JPS58101882U - Uniform electrodeposition plating installed - Google Patents

Uniform electrodeposition plating installed

Info

Publication number
JPS58101882U
JPS58101882U JP19631981U JP19631981U JPS58101882U JP S58101882 U JPS58101882 U JP S58101882U JP 19631981 U JP19631981 U JP 19631981U JP 19631981 U JP19631981 U JP 19631981U JP S58101882 U JPS58101882 U JP S58101882U
Authority
JP
Japan
Prior art keywords
workpiece
uniform electrodeposition
electrodeposition plating
auxiliary electrode
plating installed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19631981U
Other languages
Japanese (ja)
Inventor
長島　寛司
和昭 佐藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19631981U priority Critical patent/JPS58101882U/en
Publication of JPS58101882U publication Critical patent/JPS58101882U/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図と第２図は従来の均一メッキ装置を示す図、第３
図は本考案による均一メッキ装置の実施例を示す図であ
る。　　　　− 図面において、１は加工物、５は補助極（捨て板）−６
はメッキ浴、Ｒ１，８２は可変抵抗器を夫々示す。゛Figures 1 and 2 show conventional uniform plating equipment, and Figure 3 shows a conventional uniform plating device.
The figure shows an embodiment of a uniform plating apparatus according to the present invention. - In the drawing, 1 is the workpiece, 5 is the auxiliary electrode (saved plate) - 6
indicates a plating bath, and R1 and 82 indicate variable resistors, respectively.゛

Claims (1)

【実用新案登録請求の範囲】 加工物のほかに補助極を陰極側に接続する電着メッキ装
置において、該加工物および補助極大々とメッキ回路の
電源との間に可変抵抗器を挿入後。 続して、陽極と加工物および補助極の間に流れる電流の
値を互いに独立して調節できるように構成した均一電着
メッキ装置。[Scope of Claim for Utility Model Registration] In an electroplating device that connects an auxiliary electrode to the cathode side in addition to the workpiece, after inserting a variable resistor between the workpiece and the auxiliary pole and the power source of the plating circuit. Next, a uniform electrodeposition plating apparatus is constructed so that the values of the currents flowing between the anode, the workpiece, and the auxiliary electrode can be adjusted independently of each other.
JP19631981U 1981-12-28 1981-12-28 Uniform electrodeposition plating installed Pending JPS58101882U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19631981U JPS58101882U (en) 1981-12-28 1981-12-28 Uniform electrodeposition plating installed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19631981U JPS58101882U (en) 1981-12-28 1981-12-28 Uniform electrodeposition plating installed

Publications (1)

Publication Number Publication Date
JPS58101882U true JPS58101882U (en) 1983-07-11

Family

ID=30109564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19631981U Pending JPS58101882U (en) 1981-12-28 1981-12-28 Uniform electrodeposition plating installed

Country Status (1)

Country Link
JP (1) JPS58101882U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543174A (en) * 1978-09-25 1980-03-26 Otsuka Chem Co Ltd Preparation of phosphazene polymer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543174A (en) * 1978-09-25 1980-03-26 Otsuka Chem Co Ltd Preparation of phosphazene polymer

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