JPS58116251U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS58116251U
JPS58116251U JP1982013708U JP1370882U JPS58116251U JP S58116251 U JPS58116251 U JP S58116251U JP 1982013708 U JP1982013708 U JP 1982013708U JP 1370882 U JP1370882 U JP 1370882U JP S58116251 U JPS58116251 U JP S58116251U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead
diode lamp
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982013708U
Other languages
English (en)
Inventor
藤田　貞三
Original Assignee
和泉電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 和泉電気株式会社 filed Critical 和泉電気株式会社
Priority to JP1982013708U priority Critical patent/JPS58116251U/ja
Publication of JPS58116251U publication Critical patent/JPS58116251U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図乃至第３図は、この考案に係る発光ダイオードラ
ンプを説明するためのもので、第１図はリード基板の製
作過程＆ビおける正面図、第２図は要部の斜視図、第３
図はこの考案の発光ダイオ−゛トランプの一部縦断正面
図、第４図及び第一５図は、各々従来における発光ダイ
オード゛ランプの要部の斜視図である。 １７，２・・・・・・リード基板、ｌａ、　　２ｂ・・
曲基台、　　−１ｂ、　　２ｂ・・・・・・リード片、
３・・四発光ダイオード素子、４・・・・・・リード線
、５・・・・・・透光性樹脂、Ｌ・・・・・・発光ダイ
オードランプ。７

Claims (1)

    【実用新案登録請求の範囲】
  1. 三方のリード基板の基台上に発光ダイオード素子を固着
    し、他方のリード基板の基台との間をリード線を介して
    接続し、且つ前記各′リード基板をリード片の一部を残
    して透光性樹脂にて成形するようにした発光ダイオード
    ランプにおいて、前記−一方のリード基板の基台の幅を
    リード片の幅に比較して幅広とし、該幅広部を平面にお
    いて幅広となるように折曲し、該平面幅広部に発光ダイ
    オード素子を固着してなることを特徴とする発光ダイオ
    ードランプ。
JP1982013708U 1982-02-03 1982-02-03 発光ダイオ−ドランプ Pending JPS58116251U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982013708U JPS58116251U (ja) 1982-02-03 1982-02-03 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982013708U JPS58116251U (ja) 1982-02-03 1982-02-03 発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS58116251U true JPS58116251U (ja) 1983-08-08

Family

ID=30026204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982013708U Pending JPS58116251U (ja) 1982-02-03 1982-02-03 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS58116251U (ja)

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