JPS58109262U

JPS58109262U - semiconductor stack

Info

Publication number: JPS58109262U
Application number: JP658382U
Authority: JP
Inventors: 正俊竹田; 芳信糀
Original assignee: 三菱電機株式会社
Priority date: 1982-01-20
Filing date: 1982-01-20
Publication date: 1983-07-25

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来の半導体スタックの構成を示す正面図であ
る。第２図はこの考案の１実施例による一半導体スタッ
クの構成を示す正面図である。なお、図中間−ｉ号は同
一もしくは相当部分を示す。１・・・・・・圧接板、２１〜２３・・・・・・半導体
素子、３・・・・・・冷却ライン、４・・曲チューブ、
５・・曲ボルト、６・・・・・・ナツト、７．８・・・
・・・水の入口及び出口。FIG. 1 is a front view showing the configuration of a conventional semiconductor stack. FIG. 2 is a front view showing the structure of a semiconductor stack according to an embodiment of this invention. Note that the number i in the middle of the figure indicates the same or equivalent part. 1... Pressure plate, 21-23... Semiconductor element, 3... Cooling line, 4... Bent tube,
5...Koku Boruto, 6...Natsuto, 7.8...
...Water inlet and outlet.

Claims

[Scope of utility model registration request]

a cooling fan having a refrigerant flow path therein; semiconductor elements stacked alternately with the cooling fan in descending order of loss;
A pressure bonding plate that fixes these semiconductor elements and a cooling fan;
Equipped with a tube that connects the flow path of the cooling fan in series,
A semiconductor stack in which cooling is performed using the refrigerant from the semiconductor element side where the loss is large.