JPS579939B2 - - Google Patents
Info
- Publication number
- JPS579939B2 JPS579939B2 JP11085575A JP11085575A JPS579939B2 JP S579939 B2 JPS579939 B2 JP S579939B2 JP 11085575 A JP11085575 A JP 11085575A JP 11085575 A JP11085575 A JP 11085575A JP S579939 B2 JPS579939 B2 JP S579939B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11085575A JPS5235281A (en) | 1975-09-16 | 1975-09-16 | Peparation of flexible base for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11085575A JPS5235281A (en) | 1975-09-16 | 1975-09-16 | Peparation of flexible base for printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5235281A JPS5235281A (en) | 1977-03-17 |
| JPS579939B2 true JPS579939B2 (fi) | 1982-02-24 |
Family
ID=14546362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11085575A Granted JPS5235281A (en) | 1975-09-16 | 1975-09-16 | Peparation of flexible base for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5235281A (fi) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3175416D1 (en) * | 1980-09-15 | 1986-11-06 | Ciba Geigy Ag | Use of flexible materials in printed circuits |
| WO1988000428A1 (en) * | 1986-06-30 | 1988-01-14 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit board |
| US5278276A (en) * | 1985-08-27 | 1994-01-11 | Mitsui Toatsu Chemicals, Incorporated | Polyimide and high-temperature adhesive of polyimide |
| DE3650656T2 (de) * | 1985-08-27 | 1998-04-30 | Mitsui Toatsu Chemicals | Polyimide und diese enthaltende hitzebeständige klebemittel |
| WO2001047327A2 (en) * | 1999-12-23 | 2001-06-28 | Oak-Mitsui, Inc. | Method for applying polymer film to a metal foil |
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1975
- 1975-09-16 JP JP11085575A patent/JPS5235281A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5235281A (en) | 1977-03-17 |