JPS579516B2 - - Google Patents
Info
- Publication number
- JPS579516B2 JPS579516B2 JP6521376A JP6521376A JPS579516B2 JP S579516 B2 JPS579516 B2 JP S579516B2 JP 6521376 A JP6521376 A JP 6521376A JP 6521376 A JP6521376 A JP 6521376A JP S579516 B2 JPS579516 B2 JP S579516B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6521376A JPS52155096A (en) | 1976-06-04 | 1976-06-04 | Semiconductor light emitting display device |
| DE19772725265 DE2725265A1 (de) | 1976-06-04 | 1977-06-03 | Halbleiter-leuchtanzeigevorrichtung |
| US05/803,984 US4145707A (en) | 1976-06-04 | 1977-06-06 | Semiconductor luminescent display apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6521376A JPS52155096A (en) | 1976-06-04 | 1976-06-04 | Semiconductor light emitting display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52155096A JPS52155096A (en) | 1977-12-23 |
| JPS579516B2 true JPS579516B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-02-22 |
Family
ID=13280399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6521376A Granted JPS52155096A (en) | 1976-06-04 | 1976-06-04 | Semiconductor light emitting display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52155096A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
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1976
- 1976-06-04 JP JP6521376A patent/JPS52155096A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52155096A (en) | 1977-12-23 |