JPS5797945U - - Google Patents
Info
- Publication number
- JPS5797945U JPS5797945U JP1980175056U JP17505680U JPS5797945U JP S5797945 U JPS5797945 U JP S5797945U JP 1980175056 U JP1980175056 U JP 1980175056U JP 17505680 U JP17505680 U JP 17505680U JP S5797945 U JPS5797945 U JP S5797945U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980175056U JPS5797945U (de) | 1980-12-05 | 1980-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980175056U JPS5797945U (de) | 1980-12-05 | 1980-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5797945U true JPS5797945U (de) | 1982-06-16 |
Family
ID=29967276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980175056U Pending JPS5797945U (de) | 1980-12-05 | 1980-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5797945U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011233704A (ja) * | 2010-04-27 | 2011-11-17 | Mitsubishi Electric Corp | 圧接型半導体装置 |
-
1980
- 1980-12-05 JP JP1980175056U patent/JPS5797945U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011233704A (ja) * | 2010-04-27 | 2011-11-17 | Mitsubishi Electric Corp | 圧接型半導体装置 |