JPS58104806A - Electrostatic conveying device - Google Patents

Abstract

PURPOSE:To decrease damage to an objective material at its conveyance and stably convey and stop the material in a coveying device of gravitational drop type, by utilizing electrostatic force of attraction for applying lifting power in a conveying part while damping force in a braking part to the material. CONSTITUTION:If voltage is applied between a electrode plates 6, 7, electrostatic attraction is caused between the both electrodes to act lifting power on a water 3 transferred on a conveying route, in this way, frictional resistance of the wafer 3 caused by its sliding movement can be decreased, and the wafer 3 can be conveyed for a relatively long distance only by applying a fixed initial speed. If voltage is applied to a pair of electrode plates 12, electrostatic attractive force is generated between the wafer 3 and semiconductive materials 13 to increase frictional resistance of the wafer 3, and the wafer 3 can be stopped to a prescribed position by controlling the frictional resistance in accordance with sliding motion of the wafer 3.

Description

[Detailed Description of the Invention] The present invention relates to an electrostatic transfer device, and in particular, it can be used without destroying a vacuum and clean atmosphere, as seen in the manufacturing process of semiconductor devices using vacuum devices. Concerning a conveyance device that can do this.

Conventionally, conveyance equipment that handles semiconductor element substrates (hereinafter referred to as "wafers") has generally been fully equipped with belt comparers, but the scale of the equipment is relatively large, and the sliding of the motor and drive force transmission system is There is a problem in that dust is generated in moving parts.

Further, as another method, there is a so-called gravity fall method in which the object to be transferred tm is lowered by tilting the conveyance path. Although this system has a simple structure, there are problems in that the object to be transferred may stop during the downhill slide, or the object to be transferred may be lost to the stopper and damaged at the end of the downhill slide. On the other hand, attempts have been made to solve the above problem by applying vibrations to the inclined conveyance path, but this creates another problem in that the mechanism becomes complicated in order to apply vibrations.

The present invention has been made in view of the above circumstances, and its purpose is to eliminate the above-mentioned problems of conventional conveying devices, to be usable even under vacuum, and to be able to protect objects during conveyance. The main purpose of the present invention is to provide a transport device with a small number of images.

The gist of the present invention is that, in a gravity-drop type conveyance device, the sliding of an object is controlled using electrostatic attraction force. Specifically, the electrostatic attraction force is applied to the conveyance section. This electrostatic transport device is used to apply buoyancy to the object, and is used in the braking section to increase the braking force to the object.

In addition, in the present invention, semiconducting 1s1! The term "body" refers to a semiconductor having a high resistance of about 10' to 108 ohms, such as cellulose carbon, magnesium titanate, etc.

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram for explaining the present invention in detail, and in the figure, 1 is a conveyance section, and 2 is a brake section.

The transport section 1 has a first electrode plate 6 and a certain distance lI above it.
1 and a hollow second electrode plate 7. h! A pair of electrically conductive electromagnetic materials having an oblique feed path and an electrode plate 12 on the back side of the second brake part are hereinafter referred to as "semiconductor materials". ) 13 km m'diic: Nkt board 6
Same as □They are arranged so as to form one plane.

In this conveying device, when a voltage is applied to the cutting electrode plates 6 and 7 of the carpet feeding section l, an electrostatic attraction force is generated between both electrode plates, and this acts as a buoyant force on the object to be transferred 3 on the electrode plate 6. do. Moreover, the electrode 1 of the pair of semiconductor bodies 13.13 of the braking unit 2
2. When a voltage is applied between 12, the semiconductors 13 and 1
3 and the object to be transferred δ on the semiconductor body, there is a so-called
An electrostatic attraction force is generated due to the Tohn@+5n-Rah'bek effect, and this acts on the transferred object 3 as a braking force.

Note that the voltage applied here can be applied not only in both directions but also in alternating current.

Further, a speed detection head 11 for the object to be transferred 5 is provided at the downstream part of the inclined conveyance path, and the voltage applied to the electrode 12 of the braking section 2 is controlled by this signal, so that the object to be transferred 3 is controlled at a predetermined level. It is possible to smoothly convey it to the desired position. Note that 16 is a speed detection circuit, 17 is an applied voltage calculation circuit, 18 is an applied voltage generation circuit, and 19 is a power supply section.

FIG. 2 is a partially cutaway perspective view of a wafer conveyance device according to a specific embodiment of the present invention, FIG. 3 is a sectional view taken along line 1-1 in FIG. 2, and FIG. =j sectional view.

