the bottom corresponding to each part 1 to J of the composite sintered contact O, respectively. It is poured in three layers.

In this way, a three-layer composite sintered contact powder compact is created in which the upper and lower contact contact parts 1 and the base metal fixing part 3 are made of the same powder, and the middle high pressure part 2 is made of a different powder. When performing the work of putting powder and powder into the rounding machine to be formed, two hoppers are used as the hopper, which is one less than the number of contact layers, so 9 hoppers are required.
The overall length of the hoppers can be shortened due to the small number of hoppers, and
Ilg, 9 is gold! In order to reciprocate back and forth linearly with respect to IIK, the movement stroke required for the work of E, Blue is small, and the space required for the work is also linearly small. Moreover, in the process of moving Hoy-p4 J*9 forward, two layers of A powder and l are deposited in the gold mi.
During the process of adding powder and retracting it, one layer worth of powder is added, so 8. In the process of moving # back and forth once, two layers of powder can be added to gold@IK, and the
When the rear side of the hopper f8. One reciprocating movement with a short movement stroke allows the necessary powder to be introduced, resulting in very high working efficiency, and furthermore, the movement stroke and space of the hora Δset can be reduced.

After nine minutes after putting the powder into the gold W5, the upper/chunch 10 is lowered into the gold tIiI as shown in FIG. Pressing is applied to form a powder compact in which the contact contact portion 1, the high pressure resistant portion 2, and the platform fixing portion 3 are integrally stacked in layers from the bottom. By the way, if this powder compact is sintered as it is, the resulting sintered body will be curved so that the contact contact part 1 is on the inside due to the difference in coefficient of thermal expansion of the powder of the contact contact part 1 and the high pressure part 2. It may cause damage. In order to prevent warping of the sintered body, the powder is pressed using an upper punch 10 and a lower Δ punch 1 having spherical surfaces as shown in FIG.
A powder compact is molded which is curved in the opposite direction to the warp of the sintered compact so that the curve is on the inside, and when this powder compact is sintered, the entire body undergoes thermal expansion (thermal contraction), as shown in Figure 8. It is possible to obtain such a flat sintered body, that is, the O composite sintered contact as described above. Further, in this composite sintered contact, each part 1 to 3 is sintered integrally and firmly joined.

In addition, in this embodiment, it is also possible to charge powder into the metal 5 and press-mold the powder compact so as to form the pedestal fixing part S1, the high pressure resistant part O, and the contact contact part 1.

In addition, the present invention can be widely applied when molding a powder compact of a general composite sintered crystal having four or more layers, rather than the three-layer KpH. For example, when molding a powder compact having four layers, two KH Gold WK powder is charged using hoppers. t, ho.

Although it is preferable for the f to be moved back and forth in a straight line in order to shorten the movement stroke, it is also preferable to move it back and forth in a gentle circular arc, for example.
When moving the hopper backwards, it is also possible to charge powder into the metal plate from hoppers other than the front hopper.

As explained above, the method for producing composite sintered crystals of the present invention is as follows:
When molding a composite sintered crystal powder compact with three or more layers in which the top and bottom layers are made of the same powder, the hora/mana is moved back and forth against the metal with a short movement stroke to improve efficiency. Powder can be introduced into the metal bowl in layers, and the space required for the work can be reduced.

[Brief explanation of drawings]

Figure 1 (,), (b), Figure 2 (a), 弽), Figure 3
Figures (a), (b), Figures 4 (1), Cb), and Figures 5 (Hata), Cb) are examples of the manufacturing method of the present invention, in which powder compacts of composite sintered contacts are molded. Kalt
Fig. 6 and Fig. 7 are explanatory drawings showing the case of pressure forming a powder compact, respectively, and Fig. 8 is a perspective view showing a composite sintered contact. It is. 1.-Contact contact part, 2-.High voltage resistance part, S. Metal fixing part, 1. ri... ho, / arm, r, 10-punch. Applicant's Representative Patent Attorney Takehiko Suzue Figure 1 Figure 3 Figure 2 Figure 4 Figure 5 Figure 7 Figure 6 Figure 8

Claims (3)

[Claims] (1) A powder compact is formed by intermittently filling powders of the same type and sintering the powder compact by reciprocating a plurality of holes Δ- which respectively supply a plurality of types of powder with different characteristics. A method for producing composite sintered crystals. (2) Fill the powder forming the bottom layer and the top layer of the composite sintered crystals into the frontmost hopper, which has a number of hoppers one less than the number of layers of the composite sintered crystals arranged in parallel, and By filling the powder forming the intermediate layer of the double metal sintered product, and then arranging each of the two and moving them forward and sequentially positioning them on the metal lid for forming the powder compact, The lowest layer of powder was introduced into the metal mold from the armpit, and then the powder was introduced into the metal mold from another hopper, and then the rearmost hole/4 was positioned above the mold. Later, the hoppers are lined up and moved backwards through the metal lid, and when the frontmost hopper passes over the metal part, the powder of the top layer is thrown into the metal interior. A method for producing a sintered gold product according to claim 1. (3) The composite sintered crystal is an electrical contact, the bottom layer and the top layer are @SO ~ 60- and the balance is tungsten carbide or tungsten, and the middle layer is made of silver 25-30- and the balance is tungsten carbide or tungsten. A method for producing a composite sintered crystal according to claim 2.