JPS58116267U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS58116267U JPS58116267U JP1226282U JP1226282U JPS58116267U JP S58116267 U JPS58116267 U JP S58116267U JP 1226282 U JP1226282 U JP 1226282U JP 1226282 U JP1226282 U JP 1226282U JP S58116267 U JPS58116267 U JP S58116267U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- adhesive
- reinforcing member
- flexible circuit
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は可撓性回路基板の一部＆巳補強板を鰻けるよう
にした従来の回路基板の概念的な部分拡大側断面図、第
２図は本考案の一嚢施例による断線防止構造を設けた回
路基板の第１図と同様な部分拡大側断面図、第３図は第
２図の概念的な部分斜視図、そして第４図は本考案の他
の実施例による第２図と同様な部分拡大側断面図である
。
１・・・・・・可撓性回路基板、２，２Ａ・・・・・・
接着材、３：３Ａ・・・・・・補強部材、４・・・・・
・回路パターン、５゜６・・・・・・不整列部分。Fig. 1 is a conceptual partially enlarged side cross-sectional view of a conventional circuit board in which a part of the flexible circuit board and the reinforcing plate are exposed, and Fig. 2 shows prevention of wire breakage by the one-pack implementation of the present invention. FIG. 3 is a conceptual partial perspective view of FIG. 2, and FIG. 4 is a second embodiment of the present invention. It is a partially enlarged side sectional view similar to. 1...Flexible circuit board, 2,2A...
Adhesive material, 3:3A...Reinforcement member, 4...
・Circuit pattern, 5゜6... misaligned part.
Claims (1)
るようにした回路基板において、前記接着材と補強部材
との相互端ｉを不整列に形成するように構成した回路基
板。−A circuit board in which a reinforcing member is provided on a part of a flexible circuit board via an adhesive, and the circuit board is configured such that mutual ends i of the adhesive and the reinforcing member are formed in a misaligned manner. −
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226282U JPS58116267U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1226282U JPS58116267U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58116267U true JPS58116267U (en) | 1983-08-08 |
| JPH0238460Y2 JPH0238460Y2 (en) | 1990-10-17 |
Family
ID=30024847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1226282U Granted JPS58116267U (en) | 1982-01-30 | 1982-01-30 | circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116267U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059586A (en) * | 2005-08-24 | 2007-03-08 | Fujikura Ltd | Wiring circuit board and manufacturing method thereof |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| JP2010239109A (en) * | 2009-03-11 | 2010-10-21 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board and electronic device |
| US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115364U (en) * | 1977-02-21 | 1978-09-13 |
-
1982
- 1982-01-30 JP JP1226282U patent/JPS58116267U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115364U (en) * | 1977-02-21 | 1978-09-13 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059586A (en) * | 2005-08-24 | 2007-03-08 | Fujikura Ltd | Wiring circuit board and manufacturing method thereof |
| JP2010010277A (en) * | 2008-06-25 | 2010-01-14 | Nippon Mektron Ltd | Flexible circuit board and method of manufacturing the same |
| JP2010239109A (en) * | 2009-03-11 | 2010-10-21 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board and electronic device |
| US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0238460Y2 (en) | 1990-10-17 |
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