As is clear from FIG.
-1 It is composed of a transport section 1 that slides and transports on a transport path, and a braking section 2 that stops the wafer 3 that has passed through the transport section 1. In the transport section l, an electrode plate 6 is laid on the surface of the transport path provided on the upper surface of the transport stage with an insulator 5 in between. A semiconductor 8 with an electrode plate 7 bonded thereto is laid on the back side FIIJ- of Yr&4. The semiconductor 8 is fixed to a support member 10 via an insulator 9, and the support member 10 is connected to the electrode plate 6 and the semiconductor 8.
It is joined to the transport stage number so that a predetermined interval Wllk is formed between the transport stage number and the transport stage number. Further, near the exit of the moving conveyance path, a speed detection radar 11 using an optical sensor or the like for detecting the sliding speed of the wafer 3 is provided.

On the other hand, the braking section 2 is directly connected to the conveying section l&-, and the one-to-one semiconductor body 13.
13 is placed on the brake stage 14 via an insulator 14 so as to be flush with the surface of the front conveyance path.

Next, the operation of the apparatus of this embodiment constructed as described above will be explained with reference to FIGS. 3 and 4.

In FIG. 3, when a voltage is applied between electrode plates 6 and 7,
An electrostatic attraction force is generated between the two electrodes, and a buoyant force fl acts on the wafer 3 being transferred on the transport path. This reduces the frictional resistance that accompanies the sliding of the wafer 3, so that it is possible to transport the wafer 3 over a relatively long distance by simply giving it an initial velocity of one centimeter. Furthermore, it becomes possible to reduce the inclination angle of the conveyance path. Furthermore, since the semiconductor 8 is laid on the top of the transport path, even if the wafer 3 comes into contact with the top of the transport path, no excessive current will flow through the wafer/X3, thereby preventing damage to the wafer 3. be able to.

4, when a voltage is applied to the pair of electrode plates 12, the electrostatic attractive force fp is generated between the wafer 3 and the semiconductor 13, and the frictional resistance of the wafer 3 increases.For this reason, Based on the speed information of the wafer 3 at the end of conveyance detected by the speed detection head mentioned above, the voltage between the electrodes is adjusted to -M, and the frictional resistance accompanying the sliding of the wafer 3 is controlled, so that the wafer 3 can be moved to the desired position. It goes without saying that this braking function can be used even when the transport path is not inclined.

Note that when alternating current is used as the voltage to be applied to the conductor 13.13 in the brake part 2, the semiconductor is divided into a large number of different polarities and the voltage is applied to the subdivided groups. It is desirable to shift the phase of the alternating current.

As described above, the present invention uses an electrostatic attraction force to control the sliding of objects in a gravity-drop type transport device, so that it can be used even under vacuum, and This has the remarkable effect that it is possible to realize a conveying device that causes little damage to objects and is capable of fast conveying and stopping.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an outline of the conveying device of the present invention, FIG. 2 is a diagram showing a specific embodiment, FIG. 3 is a 1-1 sectional view of FIG. 2,
FIG. 4 is a cross-sectional view of FIG. 2. 1: Conveying section, 2: Braking section, 3: Target object, 6, 7: 11 Plate, 8: Semiconductor, 11: Speed detection head, 12: Electrode plate, 13: Semiconductor, 16: Speed detection Circuit, 17: Applied voltage calculation circuit, 18: Applied voltage generation circuit, 19: Power supply section. Fig. 2 1 Fig. 3■ No. 4 [zo\

Claims (3)

[Claims] (1) In a conveyance device that conveys a conductive object by sliding it on a conveyance path, an electrode provided on the surface of the conveyance path along the sliding direction of the object and above the IM pole. 1. An electrostatic transfer device comprising a semiconductive dielectric material having an electrode on its back surface provided at a certain distance from the electrode, and configured to be able to apply a voltage between the two electrodes. (2) In a conveyance device that conveys a conductive object by sliding it on a conveyance path, at the outlet of the conveyance path,
A plurality of semiconducting dielectrics having electrodes on their back surfaces are arranged so as to be flush with the surface of the transport path, and the plurality of semiconducting dielectrics are divided into two groups, and the semiconducting dielectrics belonging to one of the groups are 1. An electrostatic conveyance device, comprising: a braking section configured to be able to apply a voltage between a semiconductive dielectric and the semiconductive dielectric belonging to the usage group. (3) In a conveyance device that conveys a conductive transfer group rug by sliding it on a conveyance path, an electrode is provided on the surface of the conveyance path along the sliding direction of the object to be transferred, and an electrode is provided above the electrode. A conveyor section made of a semi-conductive dielectric material, which is placed at a certain distance from the electrodes and faces the electrodes on its back surface, and a voltage can be applied between the two electrodes; A plurality of semiconductive dielectric bodies having electrodes Yt are all arranged so as to be flush with the surface of the conveyance path, and the plurality of semiconductive dielectric bodies are divided into two groups, and the semiconductive dielectric bodies belonging to one of the groups are arranged. 1. An electrostatic conveyance device comprising a control moving part 0 capable of applying a voltage between a conductive dielectric material and the semiconductive L%F material belonging to the other group.